Design of Touch Screen Controller IC for Transparent Fingerprint Sensor

Department of Electrical EngineeringA design of system architecture and analog-front-end (AFE) with high SNR and high frame rate for mutual capacitive touch screen with multiple electrodes is presented. Firstly, a differential continuous-mode parallel operation architecture (DCPA) is proposed for large-sized TSP. The proposed architecture achieves a high product of signal-to-noise ratio (SNR) and frame rate, which is a requirement of ROIC for large-sized TSP. DCPA is accomplished by using the proposed differential sensing method with a parallel architecture in a continuous-mode. A continuous-type differential charge amplifier removes the common-mode noise component, and reduces the self-noise by the band-pass filtering effect of the continuous-mode charge amplifier. In addition, the differential parallel architecture cancels the timing skew problem caused by the continuous-mode parallel operation and effectively enhances the power spectrum density of the signal. The proposed ROIC was fabricated using a 0.18-um CMOS process and occupied an active area of 1.25 mm2. The proposed system achieved a 72 dB SNR and 240 Hz frame rate with a 32 channel TX by 10 channel RX mutual capacitive TSP. Moreover, the proposed differential-parallel architecture demonstrated higher immunity to lamp noise and display noise. The proposed system consumed 42.5 mW with a 3.3-V supply. Secondly, readout IC (ROIC) with a differential coded multiple signaling method (DCMS) is proposed to detect an atto-farad capacitance difference for fingerprint recognition in fingerprint TSP. A readout IC with high SNR and fast frame rate are required in the fingerprint recognition. However, the capacitance difference by the ridge and valley of the fingerprint is very small, so that the signal-to-noise ratio is very low. In addition, it takes long time to scan whole fingerprint TSP with multiple electrodes. A fully differential architecture with differential signaling is proposed to detect the low capacitance difference in fingerprint TSP. The internal noise generated is minimized by 2nd fully differential operational amplifier and external noise is eliminated by a lock-in sensing structure. In addition, DCMS reduces an AC offset and enhances a higher product of SNR and frame rate in multiple channels. The proposed architectures can distinguish a 50-atto-farad which is a capacitance difference resulted from the ridges and valley of the finger under the 0.3T glass. The total scan time for 42 ?? 42 fingerprint TSP is less than 21 ms and the power consumption is below 20 mW at 3.3 V supply voltage. IC has been fabricated using a 0.18 ??m standard CMOS process.ope

Integrated Circuits and Systems for Smart Sensory Applications

Connected intelligent sensing reshapes our society by empowering people with increasing new ways of mutual interactions. As integration technologies keep their scaling roadmap, the horizon of sensory applications is rapidly widening, thanks to myriad light-weight low-power or, in same cases even self-powered, smart devices with high-connectivity capabilities. CMOS integrated circuits technology is the best candidate to supply the required smartness and to pioneer these emerging sensory systems. As a result, new challenges are arising around the design of these integrated circuits and systems for sensory applications in terms of low-power edge computing, power management strategies, low-range wireless communications, integration with sensing devices. In this Special Issue recent advances in application-specific integrated circuits (ASIC) and systems for smart sensory applications in the following five emerging topics: (I) dedicated short-range communications transceivers; (II) digital smart sensors, (III) implantable neural interfaces, (IV) Power Management Strategies in wireless sensor nodes and (V) neuromorphic hardware

Approaches to Building a Quantum Computer Based on Semiconductors

Throughout this Ph.D., the quest to build a quantum computer has accelerated, driven by ever-improving fidelities of conventional qubits and the development of new technologies that promise topologically protected qubits with the potential for lifetimes that exceed those of comparable conventional qubits. As such, there has been an explosion of interest in the design of an architecture for a quantum computer. This design would have to include high-quality qubits at the bottom of the stack, be extensible, and allow the layout of many qubits with scalable methods for readout and control of the entire device. Furthermore, the whole experimental infrastructure must handle the requirements for parallel operation of many qubits in the system. Hence the crux of this thesis: to design an architecture for a semiconductor-based quantum computer that encompasses all the elements that would be required to build a large scale quantum machine, and investigate the individual these elements at each layer of this stack, from qubit to readout to control

A nano-tensile testing system for studying nanostructures inside an electron microscope:design, characterization and application

Mechanical properties of nanostructures could be remarkably different from their bulk counterparts owing to scale effects, which have attracted considerable research interest in recent years. However, nanomechanics studies are hindered by the difficulties of conducting well-instrumented mechanical testing. The objective of this thesis is to develop a novel tensile stage that can be used to probe mechanical properties of universal one-dimensional (1D) nanostructures, like nanowires and nanotubes, inside a scanning/transmission electron microscope (SEM/TEM). The main challenges of performing tensile tests at the nanoscale are: (1) specimen alignment and fixation on the tensile stage; (2) application and measurement of tensile force with nano-Newton resolution; (3) measurement of specimen elongation with nanometer resolution. Previous studies have shown that micro-electromechanical system (MEMS) technology combined with advanced microscopy (e.g. SEM and TEM) provides promising perspectives to address these challenges. Two types of nano-tensile stages, fabricated in a silicon on insulator (SOI) wafer, were developed in this thesis, which consisted of a comb-drive actuator and either a differential capacitive force sensor or a double clamped beam force sensor. The optimized comb-drive actuators could output an in-plane force of about 210 µN at a drive voltage of 120 V, and the force sensors achieved resolutions of better than 50 nN. Individual 1D nanostructures were placed on the MEMS device by in-situ nanomanipulations and fixed at their two ends via focused electron beam induced deposition (FEBID). A strategy of modifying device topography, e.g. in the form of trenches or pillars, was proposed to facilitate the specimen preparation by in-situ manipulation that could achieve a high yield of about 80%. The mechanical testing function of the developed micro devices was demonstrated by tensile tests on individual Co and Si nanowires (NWs) inside an SEM. The average apparent Young's modulus, tensile strength and fracture strain of the electrochemically deposited Co NWs were measured to be (75.3±14.6) GPa, (1.6±0.4) GPa and (2.2±0.6) %, respectively. The measured Young's modulus is significantly lower than that of Co in the bulk form (209 GPa), which is likely caused by structural defects (e.g. pores) and surface effects (e.g. surface contaminations and surface oxide layers). The phosphorous-doped SiNWs grown bottom up by the vapor-liquid-solid (VLS) technique showed an average Young's modulus of (170.0±2.4) GPa and a tensile strength larger than 8.3 GPa. This finding confirms that materials strength increases as their sizes scale down. The top down electroless chemically etched Si NWs show a tensile strength of 5.4 GPa. The developed MEMS devices and experimental techniques enable an alternative way of in-situ nanomechanical characterization based on electron microscopy. The design methodology and learning presented in this thesis would be useful to develop nano-tensile stages of other configurations with more advanced functions

SiNW-based Biosensors for Profiling Biomarkers in Breast Tumor Tissues

Breast cancer is the most common life-threatening malignancy in women of most developed countries today, with approximately 200,000 new cases diagnosed every year. About 30% of these cases progress to metastatic disease and death. Considering that one-third of these cancer deaths could be decreased if detected and treated early, new strategies for early breast cancer detection are needed to improve the efficacy of current diagnostics. The sensitive analysis of proteins such as breast cancer biomarkers has become the focus of intensive research due to its relevance to tumor diagnosis. However, the state-of-the-art diagnostic tools still lack the level of resolution needed for the detection of biomarkers at the very early stage of the disease, when treatments have more probability of success, and when protein concentration in tumor tissue is still very low. Nanotechnologies have shown great potential for the development of high-sensitive, portable devices for clinical applications. In particular, SiNWs with their unique properties such as the high surface-to-volume ratio and size, combined with the specificity of immune-sensing, are natural candidates for the fabrication of nanosensors. Thanks to their compatibility with conventional CMOS technology, SiNWs have been incorporated in standard FETs. In biosensing, SiNW-FETs have been shown a promising method for the label-free detection of trace amounts of biomolecules. However, detection of Antigen using Antibody immobilized SiNW-FETs is limited by ionic screening effects that reduce the sensor responsiveness and limit their applicability in tumor tissue. Here, we propose novel SiNW-based biosensing strategies with the aim of overcoming current sensitivity limitations of conventional SiNW-FET biosensors for the detection of breast cancer biomarkers in real human samples. Specifically, we address this goal by investigating two different approaches of biosensing. In the first method, we push the sensitivity of SiNW-FETs to their limits by proposing an alternative way of doing sensing in dry conditions. We show that in-air electrical measurements of Ab-Ag binding have the big advantage of increased Debye screening length in non-bulk solutions, and enable highly sensitive and specific measurements in breast tumor extract. Then, we present a completely novel biosensing paradigm that shows, for the first time, the use of memristive effects in fabricated SiNWs for biodetection purposes. This novel detection method has been named Voltage Gap (VoG)-biosensing as it is based on the changes of the VoG parameter, observed in the hysteretic characteristic of memristive devices, as a function of biomolecules. In this research, we demonstrate the use of the memristive-based VoG effect in Schottky Barrier SiNWs for the high-resolution sensing of ionic and biological species both in ideal buffer solutions and in tumor tissue extracts. Moreover, we propose an original theory enabling the physical interpretation and prediction of the mechanisms underlying the VoG-biosensing method in memristive devices. Finally, we demonstrate the potential of our system for future integration in a multi-panel VoG-biosensing platform. We fabricated a PDMS microfluidics enabling selective and high-quality functionalization of the NWs. We also realized a CMOS readout circuit for multiplexed VoG acquisition. The simulations demonstrate the feasibility of the approach and the potential for the integration of the reader with a portable and automated biosensing platform. Microfluidics and VoG reader will enable fast, concurrent detection ofmultiple angiogenic and inflammatory ligands in tumor tissue. This will highly improve the level of knowledge of the cancer disease by capturing the heterogeneity and the complexity of the tumor microenvironment, thus leading to novel opportunities in breast cancer diagnosis

Proceedings of the 2nd Annual Workshop on Meteorological and Environmental Inputs to Aviation Systems

The proceedings of a workshop held at the University of Tennessee Space Institute, Tullahoma, Tennessee, March 28-30, 1978, are reported. The workshop was jointly sponsored by NASA, NOAA, FAA, and brought together many disciplines of the aviation communities in round table discussions. The major objectives of the workshop are to satisfy such needs of the sponsoring agencies as the expansion of our understanding and knowledge of the interactions of the atmosphere with aviation systems, as the better definition and implementation of services to operators, and as the collection and interpretation of data for establishing operational criteria, relating the total meteorological inputs from the atmospheric sciences to the needs of aviation communities

NASA Tech Briefs, June 1995

Topics include: communications technology, electronic components and circuits, electronic systems, physical sciences, materials, computer programs, mechanics, machinery, manufacturing/fabrication, mathematics and information sciences, life sciences, books and reports, a special section of laser Tech Briefs

NASA Tech Briefs, May 1997

Topics covered include: Advanced Composites, Plastics and Metals; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery/Automation; Manufacturing/Fabrication; Mathematics and Information Sciences; Life Sciences; Books and Reports

NASA Tech Briefs, January 1999

Topics include: special coverage sections on sensors and data acquisition and sections on electronic components and circuits, electronic software, materials, mechanics, bio-medical physical sciences, book and reports, and a special section of Photonics Tech Briefs