Advances on CMOS image sensors

This paper offers an introduction to the technological advances of image sensors designed using complementary metal–oxide–semiconductor (CMOS) processes along the last decades. We review some of those technological advances and examine potential disruptive growth directions for CMOS image sensors and proposed ways to achieve them. Those advances include breakthroughs on image quality such as resolution, capture speed, light sensitivity and color detection and advances on the computational imaging. The current trend is to push the innovation efforts even further as the market requires higher resolution, higher speed, lower power consumption and, mainly, lower cost sensors. Although CMOS image sensors are currently used in several different applications from consumer to defense to medical diagnosis, product differentiation is becoming both a requirement and a difficult goal for any image sensor manufacturer. The unique properties of CMOS process allows the integration of several signal processing techniques and are driving the impressive advancement of the computational imaging. With this paper, we offer a very comprehensive review of methods, techniques, designs and fabrication of CMOS image sensors that have impacted or might will impact the images sensor applications and markets

Quantitative comparison of camera technologies for cost-effective super-resolution optical fluctuation imaging (SOFI)

Van den Eynde R, Sandmeyer A, Vandenberg W, et al. Quantitative comparison of camera technologies for cost-effective super-resolution optical fluctuation imaging (SOFI). Journal of Physics: Photonics. 2019;1(4): 044001

Comparison of two optimized readout chains for low light CIS

We compare the noise performance of two optimized readout chains that are based on 4T pixels and featuring the same bandwidth of 265kHz (enough to read 1Megapixel with 50frame/s). Both chains contain a 4T pixel, a column amplifier and a single slope analog-to-digital converter operating a CDS. In one case, the pixel operates in source follower configuration, and in common source configuration in the other case. Based on analytical noise calculation of both readout chains, an optimization methodology is presented. Analytical results are confirmed by transient simulations using 130nm process. A total input referred noise bellow 0.4 electrons RMS is reached for a simulated conversion gain of 160μV/e−. Both optimized readout chains show the same input referred 1/f noise. The common source based readout chain shows better performance for thermal noise and requires smaller silicon area. We discuss the possible drawbacks of the common source configuration and provide the reader with a comparative table between the two readout chains. The table contains several variants (column amplifier gain, in-pixel transistor sizes and type). © (2014) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only

Ultra-low noise, high-frame rate readout design for a 3D-stacked CMOS image sensor

Due to the switch from CCD to CMOS technology, CMOS based image sensors have become smaller, cheaper, faster, and have recently outclassed CCDs in terms of image quality. Apart from the extensive set of applications requiring image sensors, the next technological breakthrough in imaging would be to consolidate and completely shift the conventional CMOS image sensor technology to the 3D-stacked technology. Stacking is recent and an innovative technology in the imaging field, allowing multiple silicon tiers with different functions to be stacked on top of each other. The technology allows for an extreme parallelism of the pixel readout circuitry. Furthermore, the readout is placed underneath the pixel array on a 3D-stacked image sensor, and the parallelism of the readout can remain constant at any spatial resolution of the sensors, allowing extreme low noise and a high-frame rate (design) at virtually any sensor array resolution. The objective of this work is the design of ultra-low noise readout circuits meant for 3D-stacked image sensors, structured with parallel readout circuitries. The readout circuit’s key requirements are low noise, speed, low-area (for higher parallelism), and low power. A CMOS imaging review is presented through a short historical background, followed by the description of the motivation, the research goals, and the work contributions. The fundamentals of CMOS image sensors are addressed, as a part of highlighting the typical image sensor features, the essential building blocks, types of operation, as well as their physical characteristics and their evaluation metrics. Following up on this, the document pays attention to the readout circuit’s noise theory and the column converters theory, to identify possible pitfalls to obtain sub-electron noise imagers. Lastly, the fabricated test CIS device performances are reported along with conjectures and conclusions, ending this thesis with the 3D-stacked subject issues and the future work. A part of the developed research work is located in the Appendices.Devido à mudança da tecnologia CCD para CMOS, os sensores de imagem em CMOS tornam se mais pequenos, mais baratos, mais rápidos, e mais recentemente, ultrapassaram os sensores CCD no que respeita à qualidade de imagem. Para além do vasto conjunto de aplicações que requerem sensores de imagem, o próximo salto tecnológico no ramo dos sensores de imagem é o de mudar completamente da tecnologia de sensores de imagem CMOS convencional para a tecnologia “3D-stacked”. O empilhamento de chips é relativamente recente e é uma tecnologia inovadora no campo dos sensores de imagem, permitindo vários planos de silício com diferentes funções poderem ser empilhados uns sobre os outros. Esta tecnologia permite portanto, um paralelismo extremo na leitura dos sinais vindos da matriz de píxeis. Além disso, num sensor de imagem de planos de silício empilhados, os circuitos de leitura estão posicionados debaixo da matriz de píxeis, sendo que dessa forma, o paralelismo pode manter-se constante para qualquer resolução espacial, permitindo assim atingir um extremo baixo ruído e um alto debito de imagens, virtualmente para qualquer resolução desejada. O objetivo deste trabalho é o de desenhar circuitos de leitura de coluna de muito baixo ruído, planeados para serem empregues em sensores de imagem “3D-stacked” com estruturas altamente paralelizadas. Os requisitos chave para os circuitos de leitura são de baixo ruído, rapidez e pouca área utilizada, de forma a obter-se o melhor rácio. Uma breve revisão histórica dos sensores de imagem CMOS é apresentada, seguida da motivação, dos objetivos e das contribuições feitas. Os fundamentos dos sensores de imagem CMOS são também abordados para expor as suas características, os blocos essenciais, os tipos de operação, assim como as suas características físicas e suas métricas de avaliação. No seguimento disto, especial atenção é dada à teoria subjacente ao ruído inerente dos circuitos de leitura e dos conversores de coluna, servindo para identificar os possíveis aspetos que dificultem atingir a tão desejada performance de muito baixo ruído. Por fim, os resultados experimentais do sensor desenvolvido são apresentados junto com possíveis conjeturas e respetivas conclusões, terminando o documento com o assunto de empilhamento vertical de camadas de silício, junto com o possível trabalho futuro

A 0.4 e-rms Temporal Readout Noise 7.5 µm Pitch and a 66% Fill Factor Pixel for Low Light CMOS Image Sensors

This paper explores a new way to reduce the readout noise for CMOS image sensors by using a typical 4T pixel embedding a PMOS source follower with reduced oxide thickness and gate dimensions. This approach is confirmed by a test chip designed in a 180 nm CIS CMOS process, and embedding small arrays of the proposed new pixels together with state-of-the-art 4T pixels for comparison. The new pixels feature a pitch of 7.5 µm and a fill factor of 66%. A 0.4 erms input-referred noise and a 185 µV/e- conversion gain are obtained. Compared to stateof-the-art pixels, also present onto the test chip, the RMS noise is divided by more than 2 and the conversion gain is multiplied by 2.2

Temporal Readout Noise Analysis and Reduction Techniques for Low-Light CMOS Image Sensors

In this paper, an analytical noise calculation is presented to derive the impact of process and design parameters on 1/f and thermal noise for a low-noise CMOS image sensor (CIS) readout chain. It is shown that dramatic noise reduction is obtained by using a thin-oxide transistor as the source follower of a typical 4T pixel. This approach is confirmed by a test chip designed in a 180-nm CIS process and embedding small arrays of the proposed new pixels together with state-ofthe- art 4T pixels for comparison. The new pixels feature a pitch of 7.5 mu m and a fill factor of 66%. A 0.4e-rms input-referred noise and a 185-mu V/e-conversion gain are obtained. Compared with state-of-the-art pixels, also present onto the test chip, the rms noise is divided by more than 2 and the conversion gain is multiplied by 2.2

A SPAD-Based QVGA Image Sensor for Single-Photon Counting and Quanta Imaging

A CMOS single-photon avalanche diode (SPAD)-based quarter video graphics array image sensor with 8-μm pixel pitch and 26.8% fill factor (FF) is presented. The combination of analog pixel electronics and scalable shared-well SPAD devices facilitates high-resolution, high-FF SPAD imaging arrays exhibiting photon shot-noise-limited statistics. The SPAD has 47 counts/s dark count rate at 1.5 V excess bias (EB), 39.5% photon detection probability (PDP) at 480 nm, and a minimum of 1.1 ns dead time at 1 V EB. Analog single-photon counting imaging is demonstrated with maximum 14.2-mV/SPAD event sensitivity and 0.06e- minimum equivalent read noise. Binary quanta image sensor (QIS) 16-kframes/s real-time oversampling is shown, verifying single-photon QIS theory with 4.6× overexposure latitude and 0.168e- read noise

A correlated multiple sampling passive switched capacitor circuit for low light CMOS image sensors

After a brief review of the principle of correlated multiple sampling (CMS) and its implementation techniques in CIS readout chains, a simple CMS passive circuit that (i) requires no additional active circuitry, (ii) has no impact on the output dynamic range and (iii) does not need multiple analog-to-digital conversions (faster) is presented. The proposed circuit uses n switched capacitors to perform a CMS on 2n samples. It is validated using transient noise simulations on a CIS readout chain based on a 4T pixel, designed with a 180nm CIS process. For a line readout time of 35 μs and a column amplifier bandwidth of 256 kHz, the proposed circuit reduces the input-referred noise as expected by an ideal CMS