Pathways to servers of the future

The Special Session on “Pathways to Servers of the Future” outlines a new research program set up at Technische Universität Dresden addressing the increasing energy demand of global internet usage and the resulting ecological impact of it. The program pursues a novel holistic approach that considers hardware as well as software adaptivity to significantly increase energy efficiency, while suitably addressing application demands. The session presents the research challenges and industry perspective

dReDBox: Materializing a full-stack rack-scale system prototype of a next-generation disaggregated datacenter

Current datacenters are based on server machines, whose mainboard and hardware components form the baseline, monolithic building block that the rest of the system software, middleware and application stack are built upon. This leads to the following limitations: (a) resource proportionality of a multi-tray system is bounded by the basic building block (mainboard), (b) resource allocation to processes or virtual machines (VMs) is bounded by the available resources within the boundary of the mainboard, leading to spare resource fragmentation and inefficiencies, and (c) upgrades must be applied to each and every server even when only a specific component needs to be upgraded. The dRedBox project (Disaggregated Recursive Datacentre-in-a-Box) addresses the above limitations, and proposes the next generation, low-power, across form-factor datacenters, departing from the paradigm of the mainboard-as-a-unit and enabling the creation of function-block-as-a-unit. Hardware-level disaggregation and software-defined wiring of resources is supported by a full-fledged Type-1 hypervisor that can execute commodity virtual machines, which communicate over a low-latency and high-throughput software-defined optical network. To evaluate its novel approach, dRedBox will demonstrate application execution in the domains of network functions virtualization, infrastructure analytics, and real-time video surveillance.This work has been supported in part by EU H2020 ICTproject dRedBox, contract #687632.Peer ReviewedPostprint (author's final draft

Architecture and Advanced Electronics Pathways Toward Highly Adaptive Energy- Efficient Computing

With the explosion of the number of compute nodes, the bottleneck of future computing systems lies in the network architecture connecting the nodes. Addressing the bottleneck requires replacing current backplane-based network topologies. We propose to revolutionize computing electronics by realizing embedded optical waveguides for onboard networking and wireless chip-to-chip links at 200-GHz carrier frequency connecting neighboring boards in a rack. The control of novel rate-adaptive optical and mm-wave transceivers needs tight interlinking with the system software for runtime resource management

Venice: Exploring Server Architectures for Effective Resource Sharing

Consolidated server racks are quickly becoming the backbone of IT infrastructure for science, engineering, and business, alike. These servers are still largely built and organized as when they were distributed, individual entities. Given that many fields increasingly rely on analytics of huge datasets, it makes sense to support flexible resource utilization across servers to improve cost-effectiveness and performance. We introduce Venice, a family of data-center server architectures that builds a strong communication substrate as a first-class resource for server chips. Venice provides a diverse set of resource-joining mechanisms that enables user programs to efficiently leverage non-local resources. To better understand the implications of design decisions about system support for resource sharing we have constructed a hardware prototype that allows us to more accurately measure end-to-end performance of at-scale applications and to explore tradeoffs among performance, power, and resource-sharing transparency. We present results from our initial studies analyzing these tradeoffs when sharing memory, accelerators, or NICs. We find that it is particularly important to reduce or hide latency, that data-sharing access patterns should match the features of the communication channels employed, and that inter-channel collaboration can be exploited for better performance

Reconfigurable Optically Interconnected Systems

With the immense growth of data consumption in today's data centers and high-performance computing systems driven by the constant influx of new applications, the network infrastructure supporting this demand is under increasing pressure to enable higher bandwidth, latency, and flexibility requirements. Optical interconnects, able to support high bandwidth wavelength division multiplexed signals with extreme energy efficiency, have become the basis for long-haul and metro-scale networks around the world, while photonic components are being rapidly integrated within rack and chip-scale systems. However, optical and photonic interconnects are not a direct replacement for electronic-based components. Rather, the integration of optical interconnects with electronic peripherals allows for unique functionalities that can improve the capacity, compute performance and flexibility of current state-of-the-art computing systems. This requires physical layer methodologies for their integration with electronic components, as well as system level control planes that incorporates the optical layer characteristics. This thesis explores various network architectures and the associated control plane, hardware infrastructure, and other supporting software modules needed to integrate silicon photonics and MEMS based optical switching into conventional datacom network systems ranging from intra-data center and high-performance computing systems to the metro-scale layer networks between data centers. In each of these systems, we demonstrate dynamic bandwidth steering and compute resource allocation capabilities to enable significant performance improvements. The key accomplishments of this thesis are as follows. In Part 1, we present high-performance computing network architectures that integrate silicon photonic switches for optical bandwidth steering, enabling multiple reconfigurable topologies that results in significant system performance improvements. As high-performance systems rely on increased parallelism by scaling up to greater numbers of processor nodes, communication between these nodes grows rapidly and the interconnection network becomes a bottleneck to the overall performance of the system. It has been observed that many scientific applications operating on high-performance computing systems cause highly skewed traffic over the network, congesting only a small percentage of the total available links while other links are underutilized. This mismatch of the traffic and the bandwidth allocation of the physical layer network presents the opportunity to optimize the bandwidth resource utilization of the system by using silicon photonic switches to perform bandwidth steering. This allows the individual processors to perform at their maximum compute potential and thereby improving the overall system performance. We show various testbeds that integrates both microring resonator and Mach-Zehnder based silicon photonic switches within Dragonfly and Fat-Tree topology networks built with conventional equipment, and demonstrate 30-60% reduction in execution time of real high-performance benchmark applications. Part 2 presents a flexible network architecture and control plane that enables autonomous bandwidth steering and IT resource provisioning capabilities between metro-scale geographically distributed data centers. It uses a software-defined control plane to autonomously provision both network and IT resources to support different quality of service requirements and optimizes resource utilization under dynamically changing load variations. By actively monitoring both the bandwidth utilization of the network and CPU or memory resources of the end hosts, the control plane autonomously provisions background or dynamic connections with different levels of quality of service using optical MEMS switching, as well as initializing live migrations of virtual machines to consolidate or distribute workload. Together these functionalities provide flexibility and maximize efficiency in processing and transferring data, and enables energy and cost savings by scaling down the system when resources are not needed. An experimental testbed of three data center nodes was built to demonstrate the feasibility of these capabilities. Part 3 presents Lightbridge, a communications platform specifically designed to provide a more seamless integration between processor nodes and an optically switched network. It addresses some of the crucial issues faced by the works presented in the previous chapters related to optical switching. When optical switches perform switching operations, they change the physical topology of the network, and they lack the capability to buffer packets, resulting in certain optical circuits being unavailable. This prompts the question of whether it is safe to transmit packets by end hosts at any given time. Lightbridge was developed to coordinate switching and routing of optical circuits across the network, by having the processors gain information about the current state of the optical network before transmitting packets, and being able to buffer packets when the optical circuit is not available. This part describes details of Lightbridge which is constituted by a loadable Linux kernel module along with other supporting modifications to the Linux kernel in order to achieve the necessary functionalities

An Interconnection Architecture for Seamless Inter and Intra-Chip Communication Using Wireless Links

As semiconductor technologies continues to scale, more and more cores are being integrated on the same multicore chip. This increase in complexity poses the challenge of efficient data transfer between these cores. Several on-chip network architectures are proposed to improve the design flexibility and communication efficiency of such multicore chips. However, in a larger system consisting of several multicore chips across a board or in a System-in-Package (SiP), the performance is limited by the communication among and within these chips. Such systems, most commonly found within computing modules in typical data center nodes or server racks, are in dire need of an efficient interconnection architecture. Conventional interchip communication using wireline links involve routing the data from the internal cores to the peripheral I/O ports, travelling over the interchip channels to the destination chip, and finally getting routed from the I/O to the internal cores there. This multihop communication increases latency and energy consumption while decreasing data bandwidth in a multichip system. Furthermore, the intrachip and interchip communication architectures are separately designed to maximize design flexibility. Jointly designing them could, however, improve the communication efficiency significantly and yield better solutions. Previous attempts at this include an all-photonic approach that provides a unified inter/intra-chip optical network, based on recent progress in nano-photonic technologies. Works on wireless inter-chip interconnects successfully yielded better results than their wired counterparts, but their scopes were limited to establishing a single wireless connection between two chips rather than a communication architecture for a system as a whole. In this thesis, the design of a seamless hybrid wired and wireless interconnection network for multichip systems in a package is proposed. The design utilizes on-chip wireless transceivers with dimensions spanning up to tens of centimeters. It manages to seamlessly bind both intrachip and interchip communication architectures and enables direct chip-to-chip communication between the internal cores. It is shown through cycle accurate simulations that the proposed design increases the bandwidth and reduces the energy consumption when compared to the state-of-the-art wireline I/O based multichip communications

Silicon Photonic Subsystems for Inter-Chip Optical Networks

The continuous growth of electronic compute and memory nodes in terms of the number of I/O pins, bandwidth, and areal throughput poses major integration and packaging challenges associated with offloading multi-Tbit/s data rates within the few pJ/bit targets. While integrated photonics are already deployed in long and short distances such as inter and intra data centers communications, the promising characteristics of the silicon photonic platform set it as the future technology for optical interconnects in ultra short inter-chip distances. The high index contrast between the waveguide and the cladding together with strong thermo-optic and carrier effects in silicon allows developing a wide range of micro-scale and low power optical devices compatible with the CMOS fabrication processes. Furthermore, the availability of photonic foundries and new electrical and optical co-packaging techniques further pushes this platform for the next steps of commercial deployment. The work in this dissertation presents the current trends in high-performance memory and processor nodes and gives motivation for disaggregated and reconfigurable inter-chip network enabled with the silicon photonic layer. A dense WDM transceiver and broadband switch architectures are discussed to support a bi-directional network of ten hybrid-memory cubes (HMC) interconnected to ten processor nodes with an overall aggregated bandwidth of 9.6Tbit/s. Latency and energy consumption are key performance parameters in a processor to primary memory nodes connectivity. The transceiver design is based on energy-efficient micro-ring resonators, and the broadband switch is constructed with 2x2 Mach-Zehnder elements for nano-second reconfiguration. Each transceiver is based on hundreds of micro-rings to convert the native HMC electrical protocol to the optical domain and the switch is based on tens of hundreds of 2x2 elements to achieve non-blocking all-to-all connectivity. The next chapters focus on developing methods for controlling and monitoring such complex and highly integrated silicon photonic subsystems. The thermo-optic effect is characterized and we show experimentally that the phase of the optical carrier can be reliably controlled with pulse-width modulation (PWM) signal, ultimately relaxing the need for hundreds of digital to analog converters (DACs). We further show that doped waveguide heaters can be utilized as \textit{in-line} optical power monitors by measuring photo-conductance current, which is an alternative for the conventional tapping and integration of photo-diodes. The next part concerned with a common cascaded micro-ring resonator in a WDM transceiver design. We develop on an FPGA control algorithm that abstracts the physical layer and takes user-defined inputs to set the resonances to the desired wavelength in a unicast and multicast transmission modes. The associated sensitivities of these silicon ring resonators are presented and addressed with three closed-loop solutions. We first show a closed-loop operation based on tapping the error signal from the drop port of the micro-ring. The second solution presents a resonance wavelength locking with a single digital I/O for control and feedback signals. Lastly, we leverage the photo-conductance effect and demonstrate the locking procedure using only the doped heater for both control and feedback purposes. To achieve the inter-chip reconfigurability we discuss recent advances of high-port-count SiP broadband switches for reconfigurable inter-chip networks. To ensure optimal operation in terms of low insertion loss, low cross-talk and high signal integrity per routing path, hundreds of 2x2 Mach-Zehnder elements need to be biased precisely for the cross and bar states. We address this challenge with a tapless and a design agnostic calibration approach based on the photo-conductance effect. The automated algorithm returns a look-up table for all for each 2x2 element and the associated calibrated biases. Each routing scenario is then tested for insertion loss, crosstalk and bit-error rate of 25Gbit/s 4-level pulse amplitude modulation signals. The last part utilizes the Mach-Zehnder interferometers in WDM transceiver applications. We demonstrate a polarization insensitive four-channel WDM receiver with 40Gbit/s per channel and a transmitter design generating 8-level pulse amplitude modulation signals at 30Gbit/s

Characterizing opportunities for short reach optical interconnect adoption : a market survey and total cost of ownership model approach

Thesis (S.M. in Technology and Policy)--Massachusetts Institute of Technology, Engineering Systems Division, 2010.Cataloged from PDF version of thesis.Includes bibliographical references (p. 134-139).Over the past decade, the demand for digital information has increased dramatically with the rising use of the Internet and various types of multimedia data - text, audio, graphics, video, and voice. As a consequence, the technologies that connect and transport data have become critically important. Available interconnect technologies are broadly organized into two categories: electrical and optical. Although many digital systems use electrical interconnects, optical interconnects are becoming an attractive alternative as electrical connection has become increasingly difficult in terms of cost and performance. However, the transition from electrical to optical interconnects across multiple markets could still be hampered by its higher cost relative to interconnects in the mid-term. Thus, this work seeks to shed light on the following question: "What additional characteristics are useful to evaluate the attractiveness of optical interconnects in emerging markets?" This thesis seeks to explore and answer this question in three parts. The first part of the thesis attempts to gauge the opportunities and barriers to optical interconnect adoption in emerging markets through an analysis of first phase interviews with professionals working in the datacom, automobile, consumer hand-held device industries. Initial review of the response set shows that of the five initial emerging markets for optical interconnect, datacom, specifically high-performance computing (HPC), has the greatest potential for increased optical interconnect adoption in the near future. To further explore the environment for optical interconnects in the HPC, a second, more detailed questionnaire was distributed to a limited number of interviewees. In response to this interview, some respondents noted that several metrics other than cost and performance, particularly power consumption, as being "very important" when deciding which technology to adopt. The second part of the thesis is primarily concerned with investigating further the influence that power and performance concerns have on optical interconnect adoption in HPC data centers. Specifically, this part of the thesis seeks to explore whether power concerns in data centers could lead to increased adoption of optical interconnects. To that end, a cost model of an HPC data center has been developed to identify the possible economic impacts that the adoption of optical interconnect technologies would have in a power-driven scenario. The third part of this thesis presents a set of policy recommendations based on the results from the data center cost model.by Johnathan Jake Lindsey III.S.M.in Technology and Polic

Characterization and optimization of network traffic in cortical simulation

Considering the great variety of obstacles the Exascale systems have to face in the next future, a deeper attention will be given in this thesis to the interconnect and the power consumption. The data movement challenge involves the whole hierarchical organization of components in HPC systems — i.e. registers, cache, memory, disks. Running scientific applications needs to provide the most effective methods of data transport among the levels of hierarchy. On current petaflop systems, memory access at all the levels is the limiting factor in almost all applications. This drives the requirement for an interconnect achieving adequate rates of data transfer, or throughput, and reducing time delays, or latency, between the levels. Power consumption is identified as the largest hardware research challenge. The annual power cost to operate the system would be above 2.5 B$ per year for an Exascale system using current technology. The research for alternative power-efficient computing device is mandatory for the procurement of the future HPC systems. In this thesis, a preliminary approach will be offered to the critical process of co-design. Co-desing is defined as the simultaneos design of both hardware and software, to implement a desired function. This process both integrates all components of the Exascale initiative and illuminates the trade-offs that must be made within this complex undertaking