Low-Voltage Analog Circuit Design Using the Adaptively Biased Body-Driven Circuit Technique

The scaling of MOSFET dimensions and power supply voltage, in conjunction with an increase in system- and circuit-level performance requirements, are the most important factors driving the development of new technologies and design techniques for analog and mixed-signal integrated circuits. Though scaling has been a fact of life for analog circuit designers for many years, the approaching 1-V and sub-1-V power supplies, combined with applications that have increasingly divergent technology requirements, means that the analog and mixed-signal IC designs of the future will probably look quite different from those of the past. Foremost among the challenges that analog designers will face in highly scaled technologies are low power supply voltages, which limit dynamic range and even circuit functionality, and ultra-thin gate oxides, which give rise to significant levels of gate leakage current. The goal of this research is to develop novel analog design techniques which are commensurate with the challenges that designers will face in highly scaled CMOS technologies. To that end, a new and unique body-driven design technique called adaptive gate biasing has been developed. Adaptive gate biasing is a method for guaranteeing that MOSFETs in a body-driven simple current mirror, cascode current mirror, or regulated cascode current source are biased in saturation—independent of operating region, temperature, or supply voltage—and is an enabling technology for high-performance, low-voltage analog circuits. To prove the usefulness of the new design technique, a body-driven operational amplifier that heavily leverages adaptive gate biasing has been developed. Fabricated on a 3.3-V/0.35-μm partially depleted silicon-onv-insulator (PD-SOI) CMOS process, which has nMOS and pMOS threshold voltages of 0.65 V and 0.85 V, respectively, the body-driven amplifier displayed an open-loop gain of 88 dB, bandwidth of 9 MHz, and PSRR greater than 50 dB at 1-V power supply

Large scale reconfigurable analog system design enabled through floating-gate transistors

This work is concerned with the implementation and implication of non-volatile charge storage on VLSI system design. To that end, the floating-gate pFET (fg-pFET) is considered in the context of large-scale arrays. The programming of the element in an efficient and predictable way is essential to the implementation of these systems, and is thus explored. The overhead of the control circuitry for the fg-pFET, a key scalability issue, is examined. A light-weight, trend-accurate model is absolutely necessary for VLSI system design and simulation, and is also provided. Finally, several reconfigurable and reprogrammable systems that were built are discussed.Ph.D.Committee Chair: Hasler, Paul E.; Committee Member: Anderson, David V.; Committee Member: Ayazi, Farrokh; Committee Member: Degertekin, F. Levent; Committee Member: Hunt, William D

Study of a signal processor employing a synthetic phase isolator

Evaluation of signal data processor employing synthetic phase isolator techniqu

Neuromorphic silicon neuron circuits

23 páginas, 21 figuras, 2 tablas.-- et al.Hardware implementations of spiking neurons can be extremely useful for a large variety of applications, ranging from high-speed modeling of large-scale neural systems to real-time behaving systems, to bidirectional brain–machine interfaces. The specific circuit solutions used to implement silicon neurons depend on the application requirements. In this paper we describe the most common building blocks and techniques used to implement these circuits, and present an overview of a wide range of neuromorphic silicon neurons, which implement different computational models, ranging from biophysically realistic and conductance-based Hodgkin–Huxley models to bi-dimensional generalized adaptive integrate and fire models. We compare the different design methodologies used for each silicon neuron design described, and demonstrate their features with experimental results, measured from a wide range of fabricated VLSI chips.This work was supported by the EU ERC grant 257219 (neuroP), the EU ICT FP7 grants 231467 (eMorph), 216777 (NABAB), 231168 (SCANDLE), 15879 (FACETS), by the Swiss National Science Foundation grant 119973 (SoundRec), by the UK EPSRC grant no. EP/C010841/1, by the Spanish grants (with support from the European Regional Development Fund) TEC2006-11730-C03-01 (SAMANTA2), TEC2009-10639-C04-01 (VULCANO) Andalusian grant num. P06TIC01417 (Brain System), and by the Australian Research Council grants num. DP0343654 and num. DP0881219.Peer Reviewe

System and circuitry to provide stable transconductance for biasing

An amplifier system can include an input amplifier configured to receive an analog input signal and provide an amplified signal corresponding to the analog input signal. A tracking loop is configured to employ delta modulation for tracking the amplified signal, the tracking loop providing a corresponding output signal. A biasing circuit is configured to adjust a bias current to maintain stable transconductance over temperature variations, the biasing circuit providing at least one bias signal for biasing at least one of the input amplifier and the tracking loop, whereby the circuitry receiving the at least one bias signal exhibits stable performance over the temperature variations. In another embodiment the biasing circuit can be utilized in other applications

Robust low-power digital circuit design in nano-CMOS technologies

Device scaling has resulted in large scale integrated, high performance, low-power, and low cost systems. However the move towards sub-100 nm technology nodes has increased variability in device characteristics due to large process variations. Variability has severe implications on digital circuit design by causing timing uncertainties in combinational circuits, degrading yield and reliability of memory elements, and increasing power density due to slow scaling of supply voltage. Conventional design methods add large pessimistic safety margins to mitigate increased variability, however, they incur large power and performance loss as the combination of worst cases occurs very rarely. In-situ monitoring of timing failures provides an opportunity to dynamically tune safety margins in proportion to on-chip variability that can significantly minimize power and performance losses. We demonstrated by simulations two delay sensor designs to detect timing failures in advance that can be coupled with different compensation techniques such as voltage scaling, body biasing, or frequency scaling to avoid actual timing failures. Our simulation results using 45 nm and 32 nm technology BSIM4 models indicate significant reduction in total power consumption under temperature and statistical variations. Future work involves using dual sensing to avoid useless voltage scaling that incurs a speed loss. SRAM cache is the first victim of increased process variations that requires handcrafted design to meet area, power, and performance requirements. We have proposed novel 6 transistors (6T), 7 transistors (7T), and 8 transistors (8T)-SRAM cells that enable variability tolerant and low-power SRAM cache designs. Increased sense-amplifier offset voltage due to device mismatch arising from high variability increases delay and power consumption of SRAM design. We have proposed two novel design techniques to reduce offset voltage dependent delays providing a high speed low-power SRAM design. Increasing leakage currents in nano-CMOS technologies pose a major challenge to a low-power reliable design. We have investigated novel segmented supply voltage architecture to reduce leakage power of the SRAM caches since they occupy bulk of the total chip area and power. Future work involves developing leakage reduction methods for the combination logic designs including SRAM peripherals

Thin, nearly wireless adaptive optical device

A thin, nearly wireless adaptive optical device capable of dynamically modulating the shape of a mirror in real time to compensate for atmospheric distortions and/or variations along an optical material is provided. The device includes an optical layer, a substrate, at least one electronic circuit layer with nearly wireless architecture, an array of actuators, power electronic switches, a reactive force element, and a digital controller. Actuators are aligned so that each axis of expansion and contraction intersects both substrate and reactive force element. Electronics layer with nearly wireless architecture, power electronic switches, and digital controller are provided within a thin-film substrate. The size and weight of the adaptive optical device is solely dominated by the size of the actuator elements rather than by the power distribution system