Artificial Neural Networks in Production Scheduling and Yield Prediction of Semiconductor Wafer Fabrication System

With the development of artificial intelligence, the artificial neural networks (ANN) are widely used in the control, decision‐making and prediction of complex discrete event manufacturing systems. Wafer fabrication is one of the most complicated and high competence manufacturing phases. The production scheduling and yield prediction are two critical issues in the operation of semiconductor wafer fabrication system (SWFS). This chapter proposed two fuzzy neural networks for the production rescheduling strategy decision and the die yield prediction. Firstly, a fuzzy neural network (FNN)‐based rescheduling decision model is implemented, which can rapidly choose an optimized rescheduling strategy to schedule the semiconductor wafer fabrication lines according to the current system disturbances. The experimental results demonstrate the effectiveness of proposed FNN‐based rescheduling decision mechanism approach over the alternatives (back‐propagation neural network and Multivariate regression). Secondly, a novel fuzzy neural network‐based yield prediction model is proposed to improve prediction accuracy of die yield in which the impact factors of yield and critical electrical test parameters are considered simultaneously and are taken as independent variables. The comparison experiment verifies the proposed yield prediction method improves on three traditional yield prediction methods with respect to prediction accuracy

A review of data mining applications in semiconductor manufacturing

The authors acknowledge Fundacao para a Ciencia e a Tecnologia (FCT-MCTES) for its financial support via the project UIDB/00667/2020 (UNIDEMI).For decades, industrial companies have been collecting and storing high amounts of data with the aim of better controlling and managing their processes. However, this vast amount of information and hidden knowledge implicit in all of this data could be utilized more efficiently. With the help of data mining techniques unknown relationships can be systematically discovered. The production of semiconductors is a highly complex process, which entails several subprocesses that employ a diverse array of equipment. The size of the semiconductors signifies a high number of units can be produced, which require huge amounts of data in order to be able to control and improve the semiconductor manufacturing process. Therefore, in this paper a structured review is made through a sample of 137 papers of the published articles in the scientific community regarding data mining applications in semiconductor manufacturing. A detailed bibliometric analysis is also made. All data mining applications are classified in function of the application area. The results are then analyzed and conclusions are drawn.publishersversionpublishe

Data mining in manufacturing: a review based on the kind of knowledge

In modern manufacturing environments, vast amounts of data are collected in database management systems and data warehouses from all involved areas, including product and process design, assembly, materials planning, quality control, scheduling, maintenance, fault detection etc. Data mining has emerged as an important tool for knowledge acquisition from the manufacturing databases. This paper reviews the literature dealing with knowledge discovery and data mining applications in the broad domain of manufacturing with a special emphasis on the type of functions to be performed on the data. The major data mining functions to be performed include characterization and description, association, classification, prediction, clustering and evolution analysis. The papers reviewed have therefore been categorized in these five categories. It has been shown that there is a rapid growth in the application of data mining in the context of manufacturing processes and enterprises in the last 3 years. This review reveals the progressive applications and existing gaps identified in the context of data mining in manufacturing. A novel text mining approach has also been used on the abstracts and keywords of 150 papers to identify the research gaps and find the linkages between knowledge area, knowledge type and the applied data mining tools and techniques

Modeling and Optimization of Chemical Mechanical Planarization (Cmp) Using Neural Networks, Anfis and Evolutionary Algorithms

Higher density nano-devices and more metallization layers in microelectronic chips are unceasing goals to the present semiconductor industry. However, topological imperfections (higher non-uniformity) on the wafer surfaces and lower material removal rates (MRR) seriously hamper these pursuing motivations. Since'90, industry has been using chemical mechanical planarization/polishing (CMP) to overcome these obstacles for fabricating integrated circuits (IC) with interconnect geometries of < 0.18 &amp;#956;m. Obviously, the much needed understanding of this new technique is derived basically on the ancient lapping process. Modeling and simulation are critical to transfer CMP from an engineering 'art' to an engineering 'science'. Many efforts in CMP modeling have been made in the last decade, but the available analytical MRR and surface uniformity models cannot precisely describe this highly complicated process, involving simultaneous chemical reactions (and etching), and mechanical abrasion. In this investigation, neural networks (NN), adaptive-based-network fuzzy inference system (ANFIS), and evolutionary algorithms (EA) techniques were applied to successfully overcome the aforementioned modeling and simulation problems. In addition, fine-tuning techniques for re-modifying ANFIS models for sparse-data case using are developed. Furthermore, multi-objective evolutionary algorithms (MOEA) are firstly applied to search for the optimal input settings for CMP process to trade-off the higher MRR and lower non-Uniformity by using the previously constructed models. The results also show the simulation of MOEA optimization can certainly provide accurate guidance to search the optimal input settings for CMP process to produce lower non-uniform wafer surfaces under higher MRR.Mechanical & Aerospace Engineerin

Intelligent systems in manufacturing: current developments and future prospects

Global competition and rapidly changing customer requirements are demanding increasing changes in manufacturing environments. Enterprises are required to constantly redesign their products and continuously reconfigure their manufacturing systems. Traditional approaches to manufacturing systems do not fully satisfy this new situation. Many authors have proposed that artificial intelligence will bring the flexibility and efficiency needed by manufacturing systems. This paper is a review of artificial intelligence techniques used in manufacturing systems. The paper first defines the components of a simplified intelligent manufacturing systems (IMS), the different Artificial Intelligence (AI) techniques to be considered and then shows how these AI techniques are used for the components of IMS

MICROELECTRONICS PACKAGING TECHNOLOGY ROADMAPS, ASSEMBLY RELIABILITY, AND PROGNOSTICS

This paper reviews the industry roadmaps on commercial-off-the shelf (COTS) microelectronics packaging technologies covering the current trends toward further reducing size and increasing functionality. Due tothe breadth of work being performed in this field, this paper presents only a number of key packaging technologies. The topics for each category were down-selected by reviewing reports of industry roadmaps including the International Technology Roadmap for Semiconductor (ITRS) and by surveying publications of the International Electronics Manufacturing Initiative (iNEMI) and the roadmap of association connecting electronics industry (IPC). The paper also summarizes the findings of numerous articles and websites that allotted to the emerging and trends in microelectronics packaging technologies. A brief discussion was presented on packaging hierarchy from die to package and to system levels. Key elements of reliability for packaging assemblies were presented followed by reliabilty definition from a probablistic failure perspective. An example was present for showing conventional reliability approach using Monte Carlo simulation results for a number of plastic ball grid array (PBGA). The simulation results were compared to experimental thermal cycle test data. Prognostic health monitoring (PHM) methods, a growing field for microelectronics packaging technologies, were briefly discussed. The artificial neural network (ANN), a data-driven PHM, was discussed in details. Finally, it presented inter- and extra-polations using ANN simulation for thermal cycle test data of PBGA and ceramic BGA (CBGA) assemblies

A Review and Analysis of Automatic Optical Inspection and Quality Monitoring Methods in Electronics Industry

Electronics industry is one of the fastest evolving, innovative, and most competitive industries. In order to meet the high consumption demands on electronics components, quality standards of the products must be well-maintained. Automatic optical inspection (AOI) is one of the non-destructive techniques used in quality inspection of various products. This technique is considered robust and can replace human inspectors who are subjected to dull and fatigue in performing inspection tasks. A fully automated optical inspection system consists of hardware and software setups. Hardware setup include image sensor and illumination settings and is responsible to acquire the digital image, while the software part implements an inspection algorithm to extract the features of the acquired images and classify them into defected and non-defected based on the user requirements. A sorting mechanism can be used to separate the defective products from the good ones. This article provides a comprehensive review of the various AOI systems used in electronics, micro-electronics, and opto-electronics industries. In this review the defects of the commonly inspected electronic components, such as semiconductor wafers, flat panel displays, printed circuit boards and light emitting diodes, are first explained. Hardware setups used in acquiring images are then discussed in terms of the camera and lighting source selection and configuration. The inspection algorithms used for detecting the defects in the electronic components are discussed in terms of the preprocessing, feature extraction and classification tools used for this purpose. Recent articles that used deep learning algorithms are also reviewed. The article concludes by highlighting the current trends and possible future research directions.Framework of the IQONIC Project; European Union’s Horizon 2020 Research and Innovation Program

Sensor based real-time process monitoring for ultra-precision manufacturing processes with non-linearity and non-stationarity

This research investigates methodologies for real-time process monitoring in ultra-precision manufacturing processes, specifically, chemical mechanical planarization (CMP) and ultra-precision machining (UPM), are investigated in this dissertation.The three main components of this research are as follows: (1) developing a predictive modeling approaches for early detection of process anomalies/change points, (2) devising approaches that can capture the non-Gaussian and non-stationary characteristics of CMP and UPM processes, and (3) integrating multiple sensor data to make more reliable process related decisions in real-time.In the first part, we establish a quantitative relationship between CMP process performance, such as material removal rate (MRR) and data acquired from wireless vibration sensors. Subsequently, a non-linear sequential Bayesian analysis is integrated with decision theoretic concepts for detection of CMP process end-point for blanket copper wafers. Using this approach, CMP polishing end-point was detected within a 5% error rate.Next, a non-parametric Bayesian analytical approach is utilized to capture the inherently complex, non-Gaussian, and non-stationary sensor signal patterns observed in CMP process. An evolutionary clustering analysis, called Recurrent Nested Dirichlet Process (RNDP) approach is developed for monitoring CMP process changes using MEMS vibration signals. Using this novel signal analysis approach, process drifts are detected within 20 milliseconds and is assessed to be 3-7 times faster than traditional SPC charts. This is very beneficial to the industry from an application standpoint, because, wafer yield losses will be mitigated to a great extent, if the onset of CMP process drifts can be detected timely and accurately.Lastly, a non-parametric Bayesian modeling approach, termed Dirichlet Process (DP) is combined with a multi-level hierarchical information fusion technique for monitoring of surface finish in UPM process. Using this approach, signal patterns from six different sensors (three axis vibration and force) are integrated based on information fusion theory. It was observed that using experimental UPM sensor data that process decisions based on the multiple sensor information fusion approach were 15%-30% more accurate than the decisions from individual sensors. This will enable more accurate and reliable estimation of process conditions in ultra-precision manufacturing applications

Surface Defect Detection And Polishing Parameter Optimization Using Image Processing For G3141 Cold Rolled Steel

Traditionally the surface quality inspection especially for metal polishing purpose is perform by human inspectors. Defect detection is a method of nondestructive testing of material and products to detect defects. This study consists of two parts where the first part is applying vision system to detect and measure surface defects that have been characterized to some level of surface roughness. Specimen of G3141 cold rolled steel is used in this research as it represent the actual material applied in local automotive manufacturer. Gray image of scratch defect on metal surface is detected and information about mean gray pixel value (Ga) is interpreted and converted to surface roughness (Ra) measurement. In this study a new technique is developed where the Ga only read on the specific scratch line without considering the whole image. To realize this, automatic cropping algorithm is developed to detect the region of interest and interpret the Ga value. This techniques will enables the polishing to be done at specific scratch defect area without necessary to develop polishing path throughout the whole surface which is time consuming. Second part is to obtain the optimum polishing parameter by using artificial intelligence technique which is able to predict the grit size, polishing time and polishing force parameter to remove the scratch by polishing process. For the purpose of this study, multiple ANFIS or MANFIS have been selected to predict optimum parameter for polishing parameters. Polishing parameter data can be generated by using MANFIS to predict optimum polishing parameters such as grit size, polishing time and polishing force in order to perform polishing process. However due to lack of study done in the field of flat and dry polishing, the polishing parameter data have to be developed. The polishing parameter data for flat and dry polishing is performed by using robotic polishing arm and the experiment runs design by using full factorial design. Results show that the defect detection algorithm able to detect defect only on the scratch area and able to read the Ga value at detected scratch line and transform it to surface roughness measurement at considerably good level of accuracy compared with manual method. Results from MANFIS have shown that the system is able to predict up to 95% accuracy which is considerably high. The overall results from both parts of this research would inspire further advancements to achieve robust machine vision based surface measurement systems for industrial robotic processes specifically in polishing process