Wideband 67-116 GHz cryogenic receiver development for ALMA Band 2

The Atacama Large Millimeter/sub-millimeter Array (ALMA) is already revolutionising our understanding of the Universe. However, ALMA is not yet equipped with all of its originally planned receiver bands, which will allow it to observe over the full range of frequencies from 35-950 GHz accessible through the Earth's atmosphere. In particular Band 2 (67-90 GHz) has not yet been approved for construction. Recent technological developments in cryogenic monolithic microwave integrated circuit (MMIC) high electron mobility transistor (HEMT) amplifier and orthomode transducer (OMT) design provide an opportunity to extend the originally planned on-sky bandwidth, combining ALMA Bands 2 and 3 into one receiver cartridge covering 67-116 GHz. The IF band definition for the ALMA project took place two decades ago, when 8 GHz of on-sky bandwidth per polarisation channel was an ambitious goal. The new receiver design we present here allows the opportunity to expand ALMA's wideband capabilities, anticipating future upgrades across the entire observatory. Expanding ALMA's instantaneous bandwidth is a high priority, and provides a number of observational advantages, including lower noise in continuum observations, the ability to probe larger portions of an astronomical spectrum for, e.g., widely spaced molecular transitions, and the ability to scan efficiently in frequency space to perform surveys where the redshift or chemical complexity of the object is not known a priori. Wider IF bandwidth also reduces uncertainties in calibration and continuum subtraction that might otherwise compromise science objectives. Here we provide an overview of the component development and overall design for this wideband 67-116 GHz cryogenic receiver cartridge, designed to operate from the Band 2 receiver cartridge slot in the current ALMA front end receiver cryostat.Comment: 8 pages, proceedings from the 8th ESA Workshop on Millimetre-Wave Technology and Applications (https://atpi.eventsair.com/QuickEventWebsitePortal/millimetre-wave/mm-wave

HIGH PERFORMANCE CMOS WIDE-BAND RF FRONT-END WITH SUBTHRESHOLD OUT OF BAND SENSING

In future, the radar/satellite wireless communication devices must support multiple standards and should be designed in the form of system-on-chip (SoC) so that a significant reduction happen on cost, area, pins, and power etc. However, in such device, the design of a fully on-chip CMOS wideband receiver front-end that can process several radar/satellite signal simultaneously becomes a multifold complex problem. Further, the inherent high-power out-of-band (OB) blockers in radio spectrum will make the receiver more non-linear, even sometimes saturate the receiver. Therefore, the proper blocker rejection techniques need to be incorporated. The primary focus of this research work is the development of a CMOS high-performance low noise wideband receiver architecture with a subthreshold out of band sensing receiver. Further, the various reconfigurable mixer architectures are proposed for performance adaptability of a wideband receiver for incoming standards. Firstly, a high-performance low- noise bandwidthenhanced fully differential receiver is proposed. The receiver composed of a composite transistor pair noise canceled low noise amplifier (LNA), multi-gate-transistor (MGTR) trans-conductor amplifier, and passive switching quad followed by Tow Thomas bi-quad second order filter based tarns-impedance amplifier. An inductive degenerative technique with low-VT CMOS architecture in LNA helps to improve the bandwidth and noise figure of the receiver. The full receiver system is designed in UMC 65nm CMOS technology and measured. The packaged LNA provides a power gain 12dB (including buffer) with a 3dB bandwidth of 0.3G – 3G, noise figure of 1.8 dB having a power consumption of 18.75mW with an active area of 1.2mm*1mm. The measured receiver shows 37dB gain at 5MHz IF frequency with 1.85dB noise figure and IIP3 of +6dBm, occupies 2mm*1.2mm area with 44.5mW of power consumption. Secondly, a 3GHz-5GHz auxiliary subthreshold receiver is proposed to estimate the out of blocker power. As a redundant block in the system, the cost and power minimization of the auxiliary receiver are achieved via subthreshold circuit design techniques and implementing the design in higher technology node (180nm CMOS). The packaged auxiliary receiver gives a voltage gain of 20dB gain, the noise figure of 8.9dB noise figure, IIP3 of -10dBm and 2G-5GHz bandwidth with 3.02mW power consumption. As per the knowledge, the measured results of proposed main-high-performancereceiver and auxiliary-subthreshold-receiver are best in state of art design. Finally, the various viii reconfigurable mixers architectures are proposed to reconfigure the main-receiver performance according to the requirement of the selected communication standard. The down conversion mixers configurability are in the form of active/passive and Input (RF) and output (IF) bandwidth reconfigurability. All designs are simulated in 65nm CMOS technology. To validate the concept, the active/ passive reconfigurable mixer configuration is fabricated and measured. Measured result shows a conversion gain of 29.2 dB and 25.5 dB, noise figure of 7.7 dB and 10.2 dB, IIP3 of -11.9 dBm and 6.5 dBm in active and passive mode respectively. It consumes a power 9.24mW and 9.36mW in passive and active case with a bandwidth of 1 to 5.5 GHz and 0.5 to 5.1 GHz for active/passive case respectively

High performance building blocks for wireless receiver: multi-stage amplifiers and low noise amplifiers

Different wireless communication systems utilizing different standards and for multiple applications have penetrated the normal people's life, such as Cell phone, Wireless LAN, Bluetooth, Ultra wideband (UWB) and WiMAX systems. The wireless receiver normally serves as the primary part of the system, which heavily influences the system performance. This research concentrates on the designs of several important blocks of the receiver; multi-stage amplifier and low noise amplifier. Two novel multi-stage amplifier typologies are proposed to improve the bandwidth and reduce the silicon area for the application where a large capacitive load exists. They were designed using AMI 0.5 m µ CMOS technology. The simulation and measurement results show they have the best Figure-of-Merits (FOMs) in terms of small signal and large signal performances, with 4.6MHz and 9MHz bandwidth while consuming 0.38mW and 0.4mW power from a 2V power supply. Two Low Noise Amplifiers (LNAs) are proposed, with one designed for narrowband application and the other for UWB application. A noise reduction technique is proposed for the differential cascode Common Source LNA (CS-LNA), which reduces the LNA Noise Figure (NF), increases the LNA gain, and improves the LNA linearity. At the same time, a novel Common Gate LNA (CG-LNA) is proposed for UWB application, which has better linearity, lower power consumption, and reasonable noise performance. Finally a novel practical current injection built-in-test (BIT) technique is proposed for the RF Front-end circuits. If the off-chip component Lg and Rs values are well controlled, the proposed technique can estimate the voltage gain of the LNA with less than 1dB (8%) error

Application and design manual for High Performance RF products

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Versatile integrated circuit for the acquisition of biopotentials

Journal ArticleElectrically active cells in the body produce a wide variety of voltage signals that are useful for medical diagnosis and scientific investigation. These biopotentials span a wide range of amplitudes and frequencies. We have developed a versatile front-end integrated circuit that can be used to amplify many types of bioelectrical signals. The 0.6-μm CMOS chip contains 16 fully-differential amplifiers with gains of 46 dB, 2μVrms input-referred noise, and bandwidths programmable from 10Hz to 10kHz

Design of Power-Efficient Optical Transceivers and Design of High-Linearity Wireless Wideband Receivers

The combination of silicon photonics and advanced heterogeneous integration is promising for next-generation disaggregated data centers that demand large scale, high throughput, and low power. In this dissertation, we discuss the design and theory of power-efficient optical transceivers with System-in-Package (SiP) 2.5D integration. Combining prior arts and proposed circuit techniques, a receiver chip and a transmitter chip including two 10 Gb/s data channels and one 2.5 GHz clocking channel are designed and implemented in 28 nm CMOS technology. An innovative transimpedance amplifier (TIA) and a single-ended to differential (S2D) converter are proposed and analyzed for a low-voltage high-sensitivity receiver; a four-to-one serializer, programmable output drivers, AC coupling units, and custom pads are implemented in a low-power transmitter; an improved quadrature locked loop (QLL) is employed to generate accurate quadrature clocks. In addition, we present an analysis for inverter-based shunt-feedback TIA to explicitly depict the trade-off among sensitivity, data rate, and power consumption. At last, the research on CDR-based​ clocking schemes for optical links is also discussed. We introduce prior arts and propose a power-efficient clocking scheme based on an injection-locked phase rotator. Next, we analyze injection-locked ring oscillators (ILROs) that have been widely used for quadrature clock generators (QCGs) in multi-lane optical or wireline transceivers due to their low power, low area, and technology scalability. The asymmetrical or partial injection locking from 2 phases to 4 phases results in imbalances in amplitude and phase. We propose a modified frequency-domain analysis to provide intuitive insight into the performance design trade-offs. The analysis is validated by comparing analytical predictions with simulations for an ILRO-based QCG in 28 nm CMOS technology. This dissertation also discusses the design of high-linearity wireless wideband receivers. An out-of-band (OB) IM3 cancellation technique is proposed and analyzed. By exploiting a baseband auxiliary path (AP) with a high-pass feature, the in-band (IB) desired signal and out-of-band interferers are split. OB third-order intermodulation products (IM3) are reconstructed in the AP and cancelled in the baseband (BB). A 0.5-2.5 GHz frequency-translational noise-cancelling (FTNC) receiver is implemented in 65nm CMOS to demonstrate the proposed approach. It consumes 36 mW without cancellation at 1 GHz LO frequency and 1.2 V supply, and it achieves 8.8 MHz baseband bandwidth, 40dB gain, 3.3dB NF, 5dBm OB IIP3, and −6.5dBm OB B1dB. After IM3 cancellation, the effective OB-IIP3 increases to 32.5 dBm with an extra 34 mW for narrow-band interferers (two tones). For wideband interferers, 18.8 dB cancellation is demonstrated over 10 MHz with two −15 dBm modulated interferers. The local oscillator (LO) leakage is −92 dBm and −88 dB at 1 GHz and 2 GHz LO respectively. In summary, this technique achieves both high OB linearity and good LO isolation

Characterisation of on-chip electrostatic discharge waveforms with sub-nanosecond resolution: design of a differential high voltage probe with high bandwidth

Bliksem werd tot aan de ontdekking van de bliksemafleider (18e eeuw) gezien als een van de gevaarlijkste bedreigingen voor het stadsleven. Door het gebruik van micro-elektronica werden ingenieurs gewaar dat ditzelfde fysische verschijnsel, elektrostatische ontlading of ESD genoemd, zich ook op microscopische schaal voordoet. In de jaren zeventig was meer dan 30% van al het chipfalen te wijten aan ESD. Om dit tegen te gaan werd met het onderzoek naar ESD-protecties en -meetsystemen aangevangen. Om meer informatie over het gedrag van een ESD-protectie te verkrijgen wordt een ESD-puls op dit systeem losgelaten. Het antwoord van de protectie op deze puls wordt dan bepaald m.b.v. spannings- en stroomgolfvormmetingen. In dit werk wordt een nieuwe nauwkeurige ESD-golfvormmeettechniek voorgesteld die directe metingen op protecties kan uitvoeren. De karakterisering van ESD-golfvormen op chip wordt enorm bemoeilijkt door de grote hoeveelheid elektromagnetische interferentie die de ESD-puls veroorzaakt. Dit wordt omzeild door het gewenste signaal naar een veilige omgeving te transporteren, waar een standaard meettoestel de meting kan uitvoeren. Dit transport wordt gerealiseerd m.b.v. optische communicatie, wat immuun is voor elektromagnetische interferentie. Zo kan nauwkeurige in-situ-informatie worden verkregen waarmee de ESD-protecties in de toekomst verbeterd kunnen worden.Up to the 18th century, lightning was considered one of nature’s most dangerous threats in city life. This all ended with the lightning rod, protecting thousands of homes during lightning storms. The large-scale use of microelectronics has made engineers aware of the same physical phenomenon occuring on a microscopic scale. This phenomenon is called electrostatic discharge or ESD. In the seventies, more than 30% of all chip failure was attributed to static electricity. To counter this effect, the research for on-chip ESD protections was born. Today ESD is a buzzing line of research, as with new and faster chip technologies comes a higher ESD vulnerability. This makes ESD protection and measurement increasingly important. Although ESD is now a major subject in chip design, it copes with a lack of accurate device models. To gain more information on the exact operation of an ESD protection, an ESD pulse is unleashed upon this device. The response of the protection on this pulse is then assessed by performing voltage or current waveform measurements. This work presents a waveform measurement technique able to accurately perform direct measurements on the ESD protection. Due to the high amount of electromagnetic interference caused by the ESD pulse, direct waveform characterisation near the protection is hard. This is solved by transporting the target signal into a clean area, where the measurement is performed by standard lab equipment. The key is that this transportation is realized by means of optical communication, which is immune to electromagnetic interference. This way, accurate in situ information can be used to protect tomorrow’s chips

Wideband Watt-Level Spatial Power-Combined Power Amplifier in SiGe BiCMOS Technology for Efficient mm-Wave Array Transmitters

The continued demand for high-speed wireless communications is driving the development of integrated high-power transmitters at millimeter wave (mm-Wave) frequencies. Si-based technologies allow achieving a high level of integration but usually provide insufficient generated RF power to compensate for the increased propagation and material losses at mm-Wave bands due to the relatively low breakdown voltage of their devices. This problem can be reduced significantly if one could combine the power of multiple active devices on each antenna element. However, conventional on-chip power combining networks have inherently high insertion losses reducing transmitter efficiency and limiting its maximum achievable output power.This work presents a non-conventional design approach for mm-Wave Si-based Watt-level power amplifiers that is based on novel power-combining architecture, where an array of parallel custom PA-cells suited on the same chip is interfaced to a single substrate integrated waveguide (to be a part of an antenna element). This allows one to directly excite TEm0 waveguide modes with high power through spatial power combining functionality, obviating the need for intermediate and potentially lossy on-chip power combiners. The proposed solution offers wide impedance bandwidth (50%) and low insertion losses (0.4 dB), which are virtually independent from the number of interfaced PA-cells. The work evaluates the scalability bounds of the architecture as well as discusses the critical effects of coupled non-identical PA-cells, which are efficiently reduced by employing on-chip isolation load resistors.The proposed architecture has been demonstrated through an example of the combined PA with four differential cascode PA-cells suited on the same chip, which is flip-chip interconnected to the combiner placed on a laminate. This design is implemented in a 0.25 um SiGe BiCMOS technology. The PA-cell has a wideband performance (38.6%) with both high peak efficiency (30%) and high saturated output power (24.9 dBm), which is the highest reported output power level obtained without the use of circuit-level power combining in Si-based technologies at Ka-band. In order to achieve the optimal system-level performance of the combined PA, an EM-circuit-thermal optimization flow has been proposed, which accounts for various multiphysics effects occurring in the joint structure. The final PA achieves the peak PAE of 26.7% in combination with 30.8 dBm maximum saturated output power, which is the highest achievable output power in practical applications, where the 50-Ohms load is placed on a laminate. The high efficiency (>20%) and output power (>29.8 dBm) over a wide frequency range (30%) exceed the state-of-the-art in Si-based PAs