Reduced pin-count testing, 3D SICs, time division multiplexing, test access mechanism, simultaneous bidirectional signaling

3D Stacked Integrated Circuits (SICs) offer a promising way to cope with the technology scaling; however, the test access requirements are highly complicated due to increased transistor density and a limited number of test channels. Moreover, although the vertical interconnects in 3D SIC are capable of high-speed data transfer, the overall test speed is restricted by scan-chains that are not optimized for timing. Reduced Pin-Count Testing (RPCT) has been effectively used under these scenarios. In particular, Time Division Multiplexing (TDM) allows full utilization of interconnect bandwidth while providing low scan frequencies supported by the scan chains. However, these methods rely on Uni-Directional Signaling (UDS), in which a chip terminal (pin or a TSV) can either be used to transmit or receive data at a given time. This requires that at least two chip terminals are available at every die interface (Tester-Die or Die-Die) to form a single test channel. In this paper, we propose Simultaneous Bi-Directional Signaling (SBS), which allows a chip terminal to be used simultaneously to send and receive data, thus forming a test channel using one pin instead of two. We demonstrate how SBS can be used in conjunction with TDM to achieve reduced pin count testing while using only half the number of pins compared to conventional TDM based methods, consuming only 22.6% additional power. Alternatively, the advantage could be manifested as a test time reduction by utilizing all available test channels, allowing more parallelism and test time reduction down to half compared to UDS-based TDM. Experiments using 45nm technology suggest that the proposed method can operate at up to 1.2 GHz test clock for a stack of 3-dies, whereas for higher frequencies, a binary-weighted transmitter is proposed capable of up to 2.46 GHz test clock

차세대 자동차용 카메라 데이터 통신을 위한 비대칭 동시 양방향 송수신기의 설계

학위논문(박사) -- 서울대학교대학원 : 공과대학 전기·정보공학부, 2022.2. 정덕균.본 학위 논문에서는 차세대 자동차용 카메라 링크를 위해 높은 속도의 4레벨 펄스 진폭 변조 신호와 낮은 속도의 2레벨 펄스 진폭 변조 신호를 통신하는 비대칭 동시 양방향 송수신기의 설계 기술에 대해 제안하고 검증되었다. 첫번째 프로토타입 설계에서는, 10B6Q 직류 밸런스 코드를 탑재한 4레벨 펄스 진폭 변조 송신기와 고정된 데이터와 참조 레벨을 가지는 4레벨 펄스 진폭 변조 적응형 수신기에 대한 내용이 기술되었다. 4레벨 펄스 진폭 변조 송신기에서는 교류 연결 링크 시스템에 대응하기 위한 면적 및 전력 효율성이 좋은 10B6Q 코드가 제안되었다. 이 코드는 직류 밸런스를 맞추고 연속적으로 같은 심볼을 가지는 길이를 6개로 제한 시킨다. 비록 여기서는 입력 데이터 길이 10비트를 사용하였지만, 제안된 기술은 카메라의 다양한 데이터 타입에 대응할 수 있도록 입력 데이터 길이에 대한 확장성을 가진다. 반면, 4레벨 펄스 진폭 변조 적응형 수신기에서는, 샘플러의 옵셋을 최적으로 제거하여 더 낮은 비트에러율을 얻기 위해서, 기존의 데이터 및 참조 레벨을 조절하는 대신, 이 레벨들은 고정시키고 가변 게인 증폭기를 적응형으로 조절하도록 하였다. 상기 10B6Q 코드 및 고정 데이터 및 참조레벨 기술을 가진 프로토타입 칩들은 40 나노미터 상호보완형 메탈 산화 반도체 공정으로 제작되었고 칩 온 보드 형태로 평가되었다. 10B6Q 코드는 합성 게이트 숫자는 645개와 함께 단 0.0009 mm2 의 면적 만을 차지한다. 또한, 667 MHz 동작 주파수에서 단 0.23 mW 의 전력을 소모한다. 10B6Q 코드를 탑재한 송신기에서 8-Gb/s 4레벨 펄스 진폭 변조 신호를 고정 데이터 및 참조 레벨을 가지는 적응형 수신기로 12-m 케이블 (22-dB 채널 로스) 을 통해서 보낸 결과 최소 비트 에러율 108 을 달성하였고, 비트 에러율 105 에서는 아이 마진이 0.15 UI x 50 mV 보다 크게 측정되었다. 송수신기를 합친 전력 소모는 65.2 mW (PLL 제외) 이고, 성과의 대표수치는 0.37 pJ/b/dB 를 보여주었다. 첫번째 프로토타입 설계을 포함하여 개선된 두번째 프로토타입 설계에서는, 12-Gb/s 4레벨 펄스 진폭 변조 정방향 채널 신호와 125-Mb/s 2레벨 펄스 진폭 변조 역방향 채널 신호를 탑재한 비대칭 동시 양방향 송수신기에 대해 기술되고 검증되었다. 제안된 넓은 선형 범위를 가지는 하이브리드는 gmC 저대역 통과 필터와 에코 제거기와 함께 아웃바운드 신호를 24 dB 이상 효율적으로 감소시켰다. 또한, 넓은 선형 범위를 가지는 하이브리드와 함께 게인 감소기를 형성하게 되는 선형 범위 증폭기를 통해 4레벨 펄스 진폭 변조 신호의 선형성과 진폭의 트레이드 오프 관계를 깨는 것이 가능하였다. 동시 양방향 송수신기 칩은 40 나노미터 상호보완형 메탈 산화 반도체 공정으로 제작되었다. 상기 설계 기술들을 이용하여, 4레벨 펄스 진폭 변조 및 2레벨 펄스 진폭 변조 송수신기 모두 5m 채널 (채널 로스 15.9 dB) 에서 1E-12 보다 낮은 비트 에러율을 달성하였고, 총 78.4 mW 의 전력 소모를 기록하였다. 종합적인 송수신기는 성과 대표지표로 0.41 pJ/b/dB 와 함께 동시 양방향 통신 아래에서 4레벨 펄스 진폭 변조 신호 및 2레벨 펄스 진폭 변조 신호 각각에서 아이 마진 0.15 UI 와 0.57 UI 를 달성하였다. 이 수치는 성과 대표지표 0.5 이하를 가지는 기존 동시 양방향 송수신기와의 비교에서 최고의 아이 마진을 기록하였다.In this dissertation, design techniques of a highly asymmetric simultaneous bidirectional (SB) transceivers with high-speed PAM-4 and low-speed PAM-2 signals are proposed and demonstrated for the next-generation automotive camera link. In a first prototype design, a PAM-4 transmitter with 10B6Q DC balance code and a PAM-4 adaptive receiver with fixed data and threshold levels (dtLevs) are presented. In PAM-4 transmitter, an area- and power-efficient 10B6Q code for an AC coupled link system that guarantees DC balance and limited run length of six is proposed. Although the input data width of 10 bits is used here, the proposed scheme has an extensibility for the input data width to cover various data types of the camera. On the other hand, in the PAM-4 adaptive receiver, to optimally cancel the sampler offset for a lower BER, instead of adjusting dtLevs, the gain of a programmable gain amplifier is adjusted adaptively under fixed dtLevs. The prototype chips including above proposed 10B6Q code and fixed dtLevs are fabricated in 40-nm CMOS technology and tested in chip-on-board assembly. The 10B6Q code only occupies an active area of 0.0009 mm2 with a synthesized gate count of 645. It also consumes 0.23 mW at the operating clock frequency of 667 MHz. The transmitter with 10B6Q code delivers 8-Gb/s PAM-4 signal to the adaptive receiver using fixed dtLevs through a lossy 12-m cable (22-dB channel loss) with a BER of 1E-8, and the eye margin larger than 0.15 UI x 50 mV is measured for a BER of 1E-5. The proto-type chips consume 65.2 mW (excluding PLL), exhibiting an FoM of 0.37 pJ/b/dB. In a second prototype design advanced from the first prototypes, An asymmetric SB transceivers incorporating a 12-Gb/s PAM-4 forward channel and a 125-Mb/s PAM-2 back channel are presented and demonstrated. The proposed wide linear range (WLR) hybrid combined with a gmC low-pass filter and an echo canceller effectively suppresses the outbound signals by more than 24dB. In addition, linear range enhancer which forms a gain attenuator with WLR hybrid breaks the trade-off between the linearity and the amplitude of the PAM-4 signal. The SB transceiver chips are separately fabricated in 40-nm CMOS technology. Using above design techniques, both PAM-4 and PAM-2 SB transceivers achieve BER less than 1E-12 over a 5-m channel (15.9 dB channel loss), consuming 78.4 mW. The overall transceivers achieve an FoM of 0.41 pJ/b/dB and eye margin (at BER of 1E-12) of 0.15 UI and 0.57 UI for the forward PAM-4 and back PAM-2 signals, respectively, under SB communication. This is the best eye margin compared to the prior art SB transceivers with an FoM less than 0.5.CHAPTER 1 INTRODUCTION 1 1.1 MOTIVATION 1 1.2 DISSERTATION ORGANIZATION 4 CHAPTER 2 BACKGROUND ON AUTOMOTIVE CAMERA LINK 6 2.1 OVERVIEW 6 2.2 SYSTEM REQUIREMENTS 10 2.2.1 CHANNEL 10 2.2.2 POWER OVER DIFFERENTIAL LINE (PODL) 12 2.2.3 AC COUPLING AND DC BALANCE CODE 15 2.2.4 SIMULTANEOUS BIDIRECTIONAL COMMUNICATION 18 2.2.4.1 HYBRID 18 2.2.4.2 ECHO CANCELLER 20 2.2.5 ADAPTIVE RECEIVE EQUALIZATION 22 CHAPTER 3 AREA AND POWER EFFICIENT 10B6Q ENCODER FOR DC BALANCE 25 3.1 INTRODUCTION 25 3.2 PRIOR WORKS 28 3.3 PROPOSED AREA- AND POWER-EFFICIENT 10B6Q PAM-4 CODER 30 3.4 DESIGN OF THE 10B6Q CODE 33 3.4.1 PAM-4 DC BALANCE 35 3.4.2 PAM-4 TRANSITION DENSITY 35 3.4.3 10B6Q DECODER 37 3.5 IMPLEMENTATION AND MEASUREMENT RESULTS 40 CHAPTER 4 PAM-4 TRANSMITTER AND ADAPTIVE RECEIVER WITH FIXED DATA AND THRESHOLD LEVELS 45 4.1 INTRODUCTION 45 4.2 PRIOR WORKS 47 4.3 ARCHITECTURE AND IMPLEMENTATION 49 4.2.1 PAM-4 TRANSMITTER 49 4.2.2 PAM-4 ADAPTIVE RECEIVER 52 4.3 MEASUREMENT RESULTS 62 CHAPTER 5 ASYMMETRIC SIMULTANEOUS BIDIRECTIONAL TRANSCEIVERS USING WIDE LINEAR RANGE HYBRID 68 5.1 INTRODUCTION 68 5.2 PRIOR WORKS 70 5.3 WIDE LINEAR RANGE (WLR) HYBRID 75 5.3 IMPLEMENTATION 78 5.3.1 SERIALIZER (SER) DESIGN 78 5.3.2 DESERIALIZER (DES) DESIGN 79 5.4 HALF CIRCUIT ANALYSIS OF WLR HYBRID AND LRE 82 5.5 MEASUREMENT RESULTS 88 CHAPTER 6 CONCLUSION 97 BIBLIOGRAPHY 99 초 록 106박

Integrating simultaneous bi-direction signalling in the test fabric of 3D stacked integrated circuits.

Jennions, Ian K. - Associate SupervisorThe world has seen significant advancements in electronic devices’ capabilities, most notably the ability to embed ultra-large-scale functionalities in lightweight, area and power-efficient devices. There has been an enormous push towards quality and reliability in consumer electronics that have become an indispensable part of human life. Consequently, the tests conducted on these devices at the final stages before these are shipped out to the customers have a very high significance in the research community. However, researchers have always struggled to find a balance between the test time (hence the test cost) and the test overheads; unfortunately, these two are inversely proportional. On the other hand, the ever-increasing demand for more powerful and compact devices is now facing a new challenge. Historically, with the advancements in manufacturing technology, electronic devices witnessed miniaturizing at an exponential pace, as predicted by Moore’s law. However, further geometric or effective 2D scaling seems complicated due to performance and power concerns with smaller technology nodes. One promising way forward is by forming 3D Stacked Integrated Circuits (SICs), in which the individual dies are stacked vertically and interconnected using Through Silicon Vias (TSVs) before being packaged as a single chip. This allows more functionality to be embedded with a reduced footprint and addresses another critical problem being observed in 2D designs: increasingly long interconnects and latency issues. However, as more and more functionality is embedded into a small area, it becomes increasingly challenging to access the internal states (to observe or control) after the device is fabricated, which is essential for testing. This access is restricted by the limited number of Chip Terminals (IC pins and the vertical Through Silicon Vias) that a chip could be fitted with, the power consumption concerns, and the chip area overheads that could be allocated for testing. This research investigates Simultaneous Bi-Directional Signaling (SBS) for use in Test Access Mechanism (TAM) designs in 3D SICs. SBS enables chip terminals to simultaneously send and receive test vectors on a single Chip Terminal (CT), effectively doubling the per-pin efficiency, which could be translated into additional test channels for test time reduction or Chip Terminal reduction for resource efficiency. The research shows that SBS-based test access methods have significant potential in reducing test times and/or test resources compared to traditional approaches, thereby opening up new avenues towards cost-effectiveness and reliability of future electronics.PhD in Manufacturin

The 7TM-independent (trans) function of the Adhesion GPCR Latrophilin-1 in C. elegans neuron morphogenesis and germ cell proliferation: Thesis submitted for the degree of Dr. med.

In meiner Dissertation klärte ich wesentliche Fragen zu 7-Transmembrandomänen-unabhängigen Funktionen von Adhäsions-G-protein-gekoppelten Rezeptoren auf. Diese einzigartigen Zelloberflächenmoleküle sind essentiell für die Physiologie des Menschen, jedoch auf molekularer Ebene erst in Grundzügen verstanden. Unter anderem haben sie als G-protein-gekoppelte Rezeptoren die Fähigkeit, Signale aus der zellulären Umgebung mittels ihrer 7-Transmembrandomäne in die Zelle weiterzuleiten. Jedoch sind sie auch im Stande unabhängig von ihrer 7-Transmembrandomäne agieren. In meiner Arbeit zeigte ich wie solche Funktionen in vivo implementiert werden können und präsentierte weiterhin, dass die Rezeptoren in diesem Kontext entgegen ihrer 'Natur' im Stande sind, Signale auf benachbarten Zellen auszulösen. Meine Arbeit bildet somit die Grundlage zur weiteren Erforschung der komplexen Signalmechanismen von Adhäsions-GPCRs

Design Techniques for High Pin Efficiency Wireline Transceivers

While the majority of wireline research investigates bandwidth improvement and how to overcome the high channel loss, pin efficiency is also critical in high-performance wireline applications. This dissertation proposes two different implementations for high pin efficiency wireline transceivers. The first prototype achieves twice pin efficiency than unidirectional signaling, which is 32Gb/s simultaneous bidirectional transceiver supporting transmission and reception on the same channel at the same time. It includes an efficient low-swing voltage-mode driver with an R-gm hybrid for signal separation, combining the continuous-time-linear-equalizer (CTLE) and echo cancellation (EC) in a single stage, and employing a low-complexity 5/4X CDA system. Support of a wide range of channels is possible with foreground adaptation of the EC finite impulse response (FIR) filter taps with a sign-sign least-mean-square (SSLMS) algorithm. Fabricated in TSMC 28-nm CMOS, the 32Gb/s SBD transceiver occupies $0.09 mm^{2}$ area and achieves 16Gb/s uni-directional and 32Gb/s simultaneous bi-directional signals. 32Gb/s SBD operation consumes 1.83mW/Gb/s with 10.8dB channel loss at Nyquist rate. The second prototype presents an optical transmitter with a quantum-dot (QD) microring laser. This can support wavelength-division multiplexing allowing for high pin efficiency application by packing multiple high-bandwidth signals onto one optical channel. The development QD microring laser model accurately captures the intrinsic photonic high-speed dynamics and allows for the future co-design of the circuits and photonic device. To achieve higher bandwidth than intrinsic one, utilizing both techniques of optical injection locking (OIL) and 2-tap asymmetric Feed-forward equalizer (FFE) can perform 22Gb/s operation with 3.2mW/Gb/s. The first hybrid-integration directly-modulated OIL QD microring laser system is demonstrated

Clocking and Skew-Optimization For Source-Synchronous Simultaneous Bidirectional Links

There is continuous expansion of computing capabilities in mobile devices which demands higher I/O bandwidth and dense parallel links supporting higher data rates. Highspeed signaling leverages technology advancements to achieve higher data rates but is limited by the bandwidth of the electrical copper channel which have not scaled accordingly. To meet the continuous data-rate demand, Simultaneous Bi-directional (SBD) signaling technique is an attractive alternative relative to uni-directional signaling as it can work at lower clock speeds, exhibits better spectral efficiency and provides higher throughput in pad limited PCBs. For low-power and more robust system, the SBD transceiver should utilize forwarded clock system and per-pin de-skew circuits to correct the phase difference developed between the data and clock. The system can be configured in two roles, master and slave. To save more power, the system should have only one clock generator. The master has its own clock source and shares its clock to the slave through the clock channel, and the slave uses this forwarded clock to deserialize the inbound data and serialize the outbound data. A clock-to-data skew exists which can be corrected with a phase tracking CDR. This thesis presents a low-power implementation of forwarded clocking and clock-to-data skew optimization for a 40 Gbps SBD transceiver. The design is implemented in 28nm CMOS technology and consumes 8.8mW of power for 20 Gbps NRZ data at 0.9 V supply. The area occupied by the clocking 0.018 mm^2 area

High-speed, low cost test platform using FPGA technology

The object of this research is to develop a low-cost, adaptable testing platform for multi-GHz digital applications, with concentration on the test requirement of advanced devices. Since most advanced ATEs are very expensive, this equipment is not always available for testing cost-sensitive devices. The approach is to use recently-introduced advanced FPGAs for the core logic of the testing platform, thereby allowing for a low-cost, low power-consumption, high-performance, and adaptable test system. Furthermore to customize the testing system for specific applications, we implemented multiple extension testing modules base on this platform. With these extension modules, new functions can be added easily and the test system can be upgraded with specific features required for other testing purposes. The applications of this platform can help those digital devices to be delivered into market with shorter time, lower cost and help the development of the whole industry.Ph.D

2-wire time independent asynchronous communications

Communications both to and between low end microprocessors represents a real cost in a number of industrial and consumer products. This thesis starts by examining the properties of protocols that help to minimize these expenses and comes to the conclusion that the derived set of properties define a new category of communications protocol : Time Independent Asynchronous ( TIA) communications. To show the utility of the TIA category we develop a novel TIA protocol that uses only 2-wires and general IO pins on each host. The protocol is analyzed using the Petri net based STG ( Signal Transition Graph) which is widely use to model asynchronous logic. It is shown that STGs do not accurately model the behavior of software driven systems and so a modified form called STG-FT ( STG For Threads) is developed to better model software systems. A simulator is created to take an STG-FT model and perform a full reachability tree analysis to prove correctness and analyze livelock and deadlock properties. The simulator can also examine the full reachability tree for every possible system state ( the cross product of all sub-system states), and analyze deadlock and livelock issues related to unexpected inputs and unusual situations. Reachability pruning algorithms are developed which decrease the search tree by a factor of approximately 250 million. The 2-wire protocol is implemented between a PC and an Atmel Tiny26 microprocessor, there is also a variant that works between microprocessors. Testing verifies the simulation results including an avoidable livelock condition with data throughput peaking at a useful 50 kilobits/second in both directions. The first practical application of 2-wire TIA is part of a novel debugger for the Atmel Tiny26 microprocessor. The approach can be extended to any microprocessor with general IO pins. TIA communications, developed in this thesis, is a serious contender whenever low end microprocessors must communicate with other processors. Consumer and industrial products may be able to achieve cost saving by using this new protocol

Hybrid NRZ/Multi-Tone Signaling for High-Speed Low-Power Wireline Transceivers

Over the past few decades, incessant growth of Internet networking traffic and High-Performance Computing (HPC) has led to a tremendous demand for data bandwidth. Digital communication technologies combined with advanced integrated circuit scaling trends have enabled the semiconductor and microelectronic industry to dramatically scale the bandwidth of high-loss interfaces such as Ethernet, backplane, and Digital Subscriber Line (DSL). The key to achieving higher bandwidth is to employ equalization technique to compensate the channel impairments such as Inter-Symbol Interference (ISI), crosstalk, and environmental noise. Therefore, todayâs advanced input/outputs (I/Os) has been equipped with sophisticated equalization techniques to push beyond the uncompensated bandwidth of the system. To this end, process scaling has continually increased the data processing capability and improved the I/O performance over the last 15 years. However, since the channel bandwidth has not scaled with the same pace, the required signal processing and equalization circuitry becomes more and more complicated. Thereby, the energy efficiency improvements are largely offset by the energy needed to compensate channel impairments. In this design paradigm, re-thinking about the design strategies in order to not only satisfy the bandwidth performance, but also to improve power-performance becomes an important necessity. It is well known in communication theory that coding and signaling schemes have the potential to provide superior performance over band-limited channels. However, the choice of the optimum data communication algorithm should be considered by accounting for the circuit level power-performance trade-offs. In this thesis we have investigated the application of new algorithm and signaling schemes in wireline communications, especially for communication between microprocessors, memories, and peripherals. A new hybrid NRZ/Multi-Tone (NRZ/MT) signaling method has been developed during the course of this research. The system-level and circuit-level analysis, design, and implementation of the proposed signaling method has been performed in the frame of this work, and the silicon measurement results have proved the efficiency and the robustness of the proposed signaling methodology for wireline interfaces. In the first part of this work, a 7.5 Gb/s hybrid NRZ/MT transceiver (TRX) for multi-drop bus (MDB) memory interfaces is designed and fabricated in 40 nm CMOS technology. Reducing the complexity of the equalization circuitry on the receiver (RX) side, the proposed architecture achieves 1 pJ/bit link efficiency for a MDB channel bearing 45 dB loss at 2.5 GHz. The measurement results of the first prototype confirm that NRZ/MT serial data TRX can offer an energy-efficient solution for MDB memory interfaces. Motivated by the satisfying results of the first prototype, in the second phase of this research we have exploited the properties of multi-tone signaling, especially orthogonality among different sub-bands, to reduce the effect of crosstalk in high-dense wireline interconnects. A four-channel transceiver has been implemented in a standard CMOS 40 nm technology in order to demonstrate the performance of NRZ/MT signaling in presence of high channel loss and strong crosstalk noise. The proposed system achieves 1 pJ/bit power efficiency, while communicating over a MDB memory channel at 36 Gb/s aggregate data rate