Fast and Accurate Power Estimation of FPGA DSP Components Based on High-level Switching Activity Models

When designing DSP circuits, it is important to predict their power consumption early in the design flow in order to reduce the repetition of time consuming design phases. High-level modelling is required for fast power estimation when a design is modified at the algorithm level. This paper presents a novel high-level analytical approach to estimate logic power consumption of arithmetic components implemented in FPGAs. In particular, models of adders and multipliers are presented in detail. The proposed methodology considers input signal correlation and glitching produced inside the component. It is based on an analytical computation of the switching activity in the component which takes into account the component architecture. The complete model can estimate the power consumption for any given clock frequency, signal statistics and operands’ word-lengths. Compared to other proposed power estimation methods, the number of circuit simulations needed for characterizing the power model of the component is highly reduced. The accuracy of the model is within 10% of low-level power estimates given by the tool XPower, and it achieves better overall performance

Optimal Power Delivery Strategy in Modern VLSI Design

Department of Electrical EngineeringIn a modern very-large-scale integration (VLSI) designs, heterogeneous architectural structures and various three-dimensional (3D) integration methods have been used in a hybrid manner. Recently, the industry has combined 3D VLSI technology with the heterogeneous technology of modern VLSI called chiplet. The 3D heterogeneous architectural structure is growing attention because it reduces costs and time-to-market by increasing manufacturing yield with high integration rate and modularization. However, a main design concern of heterogeneous 3D architectural structure is power management for lowering power consumption with maintaining the required power integrity from IR drop. Although the low-power design can be realized in front-end-of-line level by reduced power supply complementary metal???oxide???semiconductor technologies, the overall low-power system performance is available with a proper design of power delivery network (PDN) for chip-level modules and system-level architectural structure. Thus, there is a demand for both the coanalysis and optimization for both chip-level and system-level. We analyzed and optimized power delivery on-chip in various 3D integration environments, and we also have proposed a chip-package-PCB coanalysis methodology at the system level. For through-silicon-via (TSV)-based 3D integration circuit (IC), We have investigated and analyzed the voltage noise in a multi-layer 3D stacking with partial element equivalent circuit (PEEC)-based on-chip PDN and frequency-dependent TSV models. We also have proposed a wire-added multi-paired on-chip PDN structure to reduce voltage noise to reduce IR drop. The performance of TSV-based 3D ICs has also been improved by reducing wake-up time through our proposed adaptive power gating strategy with tapered TSVs. For die-to-wafer 3D IC, we have proposed a power delivery pathfinding methodology, which seeks to identify a nearly optimal PDN for a given design and PDN specification. Our pathfinding methodology exploits models for routability and worst IR drop, which helps reducing iterations between PDN design and circuit design in 3D IC implementation. We also have extended the observation to system-level, we have proposed a power integrity coanalysis methodology for multiple power domains in high-frequency memory systems. Our coanalysis methodology can analyze the tendencies in power integrity by using parametric methods with consideration of package-on-package integration. We have proved that our methodology can predict similar peak-to-peak ripple voltages that are comparable with the realistic simulations of high-speed low-power memory interfaces. Finally, we have proposed analysis and optimization methodologies that are generally applicable to various integration methods used in modern VLSI designs as computer-aided-design-based solutions.clos

Design of low-voltage power efficient frequency dividers in folded MOS current mode logic

In this paper we propose a methodology to design high-speed, power-efficient static frequency dividers based on the low-voltage Folded MOS Current Mode Logic (FMCML) approach. A modeling strategy to analyze the dependence of propagation delay and power consumption on the bias currents of the divide-by-2 (DIV2) cell is introduced. We demonstrate that the behavior of the FMCML DIV2 cell is different both from the one of the conventional MCML DFF (D-type Flip-Flop) and from FMCML DFF without a level shifter. Then an analytical strategy to optimize the divider in different design scenarios: maximum speed, minimum power-delay product (PDP) or minimum energy-delay product (EDP) is presented. The possibility to scale the bias currents through the divider stages without affecting the speed performance is also investigated. The proposed analytical approach allows to gain a deep insight into the circuit behavior and to comprehensively optimize the different design tradeoffs. The derived models and design guidelines are validated against transistor level simulations referring to a commercial 28nm FDSOI CMOS process. Different divide-by-8 circuits following different optimization strategies have been designed in the same 28nm CMOS technology showing the effectiveness of the proposed methodology

System-on-chip Computing and Interconnection Architectures for Telecommunications and Signal Processing

This dissertation proposes novel architectures and design techniques targeting SoC building blocks for telecommunications and signal processing applications. Hardware implementation of Low-Density Parity-Check decoders is approached at both the algorithmic and the architecture level. Low-Density Parity-Check codes are a promising coding scheme for future communication standards due to their outstanding error correction performance. This work proposes a methodology for analyzing effects of finite precision arithmetic on error correction performance and hardware complexity. The methodology is throughout employed for co-designing the decoder. First, a low-complexity check node based on the P-output decoding principle is designed and characterized on a CMOS standard-cells library. Results demonstrate implementation loss below 0.2 dB down to BER of 10^{-8} and a saving in complexity up to 59% with respect to other works in recent literature. High-throughput and low-latency issues are addressed with modified single-phase decoding schedules. A new "memory-aware" schedule is proposed requiring down to 20% of memory with respect to the traditional two-phase flooding decoding. Additionally, throughput is doubled and logic complexity reduced of 12%. These advantages are traded-off with error correction performance, thus making the solution attractive only for long codes, as those adopted in the DVB-S2 standard. The "layered decoding" principle is extended to those codes not specifically conceived for this technique. Proposed architectures exhibit complexity savings in the order of 40% for both area and power consumption figures, while implementation loss is smaller than 0.05 dB. Most modern communication standards employ Orthogonal Frequency Division Multiplexing as part of their physical layer. The core of OFDM is the Fast Fourier Transform and its inverse in charge of symbols (de)modulation. Requirements on throughput and energy efficiency call for FFT hardware implementation, while ubiquity of FFT suggests the design of parametric, re-configurable and re-usable IP hardware macrocells. In this context, this thesis describes an FFT/IFFT core compiler particularly suited for implementation of OFDM communication systems. The tool employs an accuracy-driven configuration engine which automatically profiles the internal arithmetic and generates a core with minimum operands bit-width and thus minimum circuit complexity. The engine performs a closed-loop optimization over three different internal arithmetic models (fixed-point, block floating-point and convergent block floating-point) using the numerical accuracy budget given by the user as a reference point. The flexibility and re-usability of the proposed macrocell are illustrated through several case studies which encompass all current state-of-the-art OFDM communications standards (WLAN, WMAN, xDSL, DVB-T/H, DAB and UWB). Implementations results are presented for two deep sub-micron standard-cells libraries (65 and 90 nm) and commercially available FPGA devices. Compared with other FFT core compilers, the proposed environment produces macrocells with lower circuit complexity and same system level performance (throughput, transform size and numerical accuracy). The final part of this dissertation focuses on the Network-on-Chip design paradigm whose goal is building scalable communication infrastructures connecting hundreds of core. A low-complexity link architecture for mesochronous on-chip communication is discussed. The link enables skew constraint looseness in the clock tree synthesis, frequency speed-up, power consumption reduction and faster back-end turnarounds. The proposed architecture reaches a maximum clock frequency of 1 GHz on 65 nm low-leakage CMOS standard-cells library. In a complex test case with a full-blown NoC infrastructure, the link overhead is only 3% of chip area and 0.5% of leakage power consumption. Finally, a new methodology, named metacoding, is proposed. Metacoding generates correct-by-construction technology independent RTL codebases for NoC building blocks. The RTL coding phase is abstracted and modeled with an Object Oriented framework, integrated within a commercial tool for IP packaging (Synopsys CoreTools suite). Compared with traditional coding styles based on pre-processor directives, metacoding produces 65% smaller codebases and reduces the configurations to verify up to three orders of magnitude

DESIGN AND VALIDATION OF ELECTRONIC SYSTEMS FOR SENSOR CONDITIONING

In the last few years the great advances in process technology has lead to a dramatic increase of the density of electronic functions, furthermore latest refinements in photolithography techniques has featured an increasing shrinking of dimension of sensing elements up to the development of the Micro Electro Mechanical Systems (MEMS) in which mechanical elements, sensors, actuators, and electronics are integrated on a common silicon substrate. This rapid development of integrated systems has had a strong impact on a wide range of applications whose field of interest is focussed on sensing, conditioning and actuating activity. If in the last decades the diffusion of measurement systems was limited by high costs, large size and low reliability, the new generations of MEMS sensors guarantee remarkable savings in cost, area and power consumption featuring a deep spreading of the possible application for such systems in various market fields. This thesis deals with the development of sensor systems mainly targeting the new generation of MEMS sensors, which achieves a great reduction of area and power consumption but on the other hand requires more complexity in the conditioning interface. This work also faces the emerging issues deriving by the increasing complexity of electronic interface tight with the constant reduction of time to market which forces companies to review the design flow to maintain a high level of product quality. This research is then providing new tools and methodologies to enhance the design phase from architectural space exploration to verification of the whole system, and joining pre-silicon simulations to post-silicon verification aiding testing of electronic systems which is close to become one of the major cost factor for ICs companies. The compound scenario concerning the development of sensor systems is presented in Chapter 1, together with an overview of sensor systems market with a particular focus on the latest MEMS technology devices, and related applications in various segments. Chapter 2 introduces the state of the art for sensor interfaces: the generic sensor interface concept (based on sharing the same electronics among similar applications achieving cost saving at the expense of area and performance loss); and the Platform Based Design methodology which overcomes the drawbacks of generic sensor interfaces by keeping the generality at the highest design layers and customizing the platform for a target sensor achieving optimized performances. An evolution of Platform Based Design achieved by implementation into silicon of the ISIF (Intelligent Sensor InterFace) platform is therefore presented. ISIF is a highly configurable mixed-signal chip which allows designers to perform an effective design space exploration and to evaluate directly on silicon the system performances avoiding the critical and time consuming analysis required by standard platform based approach. Chapter 3 describes a verification and validation methodology for complex mixed signal ICs. A VHDL-AMS system verification methodology allows designers to derive VHDL-AMS models from full-custom schematics through a semi-automatic approach (featuring modeling time reduction and coherency between models and schematics), obtaining a behavioral model of the whole analog section for top level system verifications. The verification environment has been also enhanced by an integrated flow to bridge pre-silicon simulation to post-silicon verification relieving time consuming procedures for testing the prototype and featuring automatic data exchange between design and test environments. In Chapter 4 an application of the ISIF platform for design and validation of a sensor system for measuring water flow based on a hot wire anemometer in MEMS technology is described. The ISIF approach and the tools developed in the proposed verification flow have featured a fast and accurate evaluation of the whole sensor system overcoming time consuming system simulations needed in traditional approaches for architectural exploration and bringing to light phenomena related to the sensor and the surrounding media of the tailored application hardly foreseeable at system level. In the last chapter we describe the design of a smart sensor interface for conditioning all resistive class of sensor to face the market demand for low cost, optimized, high performance sensor systems. The proposed interface combines high quality signal conditioning with low size and advanced low power techniques, embodying an optimal candidate for mass production. The architectural space evaluation and the application prototyping with ISIF has enabled an effective, rapid and low risk development of the interface achieving an optimized sensor system for water flow monitoring achieving the high performances obtained with ISIF with noteworthy savings on area, cost and powe

Modular machinery arrangement and its impact in early-stage naval electric ship design

Thesis (S.M. in Naval Architecture and Marine Engineering)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering; and, (S.M.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 2012.Cataloged from PDF version of thesis.Includes bibliographical references (p. 75-77).Electrical power demands for naval surface combatants are projected to rise with the development of increasingly complex and power intensive combat systems. This trend also coincides with the need of achieving maximum fuel efficiency at both high and low hull speeds. A proposed solution to meet current and future energy needs of conventionally powered naval surface combatants is through the use of an Integrated Power System (IPS), which is seen as the next evolution in naval ship design. Unfortunately, historically-based ship design process models and parametrics cannot accommodate new-concept designs that are not incremental changes to previous practice. Additionally, integrating IPS with the next generation of ship designs is also synonymous with the desire of conducting system-level tradeoffs early within the ship design process. In an effort to enhance the relationship between new-concept designs and historically-based ship design processes, this thesis focuses on a novel approach of incorporating IPS at the earliest stage of the design process as part of assessing system-level tradeoffs early. This thesis describes a methodology for the system design and arrangement of an IPS machinery plant based on an objective of meeting a desired power generation level, effectively introducing a power constraint at the start of the design process. In conjunction with the methodology development, a hierarchical process and design tool for integration with Graphics Research Corporation's (GRC) naval architecture software suite, Paramarine, is also produced to assist in rapid development and evaluation of various IPS arrangements. The result of this process, through several case studies, provides insight into equipment selection philosophy, the initial sizing of the ship's machinery box, and the initial definition of electrical zones. Lastly, the developed tool is also used to aid in the creation of "design banks," allowing the naval architect to manage weight, power, and volume at the beginning of the ship design process; therefore, supporting early system-level tradeoffs for new-concept designs.by David J. Jurkiewicz.S.M.S.M.in Naval Architecture and Marine Engineerin

High-Speed Performance, Power and Thermal Co-simulation For SoC Design

This dissertation presents a multi-faceted effort at developing standard System Design Language based tools that allow designers to the model power and thermal behavior of SoCs, including heterogeneous SoCs that include non-digital components. The research contributions made in this dissertation include: • SystemC-based power/performance co-simulation for the Intel XScale microprocessor. We performed detailed characterization of the power dissipation patterns of a variety of system components and used these results to build detailed power models, including a highly accurate, validated instruction-level power model of the XScale processor. We also proposed a scalable, efficient and validated methodology for incorporating fast, accurate power modeling capabilities into system description languages such as SystemC. This was validated against physical measurements of hardware power dissipation. • Modeling the behavior of non-digital SoC components within standard System Design Languages. We presented an approach for modeling the functionality, performance, power, and thermal behavior of a complex class of non-digital components — MEMS microhotplate-based gas sensors — within a SystemC design framework. The components modeled include both digital components (such as microprocessors, busses and memory) and MEMS devices comprising a gas sensor SoC. The first SystemC models of a MEMS-based SoC and the first SystemC models of MEMS thermal behavior were described. Techniques for significantly improving simulation speed were proposed, and their impact quantified. • Vertically Integrated Execution-Driven Power, Performance and Thermal Co-Simulation For SoCs. We adapted the above techniques and used numerical methods to model the system of differential equations that governs on-chip thermal diffusion. This allows a single high-speed simulation to span performance, power and thermal modeling of a design. It also allows feedback behaviors, such as the impact of temperature on power dissipation or performance, to be modeled seamlessly. We validated the thermal equation-solving engine on test layouts against detailed low-level tools, and illustrated the power of such a strategy by demonstrating a series of studies that designers can perform using such tools. We also assessed how simulation and accuracy are impacted by spatial and temporal resolution used for thermal modeling

A hierarchical optimization engine for nanoelectronic systems using emerging device and interconnect technologies

A fast and efficient hierarchical optimization engine was developed to benchmark and optimize various emerging device and interconnect technologies and system-level innovations at the early design stage. As the semiconductor industry approaches sub-20nm technology nodes, both devices and interconnects are facing severe physical challenges. Many novel device and interconnect concepts and system integration techniques are proposed in the past decade to reinforce or even replace the conventional Si CMOS technology and Cu interconnects. To efficiently benchmark and optimize these emerging technologies, a validated system-level design methodology is developed based on the compact models from all hierarchies, starting from the bottom material-level, to the device- and interconnect-level, and to the top system-level models. Multiple design parameters across all hierarchies are co-optimized simultaneously to maximize the overall chip throughput instead of just the intrinsic delay or energy dissipation of the device or interconnect itself. This optimization is performed under various constraints such as the power dissipation, maximum temperature, die size area, power delivery noise, and yield. For the device benchmarking, novel graphen PN junction devices and InAs nanowire FETs are investigated for both high-performance and low-power applications. For the interconnect benchmarking, a novel local interconnect structure and hybrid Al-Cu interconnect architecture are proposed, and emerging multi-layer graphene interconnects are also investigated, and compared with the conventional Cu interconnects. For the system-level analyses, the benefits of the systems implemented with 3D integration and heterogeneous integration are analyzed. In addition, the impact of the power delivery noise and process variation for both devices and interconnects are quantified on the overall chip throughput.Ph.D

Average-case analysis of power consumption in embedded systems

Power efficiency is one of the most important constraints in the design of embedded systems since such systems are generally driven by batteries with limited energy budget or restricted power supply. In every embedded system, there are one or more processor cores to run the software and interact with the other hardware components of the system. The power consumption of the processor core(s) has an important impact on the total power dissipated in the system. Hence, the processor power optimization is crucial in satisfying the power consumption constraints, and developing low-power embedded systems. A key aspect of research in processor power optimization and management is “power estimation”. Having a fast and accurate method for processor power estimation at design time helps the designer to explore a large space of design possibilities, to make the optimal choices for developing a power efficient processor. Likewise, understanding the processor power dissipation behaviour of a specific software/application is the key for choosing appropriate algorithms in order to write power efficient software. Simulation-based methods for measuring the processor power achieve very high accuracy, but are available only late in the design process, and are often quite slow. Therefore, the need has arisen for faster, higher-level power prediction methods that allow the system designer to explore many alternatives for developing powerefficient hardware and software. The aim of this thesis is to present fast and high-level power models for the prediction of processor power consumption. Power predictability in this work is achieved in two ways: first, using a design method to develop power predictable circuits; second, analysing the power of the functions in the code which repeat during execution, then building the power model based on average number of repetitions. In the first case, a design method called Asynchronous Charge Sharing Logic (ACSL) is used to implement the Arithmetic Logic Unit (ALU) for the 8051 microcontroller. The ACSL circuits are power predictable due to the independency of their power consumption to the input data. Based on this property, a fast prediction method is presented to estimate the power of ALU by analysing the software program, and extracting the number of ALU-related instructions. This method achieves less than 1% error in power estimation and more than 100 times speedup in comparison to conventional simulation-based methods. In the second case, an average-case processor energy model is developed for the Insertion sort algorithm based on the number of comparisons that take place in the execution of the algorithm. The average number of comparisons is calculated using a high level methodology called MOdular Quantitative Analysis (MOQA). The parameters of the energy model are measured for the LEON3 processor core, but the model is general and can be used for any processor. The model has been validated through the power measurement experiments, and offers high accuracy and orders of magnitude speedup over the simulation-based method

Energy-aware synthesis for networks on chip architectures

The Network on Chip (NoC) paradigm was introduced as a scalable communication infrastructure for future System-on-Chip applications. Designing application specific customized communication architectures is critical for obtaining low power, high performance solutions. Two significant design automation problems are the creation of an optimized configuration, given application requirement the implementation of this on-chip network. Automating the design of on-chip networks requires models for estimating area and energy, algorithms to effectively explore the design space and network component libraries and tools to generate the hardware description. Chip architects are faced with managing a wide range of customization options for individual components, routers and topology. As energy is of paramount importance, the effectiveness of any custom NoC generation approach lies in the availability of good energy models to effectively explore the design space. This thesis describes a complete NoC synthesis flow, called NoCGEN, for creating energy-efficient custom NoC architectures. Three major automation problems are addressed: custom topology generation, energy modeling and generation. An iterative algorithm is proposed to generate application specific point-to-point and packet-switched networks. The algorithm explores the design space for efficient topologies using characterized models and a system-level floorplanner for evaluating placement and wire-energy. Prior to our contribution, building an energy model required careful analysis of transistor or gate implementations. To alleviate the burden, an automated linear regression-based methodology is proposed to rapidly extract energy models for many router designs. The resulting models are cycle accurate with low-complexity and found to be within 10% of gate-level energy simulations, and execute several orders of magnitude faster than gate-level simulations. A hardware description of the custom topology is generated using a parameterizable library and custom HDL generator. Fully reusable and scalable network components (switches, crossbars, arbiters, routing algorithms) are described using a template approach and are used to compose arbitrary topologies. A methodology for building and composing routers and topologies using a template engine is described. The entire flow is implemented as several demonstrable extensible tools with powerful visualization functionality. Several experiments are performed to demonstrate the design space exploration capabilities and compare it against a competing min-cut topology generation algorithm