DESIGN AND ACCOMPLISHMENT OF SLEEP CONVENTION LOGIC WITH HIGH ACCURACY

Sigma-Delta (∑-∆) analog to digital converters are well known for its use in high accuracy wireless communication applications. It is alternative for low power, high resolution (greater than 12 bits) converters, which can be ultimately integrated on digital signal Processor ICs. In this work Over Sampling concept is used to address the problem of power dissipation and noise in ADCs. In this paper a Second order Sigma-Delta Modulator is implemented using CMOS 0.13μm technology using a ±1.2 V power supply. This brief presents a second-order incremental delta–sigma analog-to-digital converter (ADC) for CMOS image sensors (CISs). The ADC that employs a cascade of integrators with a feed forward architecture uses only one operational transconductance amplifier (OTA) by sharing the OTA between the first and second stages of the modulator. Further power and area savings are achieved by using a self-biasing amplifier and the proposed level-shifting technology, which allows active signal summation at the quantize input node without using an additional OTA

Low Power Circuits for Smart Flexible ECG Sensors

Cardiovascular diseases (CVDs) are the world leading cause of death. In-home heart condition monitoring effectively reduced the CVD patient hospitalization rate. Flexible electrocardiogram (ECG) sensor provides an affordable, convenient and comfortable in-home monitoring solution. The three critical building blocks of the ECG sensor i.e., analog frontend (AFE), QRS detector, and cardiac arrhythmia classifier (CAC), are studied in this research. A fully differential difference amplifier (FDDA) based AFE that employs DC-coupled input stage increases the input impedance and improves CMRR. A parasitic capacitor reuse technique is proposed to improve the noise/area efficiency and CMRR. An on-body DC bias scheme is introduced to deal with the input DC offset. Implemented in 0.35m CMOS process with an area of 0.405mm2, the proposed AFE consumes 0.9W at 1.8V and shows excellent noise effective factor of 2.55, and CMRR of 76dB. Experiment shows the proposed AFE not only picks up clean ECG signal with electrodes placed as close as 2cm under both resting and walking conditions, but also obtains the distinct -wave after eye blink from EEG recording. A personalized QRS detection algorithm is proposed to achieve an average positive prediction rate of 99.39% and sensitivity rate of 99.21%. The user-specific template avoids the complicate models and parameters used in existing algorithms while covers most situations for practical applications. The detection is based on the comparison of the correlation coefficient of the user-specific template with the ECG segment under detection. The proposed one-target clustering reduced the required loops. A continuous-in-time discrete-in-amplitude (CTDA) artificial neural network (ANN) based CAC is proposed for the smart ECG sensor. The proposed CAC achieves over 98% classification accuracy for 4 types of beats defined by AAMI (Association for the Advancement of Medical Instrumentation). The CTDA scheme significantly reduces the input sample numbers and simplifies the sample representation to one bit. Thus, the number of arithmetic operations and the ANN structure are greatly simplified. The proposed CAC is verified by FPGA and implemented in 0.18m CMOS process. Simulation results show it can operate at clock frequencies from 10KHz to 50MHz. Average power for the patient with 75bpm heart rate is 13.34W

Design of a Class-AB Amplifier for a 1.5 Bit MDAC of a 12 Bit 100MSPS Pipeline ADC

The basic building block of a pipeline analog-to-digital converter (ADC) is the multiplying digital-to-analog converter (MDAC). The performance of the MDAC significantly depends on the performance of the operational amplifier and calibration techniques. To reduce the complexity of calibration, the operational amplifier needs to have high-linearity, high bandwidth and moderate gain. In this work, the Op-amp specifications were derived from the pipeline ADC requirements. A novel class-AB bias scheme with feed-forward compensation, which provides high linearity and bandwidth consuming low power is proposed. The advantages of the new topology over Monticelli bias scheme and Miller’s compensated amplifiers is explained. The amplifier is implemented in IBM 130nm technology and the MDAC design is used as a test bench to characterize the Op-amp performance. The proposed architecture performance is compared with class A and class-AB output stage amplifiers with Miller’s compensation reported in literature. The proposed class-AB amplifier with feed forward compensation provides an open loop gain of 47dB, unit gain bandwidth of 1040 MHz and IM3 of 75dB consuming 3.88mA current. The amplifier provides the required linearity and bandwidth at much lower power consumption than the amplifiers using conventional class-AB bias schemes

Advances in Solid State Circuit Technologies

This book brings together contributions from experts in the fields to describe the current status of important topics in solid-state circuit technologies. It consists of 20 chapters which are grouped under the following categories: general information, circuits and devices, materials, and characterization techniques. These chapters have been written by renowned experts in the respective fields making this book valuable to the integrated circuits and materials science communities. It is intended for a diverse readership including electrical engineers and material scientists in the industry and academic institutions. Readers will be able to familiarize themselves with the latest technologies in the various fields

Topical Workshop on Electronics for Particle Physics

The purpose of the workshop was to present results and original concepts for electronics research and development relevant to particle physics experiments as well as accelerator and beam instrumentation at future facilities; to review the status of electronics for the LHC experiments; to identify and encourage common efforts for the development of electronics; and to promote information exchange and collaboration in the relevant engineering and physics communities

CMOS SPAD-based image sensor for single photon counting and time of flight imaging

The facility to capture the arrival of a single photon, is the fundamental limit to the detection of quantised electromagnetic radiation. An image sensor capable of capturing a picture with this ultimate optical and temporal precision is the pinnacle of photo-sensing. The creation of high spatial resolution, single photon sensitive, and time-resolved image sensors in complementary metal oxide semiconductor (CMOS) technology offers numerous benefits in a wide field of applications. These CMOS devices will be suitable to replace high sensitivity charge-coupled device (CCD) technology (electron-multiplied or electron bombarded) with significantly lower cost and comparable performance in low light or high speed scenarios. For example, with temporal resolution in the order of nano and picoseconds, detailed three-dimensional (3D) pictures can be formed by measuring the time of flight (TOF) of a light pulse. High frame rate imaging of single photons can yield new capabilities in super-resolution microscopy. Also, the imaging of quantum effects such as the entanglement of photons may be realised. The goal of this research project is the development of such an image sensor by exploiting single photon avalanche diodes (SPAD) in advanced imaging-specific 130nm front side illuminated (FSI) CMOS technology. SPADs have three key combined advantages over other imaging technologies: single photon sensitivity, picosecond temporal resolution and the facility to be integrated in standard CMOS technology. Analogue techniques are employed to create an efficient and compact imager that is scalable to mega-pixel arrays. A SPAD-based image sensor is described with 320 by 240 pixels at a pitch of 8μm and an optical efficiency or fill-factor of 26.8%. Each pixel comprises a SPAD with a hybrid analogue counting and memory circuit that makes novel use of a low-power charge transfer amplifier. Global shutter single photon counting images are captured. These exhibit photon shot noise limited statistics with unprecedented low input-referred noise at an equivalent of 0.06 electrons. The CMOS image sensor (CIS) trends of shrinking pixels, increasing array sizes, decreasing read noise, fast readout and oversampled image formation are projected towards the formation of binary single photon imagers or quanta image sensors (QIS). In a binary digital image capture mode, the image sensor offers a look-ahead to the properties and performance of future QISs with 20,000 binary frames per second readout with a bit error rate of 1.7 x 10-3. The bit density, or cumulative binary intensity, against exposure performance of this image sensor is in the shape of the famous Hurter and Driffield densitometry curves of photographic film. Oversampled time-gated binary image capture is demonstrated, capturing 3D TOF images with 3.8cm precision in a 60cm range

Diseño CMOS de un sistema de visión “on-chip” para aplicaciones de muy alta velocidad

Falta palabras claveEsta Tesis presenta arquitecturas, circuitos y chips para el diseño de sensores de visión CMOS con procesamiento paralelo embebido. La Tesis reporta dos chips, en concreto: El chip Q-Eye; El chip Eye-RIS_VSoC.. Y dos sistemas de visión construidos con estos chips y otros sistemas “off-chip” adicionales, como FPGAs, en concreto: El sistema Eye-RIS_v1; El sistema Eye-RIS_v2. Estos chips y sistemas están concebidos para ejecutar tareas de visión a muy alta velocidad y con consumos de potencia moderados. Los sistemas resultantes son, además, compactos y por lo tanto ventajosos en términos del factor SWaP cuando se los compara con arquitecturas convencionales formadas por sensores de imágenes convencionales seguidos de procesadores digitales. La clave de estas ventajas en términos de SWaP y velocidad radica en el uso de sensores-procesadores, en lugar de meros sensores, en la interface de los sistemas de visión. Estos sensores-procesadores embeben procesadores programables de señal-mixta dentro del pixel y son capaces tanto de adquirir imágenes como de pre-procesarlas para extraer características, eliminar información redundante y reducir el número de datos que se transmiten fuera del sensor para su procesamiento ulterior. El núcleo de la tesis es el sensor-procesador Q-Eye, que se usa como interface en los sistemas Eye-RIS. Este sensor-procesador embebe una arquitectura de procesamiento formada por procesadores de señal-mixta distribuidos por pixel. Sus píxeles son por tanto estructuras multi-funcionales complejas. De hecho, son programables, incorporan memorias e interactúan con sus vecinos para realizar una variedad de operaciones, tales como: Convoluciones lineales con máscaras programables; Difusiones controladas por tiempo y nivel de señal, a través de un “grid” resistivo embebido en el plano focal; Aritmética de imágenes; Flujo de programación dependiente de la señal; Conversión entre los dominios de datos: imagen en escala de grises e imagen binaria; Operaciones lógicas en imágenes binarias; Operaciones morfológicas en imágenes binarias. etc. Con respecto a otros píxeles multi-función y sensores-procesadores anteriores, el Q-Eye reporta entre otras las siguientes ventajas: Mayor calidad de la imagen y mejores prestaciones de las funcionalidades embebidas en el chip; Mayor velocidad de operación y mejor gestión de la energía disponible; Mayor versatilidad para integración en sistemas de visión industrial. De hecho, los sistemas Eye-RIS son los primeros sistemas de visión industriales dotados de las siguientes características: Procesamiento paralelo distribuido y progresivo; Procesadores de señal-mixta fiables, robustos y con errores controlados; Programabilidad distribuida. La Tesis incluye descripciones detalladas de la arquitectura y los circuitos usados en el pixel del Q-Eye, del propio chip Q-Eye y de los sistemas de visión construidos en base a este chip. Se incluyen también ejemplos de los distintos chips en operaciónThis Thesis presents architectures, circuits and chips for the implementation of CMOS VISION SENSORS with embedded parallel processing. The Thesis reports two chips, namely: Q-eye chip; Eye-RIS_VSoC chip, and two vision systems realized by using these chips and some additional “off-chip” circuitry, such as FPGAs. These vision systems are: Eye-RIS_v1 system; Eye-RIS_v2 system. The chips and systems reported in the Thesis are conceived to perform vision tasks at very high speed and with moderate power consumption. The proposed vision systems are also compact and advantageous in terms of SWaP factors as compared with conventional architectures consisting of standard image sensor followed by digital processors. The key of these advantages in terms of SWaP and speed lies in the use of sensors-processors, rather than mere sensors, in the front-end interface of vision systems. These sensors-processors embed mixed-signal programmable processors inside the pixel. Therefore, they are able to acquire images and process them to extract the features, removing the redundant information and reducing the data throughput for later processing. The core of the Thesis is the sensor-processor Q-Eye, which is used as front-end in the Eye-RIS systems. This sensor-processor embeds a processing architecture composed by mixed-signal processors distributed per pixel. Then, its pixels are complex multi-functional structures. In fact, they are programmable, incorporate memories and interact with its neighbors in order to carry out a set of operations, including: Linear convolutions with programmable linear masks; Time- and signal-controlled diffusions (by means of an embedded resistive grid); Image arithmetic; Signal-dependent data scheduling; Gray-scale to binary transformation; Logic operation on binary images; Mathematical morphology on binary images, etc. As compared with previous multi-function pixels and sensors-processors, the Q-Eye brings among other the following advantages: Higher image quality and better performances of functionalities embedded on chip; Higher operation speed and better management of energy budget; More versatility for integration in industrial vision systems. In fact, the Eye-RIS systems are the first industrial vision systems equipped with the following characteristics: Parallel distributed and progressive processing; Reliable, robust mixed-signal processors with handled errors; Distributed programmability. This Thesis includes detailed descriptions of architecture and circuits used in the Q-Eye pixel, in the Q-Eye chip itself and in the vision systems developed based on this chip. Also, several examples of chips and systems in operation are presented