Concepts and methods in optimization of integrated LC VCOs

Underlying physical mechanisms controlling the noise properties of oscillators are studied. This treatment shows the importance of inductance selection for oscillator noise optimization. A design strategy centered around an inductance selection scheme is executed using a practical graphical optimization method to optimize phase noise subject to design constraints such as power dissipation, tank amplitude, tuning range, startup condition, and diameters of spiral inductors. The optimization technique is demonstrated through a design example, leading to a 2.4-GHz fully integrated, LC voltage-controlled oscillator (VCO) implemented using 0.35-μm MOS transistors. The measured phase-noise values are -121, -117, and -115 dBc/Hz at 600-kHz offset from 1.91, 2.03, and 2.60-GHz carriers, respectively. The VCO dissipates 4 mA from a 2.5-V supply voltage. The inversion mode MOSCAP tuning is used to achieve 26% of tuning range. Two figures of merit for performance comparison of various oscillators are introduced and used to compare this work to previously reported results

A Robust 43-GHz VCO in CMOS for OC-768 SONET Applications

In this paper, we present a 43-GHz LC-VCO in 0.13-/spl mu/m CMOS for use in SONET OC-768 optical networks. A tuned output buffer is used to provide 1.3 V/sub p-p/ (single-ended) into a 90-fF capacitive load as is required when the VCO is used in typical clock and data recovery (CDR) circuits. Phase noise is -90 dBc/Hz at a 1-MHz offset from the carrier; this meets SONET jitter specifications. The design has a tune range of 4.2%. The VCO, including output buffers, consumes 14 mA from a 1-V supply and occupies 0.06 mm/sup 2/ of die area. Modern CMOS process characteristics and the high center frequency of this design mean that the tank loss is not dominated by the integrated inductor, but rather by the tank capacitance. An area-efficient inductor design that does not require any optimization is used

Low power low voltage quadrature RC oscillators for modern RF receivers

Dissertação apresentada na Faculdade de Ciências e Tecnologia da Universidade Nova de Lisboa para a obtenção do grau de Mestre em Engenharia Electrotécnica e de ComputadoresThis thesis proposes a study of three different RC oscillators, two relaxation and a ring oscillator. All the circuits are implemented using UMC 130 nm CMOS technology with a supply voltage of 1.2 V. We present a wideband MOS current/voltage controlled quadrature oscillator constituted by two multivibrators. Two different forms of coupling named, soft (traditional)and hard (proposed) are differentiated and investigated. It is found that hard coupling reduces the quadrature error and results in a low phase-noise (about 2 dB improvement) with respect to soft coupling. The behaviour of the singular and coupled multivibrators is investigated, when an external synchronizing harmonic is applied. We introduce a new RC relaxation oscillator with pulse self biasing, to reduce power consumption, and with harmonic ltering and resistor feedback, to reduce phase-noise. The designed circuit has a very low phase-noise, -132.6 dBc/Hz @ 10 MHz offset, and the power consumption is only 1 mW, which leads to a gure of merit (FOM) of -159.1 dBc/Hz. The nal circuit is a two integrator fully implemented in CMOS technology, with low power consumption. The respective layout is made and occupies a total area of5.856x10-3 mm2, post-layout simulation is also done

A New Low-Power CMOS Quadrature VCO with Current Reused Structure

A new quadrature voltage controlled oscillator (QVCO) circuit topology is proposed for low-voltage and low-power applications. In the proposed circuit, two oscillators with current-reused structure are coupled to each other by two P&N-MOS pairs. In this way, low phase noise quadrature signals are generated with low-voltage and low-power. The simulation is made by Cadence in chartered 0.18 μm CMOS process. The simulation result shows that the QVCO phase noise is approximately - 117.1 dBc/Hz at 1MHz offset from 1.8 GHz operation frequency. The QVCO dissipates 1.92 mW with a 1.1 V supply voltage

Design And Implementation Of Up-Conversion Mixer And Lc-Quadrature Oscillator For IEEE 802.11a WLAN Transmitter Application Utilizing 0.18 Pm CMOS Technology [TK7871.99.M44 H279 2008 f rb].

Perlumbaan implementasi litar terkamil radio, dengan kos yang rendah telah menggalakkan penggunaan teknologi CMOS. The drive for cost reduction has led to the use of CMOS technology for highly integrated radios

Receiver Front-Ends in CMOS with Ultra-Low Power Consumption

Historically, research on radio communication has focused on improving range and data rate. In the last decade, however, there has been an increasing demand for low power and low cost radios that can provide connectivity with small devices around us. They should be able to offer basic connectivity with a power consumption low enough to function extended periods of time on a single battery charge, or even energy scavenged from the surroundings. This work is focused on the design of ultra-low power receiver front-ends intended for a receiver operating in the 2.4GHz ISM band, having an active power consumption of 1mW and chip area of 1mm². Low power consumption and small size make it hard to achieve good sensitivity and tolerance to interference. This thesis starts with an introduction to the overall receiver specifications, low power radio and radio standards, front-end and LO generation architectures and building blocks, followed by the four included papers. Paper I demonstrates an inductorless front-end operating at 915MHz, including a frequency divider for quadrature LO generation. An LO generator operating at 2.4GHz is shown in Paper II, enabling a front-end operating above 2GHz. Papers III and IV contain circuits with combined front-end and LO generator operating at or above the full 2.45GHz target frequency. They use VCO and frequency divider topologies that offer efficient operation and low quadrature error. An efficient passive-mixer design with improved suppression of interference, enables an LNA-less design in Paper IV capable of operating without a SAW-filter

Design of a tunable multi-band differential LC VCO using 0.35 mu m SiGe BiCMOS technology for multi-standard wireless communication systems

In this paper, an integrated 2.2-5.7GHz multi-band differential LC VCO for multi-standard wireless communication systems was designed utilizing 0.35 mu m SiGe BiCMOS technology. The topology, which combines the switching inductors and capacitors together in the same circuit, is a novel approach for wideband VCOs. Based on the post-layout simulation results, the VCO can be tuned using a DC voltage of 0 to 3.3 V for 5 different frequency bands (2.27-2.51 GHz, 2.48-2.78 GHz, 3.22-3.53 GHz, 3.48-3.91 GHz and 4.528-5.7 GHz) with a maximum bandwidth of 1.36 GHz and a minimum bandwidth of 300 MHz. The designed and simulated VCO can generate a differential output power between 0.992 and -6.087 dBm with an average power consumption of 44.21 mW including the buffers. The average second and third harmonics level were obtained as -37.21 and -47.6 dBm, respectively. The phase noise between -110.45 and -122.5 dBc/Hz, that was simulated at 1 MHz offset, can be obtained through the frequency of interest. Additionally, the figure of merit (FOM), that includes all important parameters such as the phase noise, the power consumption and the ratio of the operating frequency to the offset frequency, is between -176.48 and -181.16 and comparable or better than the ones with the other current VCOs. The main advantage of this study in comparison with the other VCOs, is covering 5 frequency bands starting from 2.27 up to 5.76 GHz without FOM and area abandonment. Output power of the fundamental frequency changes between -6.087 and 0.992 dBm, depending on the bias conditions (operating bands). Based on the post-layout simulation results, the core VCO circuit draws a current between 2.4-6.3 mA and between 11.4 and 15.3 mA with the buffer circuit from 3.3 V supply. The circuit occupies an area of 1.477 mm(2) on Si substrate, including DC, digital and RF pads