Rail-to-Rail Timing Signals Generation Using InGaZnO TFTs for Flexible X-Ray Detector

ECR/2017/000931 POCI-01-0145-FEDER-007688This paper reports on-chip rail-to-rail timing signals generation thin-film circuits for the first time. These circuits, based on a-IGZO thin-film transistors (TFTs) with a simple staggered bottom gate structure, allow row and column selection of a sensor matrix embedded in a flexible radiation sensing system. They include on-chip clock generator (ring oscillator), column selector (shift register) and row-selector (a frequency divider and a shift register). They are realised with rail-to-rail logic gates with level-shifting ability that can perform inversion and NAND logic operations. These logic gates are capable of providing full output swing between supply rails, $V_{DD}$ and $V_{SS}$ , by introducing a single additional switch for each input in bootstrapping logic gates. These circuits were characterised under normal ambient atmosphere and show an improved performance compared to the conventional logic gates with diode connected load and pseudo CMOS counterparts. By using these high-performance logic gates, a complete rail-to-rail frequency divider is presented from measurements using D-Flip Flop. In order to realize a complete compact system, an on-chip ring oscillator (output clock frequency around 1 kHz) and a shift register are also presented from simulations, where these circuits show a power consumption of 1.5 mW and 0.82 mW at a supply voltage of 8 V, respectively. While the circuit concepts described here were designed for an X-ray sensing system, they can be readily expanded to other domains where flexible on-chip timing signal generation is required, such as, smart packaging, biomedical wearable devices and RFIDs.publishersversionpublishe

Advanced modelling and design considerations for interconnects in ultra- low power digital system

PhD ThesisAs Very Large Scale Integration (VLSI) is progressing in very Deep submicron (DSM) regime without decreasing chip area, the importance of global interconnects increases but at the cost of performance and power consumption for advanced System-on- Chip (SoC)s. However, the growing complexity of interconnects behaviour presents a challenge for their adequate modelling, whereby conventional circuit theoretic approaches cannot provide sufficient accuracy. During the last decades, fractional differential calculus has been successfully applied to modelling certain classes of dynamical systems while keeping complexity of the models under acceptable bounds. For example, fractional calculus can help capturing inherent physical effects in electrical networks in a compact form, without following conventional assumptions about linearization of non-linear interconnect components. This thesis tackles the problem of interconnect modelling in its generality to simulate a wide range of interconnection configurations, its capacity to emulate irregular circuit elements and its simplicity in the form of responsible approximation. This includes modelling and analysing interconnections considering their irregular components to add more flexibility and freedom for design. The aim is to achieve the simplest adaptable model with the highest possible accuracy. Thus, the proposed model can be used for fast computer simulation of interconnection behaviour. In addition, this thesis proposes a low power circuit for driving a global interconnect at voltages close to the noise level. As a result, the proposed circuit demonstrates a promising solution to address the energy and performance issues related to scaling effects on interconnects along with soft errors that can be caused by neutron particles. The major contributions of this thesis are twofold. Firstly, in order to address Ultra-Low Power (ULP) design limitations, a novel driver scheme has been configured. This scheme uses a bootstrap circuitry which boosts the driver’s ability to drive a long interconnect with an important feedback feature in it. Hence, this approach achieves two objectives: improving performance and mitigating power consumption. Those achievements are essential in designing ULP circuits along with occupying a smaller footprint and being immune to noise, observed in this design as well. These have been verified by comparing the proposed design to the previous and traditional circuits using a simulation tool. Additionally, the boosting based approach has been shown beneficial in mitigating the effects of single event upset (SEU)s, which are known to affect DSM circuits working under low voltages. Secondly, the CMOS circuit driving a distributed RLC load has been brought in its analysis into the fractional order domain. This model will make the on-chip interconnect structure easy to adjust by including the effect of fractional orders on the interconnect timing, which has not been considered before. A second-order model for the transfer functions of the proposed general structure is derived, keeping the complexity associated with second-order models for this class of circuits at a minimum. The approach here attaches an important trait of robustness to the circuit design procedure; namely, by simply adjusting the fractional order we can avoid modifying the circuit components. This can also be used to optimise the estimation of the system’s delay for a broad range of frequencies, particularly at the beginning of the design flow, when computational speed is of paramount importance.Iraqi Ministry of Higher Education and Scientific Researc

Design and implementation of Radix-3/Radix-2 based novel hybrid SAR ADC in scaled CMOS technologies

This thesis focuses on low power and high speed design techniques for successive approximation register (SAR) analog-to-digital converters (ADCs) in nanoscale CMOS technologies. SAR ADCs’ speed is limited by the number of bits of resolution. An N-bit conventional SAR ADC takes N conversion cycles. To speed up the conversion process, we introduce a radix-3 SAR ADC which can compute 1:6 bits per cycle. To our knowledge, it is the first fully programmable and efficiently hardware controlled radix-3 SAR ADC. We had to use two comparators per cycle due to ADC architecture and we proposed a simple calibration scheme for the comparators. Also, as the architecture of the DAC array is completely different from the architecture of conventional radix-2 SAR ADC’s DAC arrays, we came up with an algorithm for calibration of capacitors of the DAC. Low power SAR ADCs face two major challenges especially at high resolutions: (1) increased comparator power to suppress the noise, and (2) increased DAC switching energy due to the large DAC size. Due to our proposed architecture,the radix-3 SAR ADC uses two comparators per cycle and two differential DACs. To improve the comparator’s power efficiency, an efficient and low cost calibration technique has been introduced. It allows a low power and noisy comparator to achieve high signal-to-noise ratio (SNR). To improve the DAC switching energy, we introduced a radix-3/radix-2 based novel hybrid SAR ADC. We use two single ended DACs for radix-3 SAR ADC and these two single ended DACs can be used as one differential DAC for radix-2 SAR ADC. So, overall, we only have a single DAC as conventional radix- 2 SAR ADC. In addition, a monotonic switching technique is adopted for radix-2 search to reduce the DAC capacitor size and hence, to reduce switching power. It can reduce the total number of unit capacitors by four times. Our proposed hybrid SAR ADC can achieve less DAC energy compared to radix-3 and radix-2 SAR ADCs. Also, to utilize technology scaling, we used the minimum capacitor size allowed by thermal noise limitations. To achieve high resolution, we introduced calibration algorithm for the DAC array. As mentioned earlier, the radix-3 SAR ADC offers higher power than conventional radix-2 SAR ADC because of simultaneous use of two comparators. In the proposed hybrid SAR ADC, we will be using radix-3 search for first few MSB bits. So, the resolution required for radix-3 comparators are much larger than the LSB value of 10-bit ADC. By implementing calibration of comparators, we can use low power, high input referred offset and high speed comparators for radix-3 search. Radix-2 search will be used for rest of the bits and the resolution of the radix-2 comparator has to be less than the required LSB value. So, a high power, low input referred offset and high speed comparator is used for radix-2 search. Also, we introduced clock gating for comparators. So, radix-3 comparators will not toggle during radix-2 search and the radix-2 comparators will be inactive during radix-3 search. By using the aforementioned techniques, the overall comparator power is definitely less than a radix-3 SAR ADC and comparable to a conventional radix-2 SAR ADC. A prototype radix-3/radix-2 based hybrid SAR ADC with the proposed technique is designed and fabricated in 40nm CMOS technology. It achieves an SNDR of 56.9 dB and consumes only 0.38 mW power at 30MS/s, leading to a Walden figure of merit of 21.5 fJ/conv-step.Electrical and Computer Engineerin

Design and analysis of a high-efficiencyv high-voltage class-D power output stage

The analysis and design of a highly-efficient 80 V class-D power stage design in a 0.14 μm SOI-based BCD process is described. It features immunity to the on-chip supply bounce, realized by internally regulated floating supplies, variable driving strength for the gate driver, and an efficient 2-step level shifter design. Fast switching transition and low switching loss are achieved with 94% peak efficiency for the complete class-D power stage in the realized chip

Design of Energy-Efficient A/D Converters with Partial Embedded Equalization for High-Speed Wireline Receiver Applications

As the data rates of wireline communication links increases, channel impairments such as skin effect, dielectric loss, fiber dispersion, reflections and cross-talk become more pronounced. This warrants more interest in analog-to-digital converter (ADC)-based serial link receivers, as they allow for more complex and flexible back-end digital signal processing (DSP) relative to binary or mixed-signal receivers. Utilizing this back-end DSP allows for complex digital equalization and more bandwidth-efficient modulation schemes, while also displaying reduced process/voltage/temperature (PVT) sensitivity. Furthermore, these architectures offer straightforward design translation and can directly leverage the area and power scaling offered by new CMOS technology nodes. However, the power consumption of the ADC front-end and subsequent digital signal processing is a major issue. Embedding partial equalization inside the front-end ADC can potentially result in lowering the complexity of back-end DSP and/or decreasing the ADC resolution requirement, which results in a more energy-effcient receiver. This dissertation presents efficient implementations for multi-GS/s time-interleaved ADCs with partial embedded equalization. First prototype details a 6b 1.6GS/s ADC with a novel embedded redundant-cycle 1-tap DFE structure in 90nm CMOS. The other two prototypes explain more complex 6b 10GS/s ADCs with efficiently embedded feed-forward equalization (FFE) and decision feedback equalization (DFE) in 65nm CMOS. Leveraging a time-interleaved successive approximation ADC architecture, new structures for embedded DFE and FFE are proposed with low power/area overhead. Measurement results over FR4 channels verify the effectiveness of proposed embedded equalization schemes. The comparison of fabricated prototypes against state-of-the-art general-purpose ADCs at similar speed/resolution range shows comparable performances, while the proposed architectures include embedded equalization as well

A novel low-swing voltage driver design and the analysis of its robustness to the effects of process variation and external disturbances

arket forces are continually demanding devices with increased functionality/unit area; these demands have been satisfied through aggressive technology scaling which, unfortunately, has impacted adversely on the global interconnect delay subsequently reducing system performance. Line drivers have been used to mitigate the problems with delay; however, these have a large power consumption. A solution to reducing the power dissipation of the drivers is to use lower supply voltages. However, by adopting a lower power supply voltage, the performance of the line drivers for global interconnects is impaired unless low-swing signalling techniques are implemented. Low-swing signalling techniques can provide high speed signalling with low power consumption and hence can be used to drive global on-chip interconnect. Most of the proposed low-swing signalling schemes are immune to noise as they have a good SNR. However, they tend to have a large penalty in area and complexity as they require additional circuitry such as voltage generators and low-Vth devices. Most of the schemes also incorporate multiple Vdd and reference voltages which increase the overall circuit complexity. A diode-connected driver circuit has the best attributes over other low-swing signalling techniques in terms of low power, low delay, good SNR and low area overhead. By incorporating a diode-connected configuration at the output, it can provide high speed signalling due to its high driving capability. However, this configuration also has its limitations as it has issues with its adaptability to process variations, as well as an issue with leakage currents. To address these limitations, two novel driver schemes have been designed, namely, nLVSD and mLVSD, which, additionally, have improvements in performance and power consumption. Comparisons between the proposed schemes with the existing diode-connected driver circuits (MJ and DDC) showed that the nLVSD and mLVSD drivers have approximately 46% and 50% less delay. The name MJ originates from the driver’s designer called Juan A. Montiel-Nelson, while DDC stands for dynamic diode-connected. In terms of power consumption, the nLVSD and mLVSD drivers also produce 43% and 7% improvement. Additionally, the mLVSD driver scheme is the most robust as its SNR is 14 to 44% higher compared to other diode-connected driver circuits. On the other hand, the nLVSD driver has 6% lower SNR compared to the MJ driver, even though it is 19% more robust than the DDC driver. However, since its SNR is still above 1, its improved performance and reduced power consumption, as well other advantages it has over other diode-connected driver circuits can compensate for this limitation. Regarding the robustness to external disturbances, the proposedmdriver circuits are more robust to crosstalk effects as the nLVSD and mLVSD drivers are approximately 35% and 7% more robust than other diode-connected drivers. Furthermore, the mLVSD driver is 5%, 33% and 47% more tolerant to SEUs compared to the nLVSD, MJ and DDC driver circuits respectively, whilst the MJ and DDC drivers are 26% and 40% less tolerant to SEUs iii compared to the nLVSD circuit. A comparison between the four schemes was also undertaken in the presence of ±3σ process and voltage (PV) variations. The analysis indicated that both proposed driver schemes are more robust than other diode-connected driver schemes, namely, the MJ and DDC driver circuits. The MJ driver scheme deviates approximately 18% and 35% more in delay and power consumption compared to the proposed schemes. The DDC driver has approximately 20% and 57% more variations in delay and power consumption in comparison to the proposed schemes. In order to further improve the robustness of the proposed driver circuits against process variation and environmental disturbances, they were further analysed to identify which process variables had the most impact on circuit delay and power consumption, as well as identifying several design techniques to mitigate problems with environmental disturbances. The most significant process parameters to have impact on circuit delay and power consumption were identified to be Vdd, tox, Vth, s, w and t. The impact of SEUs on the circuit can be reduced by increasing the bias currents whilst design methods such as increasing the interconnect spacing can help improve the circuit robustness against crosstalk. Overall it is considered that the proposed nLVSD and mLVSD circuits advance the state of the art in driver design for on-chip signalling applications.EThOS - Electronic Theses Online ServiceGBUnited Kingdo

Design Techniques for High Speed Low Voltage and Low Power Non-Calibrated Pipeline Analog to Digital Converters

The profound digitization of modern microelectronic modules made Analog-to- Digital converters (ADC) key components in many systems. With resolutions up to 14bits and sampling rates in the 100s of MHz, the pipeline ADC is a prime candidate for a wide range of applications such as instrumentation, communications and consumer electronics. However, while past work focused on enhancing the performance of the pipeline ADC from an architectural standpoint, little has been done to individually address its fundamental building blocks. This work aims to achieve the latter by proposing design techniques to improve the performance of these blocks with minimal power consumption in low voltage environments, such that collectively high performance is achieved in the pipeline ADC. Towards this goal, a Recycling Folded Cascode (RFC) amplifier is proposed as an enhancement to the general performance of the conventional folded cascode. Tested in Taiwan Semiconductor Manufacturing Company (TSMC) 0.18?m Complementary Metal Oxide Semiconductor (CMOS) technology, the RFC provides twice the bandwidth, 8-10dB additional gain, more than twice the slew rate and improved noise performance over the conventional folded cascode-all at no additional power or silicon area. The direct auto-zeroing offset cancellation scheme is optimized for low voltage environments using a dual level common mode feedback (CMFB) circuit, and amplifier differential offsets up to 50mV are effectively cancelled. Together with the RFC, the dual level CMFB was used to implement a sample and hold amplifier driving a singleended load of 1.4pF and using only 2.6mA; at 200MS/s better than 9bit linearity is achieved. Finally a power conscious technique is proposed to reduce the kickback noise of dynamic comparators without resorting to the use of pre-amplifiers. When all techniques are collectively used to implement a 1Vpp 10bit 160MS/s pipeline ADC in Semiconductor Manufacturing International Corporation (SMIC) 0.18[mu]m CMOS, 9.2 effective number of bits (ENOB) is achieved with a near Nyquist-rate full scale signal. The ADC uses an area of 1.1mm2 and consumes 42mW in its analog core. Compared to recent state-of-the-art implementations in the 100-200MS/s range, the presented pipeline ADC uses the least power per conversion rated at 0.45pJ/conversion-step

Development of electronics for microultrasound capsule endoscopy

Development of intracorporeal devices has surged in the last decade due to advancements in the semiconductor industry, energy storage and low-power sensing systems. This work aims to present a thorough systematic overview and exploration of the microultrasound (µUS) capsule endoscopy (CE) field as the development of electronic components will be key to a successful applicable µUSCE device. The research focused on investigating and designing high-voltage (HV, < 36 V) generating and driving circuits as well as a low-noise amplifier (LNA) for battery-powered and volume-limited systems. In implantable applications, HV generation with maximum efficiency is required to improve the operational lifetime whilst reducing the cost of the device. A fully integrated hybrid (H) charge pump (CP) comprising a serial-parallel (SP) stage was designed and manufactured for > 20 V and 0 - 100 µA output capabilities. The results were compared to a Dickson (DKCP) occupying the same chip area; further improvements in the SPCP topology were explored and a new switching scheme for SPCPs was introduced. A second regulated CP version was excogitated and manufactured to use with an integrated µUS pulse generator. The CP was manufactured and tested at different output currents and capacitive loads; its operation with an US pulser was evaluated and a novel self-oscillating CP mechanism to eliminate the need of an auxiliary clock generator with a minimum area overhead was devised. A single-output universal US pulser was designed, manufactured and tested with 1.5 MHz, 3 MHz, and 28 MHz arrays to achieve a means of fully-integrated, low-power transducer driving. The circuit was evaluated for power consumption and pulse generation capabilities with different loads. Pulse-echo measurements were carried out and compared with those from a commercial US research system to characterise and understand the quality of the generated pulse. A second pulser version for a 28 MHz array was derived to allow control of individual elements. The work involved its optimisation methodology and design of a novel HV feedback-based level-shifter. A low-noise amplifier (LNA) was designed for a wide bandwidth µUS array with a centre frequency of 28 MHz. The LNA was based on an energy-efficient inverter architecture. The circuit encompassed a full power-down functionality and was investigated for a self-biased operation to achieve lower chip area. The explored concepts enable realisation of low power and high performance LNAs for µUS frequencies