A micro gas preconcentrator with improved performance for pollution monitoring and explosives detection

International audienceThis paper presents the optimization of a micro gas preconcentrator based on a micro-channel in porous and non-porous silicon filled with an adequate adsorbent. This micro gas preconcentrator is both applicable in the fields of atmospheric pollution monitoring (Volatil organic compounds—VOCs) and explosives detection (nitroaromatic compounds). Different designs of micro-devices and adsorbent materials have been investigated since these two parameters are of importance in the performances of the micro-device. The optimization of the device and its operation were driven by its future application in outdoor environments. Parameters such as the preconcentration factor, cycle time and the influence of the humidity were considered along the optimization process. As a result of this study, a preconcentrator with a total cycle time of 10 min and the use of single wall carbon nanotubes (SWCNTs) as adsorbent exhibits a good preconcentration factor for VOCs with a limited influence of the humidity. The benefits of using porous silicon to modify the gas desorption kinetics are also investigated

Microfabricated Chemical Analysis Systems for Environmental Applications

Recent contributions to the design, development, and fabrication of microtechnological devices for chemical analysis are summarized. The discussion includes microdisk-electrode arrays for voltammetric analysis of trace metals, and micro total-analysis systems for coulometric nanotitrations of different analytes

Design and fabrication of a circular Digital Variable Optical Attenuator

The second generation circular digital variable optical attenuator (CDVOA) with an effective area of 1500 μm diameter has been designed and fabricated based on SOI technology. C-band incoming Gaussian light can be reflected to an outgoing fiber from a shiny circular area, which is divided into sectors that can be individually tilted and addressed electrostatically to achieve variable light attenuation. Using a delay mask process, each movable component i) has an underlying ridge frame to maintain flatness, ii) is suspended by two micro beams at a bridge structure that connects to a handle where aluminum electrode is located underneath, and iii) is separated by wall structures at the handle area to reduce crosstalk from adjacent electrodes. Critical fabrication processes including the mirror and chip release are performed using a HF vapor phase etcher. Fluidic pressure and chip-dicing shocks are avoided. Initial results show that a mirror sector suspended by two 345 μm long beams with a cross-section of about 5×5 μm2 can be tilted to 2.8° at about 18 V driving voltage. Initial interferometric measurement gives estimated individual mirror flatness after metallic reflective coating to be about λ/15. The assembled chips are ready for further testing and characterization