37 research outputs found

    Defect-sensitivity analysis of an SEU immune CMOS logic family

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    Fault testing of resistive manufacturing defects is done on a recently developed single event upset immune logic family. Resistive ranges and delay times are compared with those of traditional CMOS logic. Reaction of the logic to these defects is observed for a NOR gate, and an evaluation of its ability to cope with them is determined

    Fault modeling, delay evaluation and path selection for delay test under process variation in nano-scale VLSI circuits

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    Delay test in nano-scale VLSI circuits becomes more difficult with shrinking technology feature sizes and rising clock frequencies. In this dissertation, we study three challenging issues in delay test: fault modeling, variational delay evaluation and path selection under process variation. Previous research of fault modeling on resistive spot defects, such as resistive opens and bridges in the interconnect, and resistive shorts in devices, lacked an accurate fault model. As a result it was difficult to perform fault simulation and select the best vectors. Conventional methods to compute variational delay under process variation are either slow or inaccurate. On the problem of path selection under process variation, previous approaches either choose too many paths, or missed the path that is necessary to be tested. We present new solutions in this dissertation. A new fault model that clearly and comprehensively expresses the relationship between electrical behaviors and resistive spots is proposed. Then the effect of process variations on path delays is modeled with a linear function and a fast method to compute coefficients of the linear function is also derived. Finally, we present the new path pruning algorithms that efficiently prune unimportant paths for test, and as a result we select as few as possible paths for test while the fault coverage is satisfied. The experimental results show that the new solutions are efficient and accurate

    Test Quality Analysis and Improvement for an Embedded Asynchronous FIFO

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    Embedded First-InFirst-Out (FIFO) memories are increasingly used in many IC designs.We have created a new full-custom embedded FIFO module withasynchronous read and write clocks, which is at least a factor twosmaller and also faster than SRAM-based and standard-cell-basedcounterparts. The detection qualities of the FIFO test for bothhard and weak resistive shorts and opens have been analyzed by anIFA-like method based on analog simulation. The defect coverage ofthe initial FIFO test for shorts in the bit-cell matrix has beenimproved by inclusion of an additional data background andlow-voltage testing; for low-resistant shorts, 100% defect coverageis obtained. The defect coverage for opens has been improved by anew test procedure which includes waitingperiods

    CA-BIST for asynchronous circuits: a case study on the RAPPID asynchronous instruction length decoder

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    Journal ArticleThis paper presents a case study in low-cost noninvasive Built-In Self Test (BIST) for RAPPID, a largescale 120,000-transistor asynchronous version of the Pentium® Pro Instruction Length Decoder, which runs at 3.6 GHz. RAPPID uses a synchronous 0.25 micron CMOS library for static and domino logic, and has no Design-for-Test hooks other than some debug features. We explore the use of Cellular Automata (CA) for on-chip test pattern generation and response evaluation. More specifically, we look for fast ways to tune the CA-BIST to the RAPPID design, rather than using pseudo-random testing. The metric for tuning the CA-BIST pattern generation is based on an abstract hardware description model of the instruction length decoder, which is independent of implementation details, and hence also independent of the asynchronous circuit style. Our CA-BI ST solution uses a novel bootstrap procedure for generating the test patterns, which give complete coverage for this metric, and cover 94% of the testable stuck-at faults for the actual design at switch level. Analysis of the undetected and untestable faults shows that the same fault effects can be expected for a similar clocked circuit. This is encouraging evidence that testability is no excuse to avoid asynchronous design techniques in addition to high-performance synchronous solutions

    Technology and layout-related testing of static random-access memories

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    Static random-access memories (SRAMs) exhibit faults that are electrical in nature. Functional and electrical testing are performed to diagnose faulty operation. These tests are usually designed from simple fault models that describe the chip interface behavior without a thorough analysis of the chip layout and technology. However, there are certain technology and layout-related defects that are internal to the chip and are mostly time-dependent in nature. The resulting failures may or may not seriously degrade the input/output interface behavior. They may show up as electrical faults (such as a slow access fault) and/or functional faults (such as a pattern sensitive fault). However, these faults cannot be described properly with the functional fault models because these models do not take timing into account. Also, electrical fault models that describe merely the input/output interface behavior are inadequate to characterize every possible defect in the basic SRAM cell. Examples of faults produced by these defects are: (a) static data loss, (b) abnormally high currents drawn from the power supply, etc. Generating tests for such faults often requires a thorough understanding and analysis of the circuit technology and layout. In this article, we shall examine ways to characterize and test such faults. We shall divide such faults into two categories depending on the types of SRAMs they effect—silicon SRAMs and GaAs SRAMs.Peer Reviewedhttp://deepblue.lib.umich.edu/bitstream/2027.42/43015/1/10836_2004_Article_BF00972519.pd

    CA-BIST for asynchronous circuits: a case study on the RAPPID asynchronous instruction length decoder

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    Journal ArticleThis paper presents a case study in low-cost noninvasive Built-In Self Test (BIST) for RAPPID, a largescale 120,000-transistor asynchronous version of the Pentium® Pro Instruction Length Decoder, which runs at 3.6 GHz. RAPPID uses a synchronous 0.25 micron CMOS library for static and domino logic, and has no Design-for-Test hooks other than some debug features. We explore the use of Cellular Automata (CA) for on-chip test pattern generation and response evaluation. More specifically, we look for fast ways to tune the CA-BIST to the RAPPID design, rather than using pseudo-random testing. The metric for tuning the CA-BIST pattern generation is based on an abstract hardware description model of the instruction length decoder, which is independent of implementation details, and hence also independent of the asynchronous circuit style. Our CA-BI ST solution uses a novel bootstrap procedure for generating the test patterns, which give complete coverage for this metric, and cover 94% of the testable stuck-at faults for the actual design at switch level. Analysis of the undetected and untestable faults shows that the same fault effects can be expected for a similar clocked circuit. This is encouraging evidence that testability is no excuse to avoid asynchronous design techniques in addition to high-performance synchronous solutions

    Learning digital test and diagnostics via Internet

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    An environment targeted to e-learning is presented for teaching design and test of electronic systems. The environment consists of a set of Java applets, and of web based access to the hardware equipments, which can be used in the classroom, for learning at home, in laboratory research and training, or for carrying out testing of students during exams. The tools support university courses on digital electronics, computer hardware, testing and design for testability to learn by hands-on exercises how to design digital systems, how to make them testable, how to build self-testing systems, how to generate test patterns, how to analyze the quality of tests, and how to localize faults in hardware. The tasks chosen for hands-on training represent simultaneously research problems, which allow to fostering in students critical thinking, problem solving skills and creativity

    An Accurate Timing Model for Fault Simulation in MOS Circuits

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    Coordinated Science Laboratory was formerly known as Control Systems LaboratorySemiconductor Research Corporation / 88-DP-109Joint Services Electronics Program / N00014-84-C-0149U of I OnlyRestricted to UIUC communit

    On the production testing of analog and digital circuits

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    This thesis focuses on the production testing of Analog and Digital circuits. First, it addresses the issue of finding a high coverage minimum test set for the second generation current conveyor as this was not tackled before. The circuit under test is used in active capacitance multipliers, V-I scalar circuits, Biquadratic filters and many other applications. This circuit is often used to implement voltage followers, current followers and voltage to current converters. Five faults are assumed per transistor. It is shown that, to obtain 100% fault coverage, the CCII has to be operated in voltage to current converter mode. Only two test values are required to obtain this fault coverage. Additionally, the thesis focuses on the production testing of Memristor Ratioed Logic (MRL) gates because this was not studied before. MRL is a family that uses memristors along with CMOS inverters to design logic gates. Two-input NAND and NOR gates are investigated using the stuck at fault model for the memristors and the five-fault model for the transistors. It is shown that in order to obtain full coverage for the MRL NAND and NOR gates, two solutions are proposed. The first is the usage of scaled input voltages to prevent the output from falling in the undefined region. The second proposed solution is changing the switching threshold VM of the CMOS inverter. In addition, it is shown that test speed and order should be taken into consideration. It is proven that three ordered test vectors are needed for full coverage in MRL NAND and NOR gates, which is different from the 100% coverage test set in the conventional NAND and NOR CMOS designs

    Product assurance technology for custom LSI/VLSI electronics

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    The technology for obtaining custom integrated circuits from CMOS-bulk silicon foundries using a universal set of layout rules is presented. The technical efforts were guided by the requirement to develop a 3 micron CMOS test chip for the Combined Release and Radiation Effects Satellite (CRRES). This chip contains both analog and digital circuits. The development employed all the elements required to obtain custom circuits from silicon foundries, including circuit design, foundry interfacing, circuit test, and circuit qualification
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