Design and debugging of multi-step analog to digital converters

With the fast advancement of CMOS fabrication technology, more and more signal-processing functions are implemented in the digital domain for a lower cost, lower power consumption, higher yield, and higher re-configurability. The trend of increasing integration level for integrated circuits has forced the A/D converter interface to reside on the same silicon in complex mixed-signal ICs containing mostly digital blocks for DSP and control. However, specifications of the converters in various applications emphasize high dynamic range and low spurious spectral performance. It is nontrivial to achieve this level of linearity in a monolithic environment where post-fabrication component trimming or calibration is cumbersome to implement for certain applications or/and for cost and manufacturability reasons. Additionally, as CMOS integrated circuits are accomplishing unprecedented integration levels, potential problems associated with device scaling – the short-channel effects – are also looming large as technology strides into the deep-submicron regime. The A/D conversion process involves sampling the applied analog input signal and quantizing it to its digital representation by comparing it to reference voltages before further signal processing in subsequent digital systems. Depending on how these functions are combined, different A/D converter architectures can be implemented with different requirements on each function. Practical realizations show the trend that to a first order, converter power is directly proportional to sampling rate. However, power dissipation required becomes nonlinear as the speed capabilities of a process technology are pushed to the limit. Pipeline and two-step/multi-step converters tend to be the most efficient at achieving a given resolution and sampling rate specification. This thesis is in a sense unique work as it covers the whole spectrum of design, test, debugging and calibration of multi-step A/D converters; it incorporates development of circuit techniques and algorithms to enhance the resolution and attainable sample rate of an A/D converter and to enhance testing and debugging potential to detect errors dynamically, to isolate and confine faults, and to recover and compensate for the errors continuously. The power proficiency for high resolution of multi-step converter by combining parallelism and calibration and exploiting low-voltage circuit techniques is demonstrated with a 1.8 V, 12-bit, 80 MS/s, 100 mW analog to-digital converter fabricated in five-metal layers 0.18-µm CMOS process. Lower power supply voltages significantly reduce noise margins and increase variations in process, device and design parameters. Consequently, it is steadily more difficult to control the fabrication process precisely enough to maintain uniformity. Microscopic particles present in the manufacturing environment and slight variations in the parameters of manufacturing steps can all lead to the geometrical and electrical properties of an IC to deviate from those generated at the end of the design process. Those defects can cause various types of malfunctioning, depending on the IC topology and the nature of the defect. To relive the burden placed on IC design and manufacturing originated with ever-increasing costs associated with testing and debugging of complex mixed-signal electronic systems, several circuit techniques and algorithms are developed and incorporated in proposed ATPG, DfT and BIST methodologies. Process variation cannot be solved by improving manufacturing tolerances; variability must be reduced by new device technology or managed by design in order for scaling to continue. Similarly, within-die performance variation also imposes new challenges for test methods. With the use of dedicated sensors, which exploit knowledge of the circuit structure and the specific defect mechanisms, the method described in this thesis facilitates early and fast identification of excessive process parameter variation effects. The expectation-maximization algorithm makes the estimation problem more tractable and also yields good estimates of the parameters for small sample sizes. To allow the test guidance with the information obtained through monitoring process variations implemented adjusted support vector machine classifier simultaneously minimize the empirical classification error and maximize the geometric margin. On a positive note, the use of digital enhancing calibration techniques reduces the need for expensive technologies with special fabrication steps. Indeed, the extra cost of digital processing is normally affordable as the use of submicron mixed signal technologies allows for efficient usage of silicon area even for relatively complex algorithms. Employed adaptive filtering algorithm for error estimation offers the small number of operations per iteration and does not require correlation function calculation nor matrix inversions. The presented foreground calibration algorithm does not need any dedicated test signal and does not require a part of the conversion time. It works continuously and with every signal applied to the A/D converter. The feasibility of the method for on-line and off-line debugging and calibration has been verified by experimental measurements from the silicon prototype fabricated in standard single poly, six metal 0.09-µm CMOS process

Design of Power Management Integrated Circuits and High-Performance ADCs

A battery-powered system has widely expanded its applications to implantable medical devices (IMDs) and portable electronic devices. Since portable devices or IMDs operate in the energy-constrained environment, their low-power operations in combination with efficiently sourcing energy to them are key problems to extend device life. This research proposes novel circuit techniques for two essential functions of a power receiving unit (PRU) in the energy-constrained environment, which are power management and signal processing. The first part of this dissertation discusses power management integrated circuits for a PRU. From a power management perspective, the most critical two circuit blocks are a front-end rectifier and a battery charger. The front-end CMOS active rectifier converts transmitted AC power into DC power. High power conversion efficiency (PCE) is required to reduce power loss during the power transfer, and high voltage conversion ratio (VCR) is required for the rectifier to enable low-voltage operations. The proposed 13.56-MHz CMOS active rectifier presents low-power circuit techniques for comparators and controllers to reduce increasing power loss of an active diode with offset/delay calibration. It is implemented with 5-V devices of a 0.35 µm CMOS process to support high voltage. A peak PCE of 89.0%, a peak VCR of 90.1%, and a maximum output power of 126.7 mW are measured for 200Ω loading. The linear battery charger stores the converted DC power into a battery. Since even small power saving can be enough to run the low-power PRU, a battery charger with low IvQ is desirable. The presented battery charger is based on a single amplifier for regulation and the charging phase transition from the constant-current (CC) phase to the constant-voltage (CV) phase. The proposed unified amplifier is based on stacked differential pairs which share the bias current. Its current-steering property removes multiple amplifiers for regulation and the CC-CV transition, and achieves high unity-gain loop bandwidth for fast regulation. The charger with the maximum charging current of 25 mA is implemented in 0.35 µm CMOS. A peak charger efficiency of 94% and average charger efficiency of 88% are achieved with an 80-mAh Li-ion polymer battery. The second part of this dissertation focuses on analog-to-digital converters (ADCs). From a signal processing perspective, an ADC is one of the most important circuit blocks in the PRU. Hence, an energy-efficient ADC is essential in the energy-constrained environment. A pipelined successive approximation register (SAR) ADC has good energy efficiency in a design space of moderate-to-high speeds and resolutions. Process-Voltage-Temperature variations of a dynamic amplifier in the pipelined-SAR ADC is a key design issue. This research presents two dynamic amplifier architectures for temperature compensation. One is based on a voltage-to-time converter (VTC) and a time-to-voltage converter (TVC), and the other is based on a temperature-dependent common-mode detector. The former amplifier is adopted in a 13-bit 10-50 MS/s subranging pipelined-SAR ADC fabricated in 0.13-µm CMOS. The ADC can operate under the power supply voltage of 0.8-1.2 V. Figure-of-Merits (FoMs) of 4-11.3 fJ/conversion-step are achieved. The latter amplifier is also implemented in 0.13-µm CMOS, consuming 0.11 mW at 50 MS/s. Its measured gain variation is 2.1% across the temperature range of -20°C to 85 °C

Utilizing digital design techniques and circuits to improve energy and design efficiency of analog and mixed-signal circuits

Technology scaling has long driven large growth in the electronics market. With each successive technology generation, digital circuits become more power and area efficient. The large performance increases realized for digital circuits due to digital scaling have not translated to similar performance improvements for analog circuits. First, noise-limited analog circuits are not capable of leveraging the reduced parasitics of advanced processes, since capacitor sizes are generally set by noise requirements. Second, analog circuit performance is closely tied to the achievable device intrinsic gain, which degrades as process sizes shrink. Reduced supply voltages further exacerbate this issue, as the achievable gain per stage is limited by the number of devices that can be stacked while maintaining all devices in saturation. Finally, process variation increases with decreased feature sizes, so analog circuits have deal with increased mismatch and wider variations in threshold voltages, increasing the time required to design a circuit that is robust across process, voltage, and temperature (PVT) variation. This work seeks to address the limitations of analog circuits in advanced technologies by leveraging digital techniques and digital-like circuits that offer improved scalability. The first half of this dissertation investigates replacing the traditional closed-loop residue amplifier in a pipeline analog-to-digital converter (ADC) with an open loop dynamic amplifier. Previous works incorporating dynamic amplifiers have struggled to achieve large gains and have suffered from offset mismatch between the comparator and amplifier, which will only get worse in more advanced technologies. We propose the usage of a residue amplifier that combines an integration stage, to ensure low noise operation, with a positive feedback stage, to ensure high gain and high speed operation. By utilizing this topology, the proposed amplifier was the first dynamic amplifier to achieve a high gain of 32. Additionally, the proposed amplifier can reuse existing comparator hardware in the ADC, removing all offset mismatch between comparator and amplifier. Digital calibration techniques were applied to ensure a constant gain across PVT. The next part of this dissertation tries to overcome the scaling challenges for noise-limited ADCs with band-limited input signals. By leveraging digital filtering techniques to generate a prediction of the band-limited signal, the conversion can be limited to a range that is a fraction of the total ADC input range, allowing for significant decreases in reference and comparator power consumption. This work extends previous works by enabling accurate predictions for any band-limited signal characteristic. Previous works only focused on accurate predictions for low-activity signals. Finally, the large compute power enabled by modern technology scaling is leveraged to improve the design efficiency of analog circuits. A new automated circuit sizing tool is proposed that can achieve better performance than manual designs done by experts in a much shorter amount of time. All of these techniques help to alleviate the power and design efficiency limitations caused by technology scaling.Electrical and Computer Engineerin

Calibration techniques in nyquist A/D converters

In modern systems signal processing is performed in the digital domain. Contrary to analog circuits, digital signal processing offers more robustness, programmability, error correction and storage possibility. The trend to shift the A/D converter towards the input of the system requires A/D converters with more dynamic range and higher sampling speeds. This puts extreme demands on the A/D converter and potentially increases the power consumption. Calibration Techniques in Nyquist A/D Converters analyses different A/D-converter architectures with an emphasis on the maximum achievable power efficiency. It is shown that in order to achieve high speed and high accuracy at high power efficiency, calibration is required. Calibration reduces the overall power consumption by using the available digital processing capability to relax the demands on critical power hungry analog components. Several calibration techniques are analyzed. The calibration techniques presented in this book are applicable to other analog-to-digital systems, such as those applied in integrated receivers. Further refinements will allow using analog components with less accuracy, which will then be compensated by digital signal processing. The presented methods allow implementing this without introducing a speed or power penalty

High-Speed Analog-to-Digital Converters for Broadband Applications

Flash Analog-to-Digital Converters (ADCs), targeting optical communication standards, have been reported in SiGe BiCMOS technology. CMOS implementation of such designs faces two challenges. The first is to achieve a high sampling speed, given the lower gain-bandwidth (lower ft) of CMOS technology. The second challenge is to handle the wide bandwidth of the input signal with a certain accuracy. Although the first problem can be relaxed by using the time-interleaved architecture, the second problem remains as a main obstacle to CMOS implementation. As a result, the feasibility of the CMOS implementation of ADCs for such applications, or other wide band applications, depends primarily on achieving a very small input capacitance (large bandwidth) at the desired accuracy. In the flash architecture, the input capacitance is traded off for the achievable accuracy. This tradeoff becomes tighter with technology scaling. An effective way to ease this tradeoff is to use resistive offset averaging. This permits the use of smaller area transistors, leading to a reduction in the ADC input capacitance. In addition, interpolation can be used to decrease the input capacitance of flash ADCs. In an interpolating architecture, the number of ADC input preamplifiers is reduced significantly, and a resistor network interpolates the missing zero-crossings needed for an N-bit conversion. The resistive network also averages out the preamplifiers offsets. Consequently, an interpolating network works also as an averaging network. The resistor network used for averaging or interpolation causes a systematic non-linearity at the ADC transfer characteristics edges. The common solution to this problem is to extend the preamplifiers array beyond the input signal voltage range by using dummy preamplifiers. However, this demands a corresponding extension of the flash ADC reference-voltage resistor ladder. Since the voltage headroom of the reference ladder is considered to be a main bottleneck in the implementation of flash ADCs in deep-submicron technologies with reduced supply voltage, extending the reference voltage beyond the input voltage range is highly undesirable. The principal objective of this thesis is to develop a new circuit technique to enhance the bandwidth-accuracy product of flash ADCs. Thus, first, a rigorous analysis of flash ADC architectures accuracy-bandwidth tradeoff is presented. It is demonstrated that the interpolating architecture achieves a superior accuracy compared to that of a full flash architecture for the same input capacitance, and hence would lead to a higher bandwidth-accuracy product, especially in deep-submicron technologies that use low power supplies. Also, the gain obtained, when interpolation is employed, is quantified. In addition, the limitations of a previous claim, which suggests that an interpolating architecture is equivalent to an averaging full flash architecture that trades off accuracy for the input capacitance, is presented. Secondly, a termination technique for the averaging/interpolation network of flash ADC preamplifiers is devised. The proposed technique maintains the linearity of the ADC at the transfer characteristics edges and cancels out the over-range voltage, consumed by the dummy preamplifiers. This makes flash ADCs more amenable for integration in deep-submicron CMOS technologies. In addition, the elimination of this over-range voltage allows a larger least-significant bit. As a result, a higher input referred offset is tolerated, and a significant reductions in the ADC input capacitance and power dissipation are achieved at the same accuracy. Unlike a previous solution, the proposed technique does not introduce negative transconductance at flash ADC preamplifiers array edges. As a result, the offset averaging technique can be used efficiently. To prove the resulting saving in the ADC input capacitance and power dissipation that is attained by the proposed termination technique, a 6-bit 1.6-GS/s flash ADC test chip is designed and implemented in 0.13-$\mu$m CMOS technology. The ADC consumes 180 mW from a 1.5-V supply and achieves a Signal-to-Noise-plus-Distortion Ratio (SNDR) of 34.5 dB and 30 dB at 50-MHz and 1450-MHz input signal frequency, respectively. The measured peak Integral-Non-Linearity (INL) and Differential-Non-Linearity (DNL) are 0.42 LSB and 0.49 LSB, respectively

Design et test pour la haute performance d'un convertisseur A/D basé sur l'architecture "subranging"

Les architectures des convertisseurs A/N -- Un nouveau A/n pour des applications à haute résolution et haute vitesse -- Un commutateur actif en mode courant pour des applications de hautes performances à faibles tensions -- Un nouveau convertisseur A/N "subranging" en mode courant pour des applications à haute vitesse -- Un nouveau BIST numérique intégré pour convertisseurs analogique-numérique

Built-in self test of RF subsystems

textWith the rapid development of wireless and wireline communications, a variety of new standards and applications are emerging in the marketplace. In order to achieve higher levels of integration, RF circuits are frequently embedded into System on Chip (SoC) or System in Package (SiP) products. These developments, however, lead to new challenges in manufacturing test time and cost. Use of traditional RF test techniques requires expensive high frequency test instruments and long test time, which makes test one of the bottlenecks for reducing IC costs. This research is in the area of built-in self test technique for RF subsystems. In the test approach followed in this research, on-chip detectors are used to calculate circuits specifications, and data converters are used to collect the data for analysis by an on-chip processor. A novel on-chip amplitude detector has been designed and optimized for RF circuit specification test. By using on-chip detectors, both the system performance and specifications of the individual components can be accurately measured. On-chip measurement results need to be collected by Analog to Digital Converters (ADCs). A novel time domain, low power ADC has been designed for this purpose. The ADC architecture is based on a linear voltage controlled delay line. Using this structure results in a linear transfer function for the input dependent delay. The time delay difference is then compared to a reference to generate a digital code. Two prototype test chips were fabricated in commercial CMOS processes. One is for the RF transceiver front end with on-chip detectors; the other is for the test ADC. The 940MHz RF transceiver front-end was implemented with on-chip detectors in a 0.18 [micrometer] CMOS technology. The chips were mounted onto RF Printed Circuit Boards (PCBs), with tunable power supply and biasing knobs. The detector was characterized with measurements which show that the detector keeps linear performance over a wide input amplitude range of 500mV. Preliminary simulation and measurements show accurate transceiver performance prediction under process variations. A 300MS/s 6 bit ADC was designed using the novel time domain architecture in a 0.13 [micrometer] standard digital CMOS process. The simulation results show 36.6dB Signal to Noise Ratio (SNR), 34.1dB Signal to Noise and Distortion Ratio (SNDR) for 99MHz input, Differential Non-Linearity (DNL)<0.2 Least Significant Bit (LSB), and Integral Non-Linearity (INL)<0.5LSB. Overall chip power is 2.7mW with a 1.2V power supply. The built-in detector RF test was extended to a full transceiver RF front end test with a loop-back setup, so that measurements can be made to verify the benefits of the technique. The application of the approach to testing gain, linearity and noise figure was investigated. New detector types are also evaluated. In addition, the low-power delay-line based ADC was characterized and improved to facilitate gathering of data from the detector. Several improved ADC structures at the system level are also analyzed. The built-in detector based RF test technique enables the cost-efficient test for SoCs.Electrical and Computer Engineerin

Circuit techniques for low-voltage and high-speed A/D converters

The increasing digitalization in all spheres of electronics applications, from telecommunications systems to consumer electronics appliances, requires analog-to-digital converters (ADCs) with a higher sampling rate, higher resolution, and lower power consumption. The evolution of integrated circuit technologies partially helps in meeting these requirements by providing faster devices and allowing for the realization of more complex functions in a given silicon area, but simultaneously it brings new challenges, the most important of which is the decreasing supply voltage. Based on the switched capacitor (SC) technique, the pipelined architecture has most successfully exploited the features of CMOS technology in realizing high-speed high-resolution ADCs. An analysis of the effects of the supply voltage and technology scaling on SC circuits is carried out, and it shows that benefits can be expected at least for the next few technology generations. The operational amplifier is a central building block in SC circuits, and thus a comparison of the topologies and their low voltage capabilities is presented. It is well-known that the SC technique in its standard form is not suitable for very low supply voltages, mainly because of insufficient switch control voltage. Two low-voltage modifications are investigated: switch bootstrapping and the switched opamp (SO) technique. Improved circuit structures are proposed for both. Two ADC prototypes using the SO technique are presented, while bootstrapped switches are utilized in three other prototypes. An integral part of an ADC is the front-end sample-and-hold (S/H) circuit. At high signal frequencies its linearity is predominantly determined by the switches utilized. A review of S/H architectures is presented, and switch linearization by means of bootstrapping is studied and applied to two of the prototypes. Another important parameter is sampling clock jitter, which is analyzed and then minimized with carefully-designed clock generation and buffering. The throughput of ADCs can be increased by using parallelism. This is demonstrated on the circuit level with the double-sampling technique, which is applied to S/H circuits and a pipelined ADC. An analysis of nonidealities in double-sampling is presented. At the system level parallelism is utilized in a time-interleaved ADC. The mismatch of parallel signal paths produces errors, for the elimination of which a timing skew insensitive sampling circuit and a digital offset calibration are developed. A total of seven prototypes are presented: two double-sampled S/H circuits, a time-interleaved ADC, an IF-sampling self-calibrated pipelined ADC, a current steering DAC with a deglitcher, and two pipelined ADCs employing the SO technique.reviewe

Digital Background Self-Calibration Technique for Compensating Transition Offsets in Reference-less Flash ADCs

This Dissertation focusses on proving that background calibration using adaptive algorithms are low-cost, stable and effective methods for obtaining high accuracy in flash A/D converters. An integrated reference-less 3-bit flash ADC circuit has been successfully designed and taped out in UMC 180 nm CMOS technology in order to prove the efficiency of our proposed background calibration. References for ADC transitions have been virtually implemented built-in in the comparators dynamic-latch topology by a controlled mismatch added to each comparator input front-end. An external very simple DAC block (calibration bank) allows control the quantity of mismatch added in each comparator front-end and, therefore, compensate the offset of its effective transition with respect to the nominal value. In order to assist to the estimation of the offset of the prototype comparators, an auxiliary A/D converter with higher resolution and lower conversion speed than the flash ADC is used: a 6-bit capacitive-DAC SAR type. Special care in synchronization of analogue sampling instant in both ADCs has been taken into account. In this thesis, a criterion to identify the optimum parameters of the flash ADC design with adaptive background calibration has been set. With this criterion, the best choice for dynamic latch architecture, calibration bank resolution and flash ADC resolution are selected. The performance of the calibration algorithm have been tested, providing great programmability to the digital processor that implements the algorithm, allowing to choose the algorithm limits, accuracy and quantization errors in the arithmetic. Further, systematic controlled offset can be forced in the comparators of the flash ADC in order to have a more exhaustive test of calibration