Vapor phase doping with N-type dopant into silicon by atmospheric pressure chemical vapor deposition

peer reviewedAtomic layer doping of phosphorus (P) and arsenic (As) into Si was performed using the vapor phase doping (VPD) technique. For increasing deposition time and precursor gas flow rate, the P and As doses tend to saturate at about 0.8 and 1.0 monolayer of Si, respectively. Therefore, these processes are self-limited in both cases. When a Si cap layer is grown on the P-covered Si(001), high P concentration of 3.7 × 1020 cm-3 at the heterointerface in the Si- cap/P/Si-substrate layer stacks is achieved. Due to As desorption and segregation toward the Si surface during the temperature ramp up and during the Si-cap growth, the As concentration at the heterointerface in the Si-cap/As/Si-substrate layer stacks was lower compared to the P case. These results allowed us to evaluate the feasibility of the VPD process to fabricate precisely controlled doping profiles

Nucleation Mechanism during WS2 Plasma Enhanced Atomic Layer Deposition on Amorphous Al2O3 and Sapphire Substrates

The structure, crystallinity and properties of as-deposited two-dimensional (2D) transition metal dichalcogenides are determined by nucleation mechanisms in the deposition process. 2D materials grown by atomic layer deposition (ALD) in absence of a template, are polycrystalline or amorphous. Little is known about their nucleation mechanisms. Therefore, we investigate the nucleation behavior of WS2 during plasma enhanced ALD from WF6, H2 plasma and H2S at 300 °C on amorphous ALD Al2O3 starting surface and on monocrystalline, bulk sapphire. Preferential interaction of the precursors with the Al2O3 starting surface promotes fast closure of the WS2 layer. The WS2 layers are fully continuous at WS2 content corresponding to only 1.2 WS2 monolayers. On amorphous Al2O3, (0002) textured and polycrystalline WS2 layers form with grain size of 5 nm to 20 nm due to high nucleation density (~1014 nuclei/cm2). The WS2 growth mode changes from 2D (layer-by-layer) growth on the initial Al2O3 surface to three-dimensional (Volmer-Weber) growth after WS2 layer closure. Further growth proceeds from both WS2 basal planes in register with the underlying WS2 grain, and from or over grain boundaries of the underlying WS2 layer with different in-plane orientation. In contrast, on monocrystalline sapphire, WS2 crystal grains can locally align along a preferred in-plane orientation. Epitaxial seeding occurs locally albeit a large portion of crystals remain randomly oriented, presumably due to the low deposition temperature. The WS2 sheet resistance is 168 MΩµm suggesting that charge transport in the WS2 layers is limited by grain boundaries.status: publishe

Microwave Properties of Ba-Substituted Pb(Zr0.52_{0.52}Ti0.48_{0.48})O3_3 after Chemical-Mechanical Polishing

We have studied the effect of chemical-mechanical polishing (CMP) on the ferroelectric, piezoelectric, and microwave dielectric properties of Ba-substituted PZT (BPZT), deposited by pulsed laser deposition. CMP allowed for the reduction of the root mean square surface roughness of 600 nm thick BPZT films from 12.1nm to 0.79 nm. Ammonium peroxide (SC-1) cleaning was effective to remove Si CMP residuals. Measurements of the ferroelectric hysteresis after CMP indicated that the ferroelectric properties of BPZT were only weakly affected by CMP, while the piezoelectric d33 coefficient and the microwave permittivity were reduced slightly by 10%. This can be attributed to the formation of a thin dead layer at the BPZT surface. Moreover, the intrinsic dielectric permittivity at microwave frequencies between 1 and 25 GHz was not influenced by CMP, whereas the dead layer series capacitance decreased by 10%. The results indicate that the CMP process can be used to smoothen the BPZT surface without affecting the film properties strongly.Comment: 13 pages of text, 4 tables and 7 figures. This project has received funding from the European Union's Horizon 2020 research and innovation program under grant agreement No. 801055 "Spin Wave Computing for Ultimately-Scaled Hybrid Low-Power Electronics" - CHIRO

Photoemission in microelectronic research: When technological developments allow to tackle new questions in the lab

Photoemission has always played an important role in the development of new microelectronic devices and processes and has quickly focused on the use of monochromatized Al Kd radiation in most commercial instruments. While, for instance, ARXPS using sample tilting or the use of high-energy photoemission at synchrotron facilities were available, their use remained confidential due to technical constraints such as measurement time, repeatability of the measurements and/or access to the facilities. In this paper, we show through some examples that the implementation of these features in a user-friendly setup in the laboratory considerably enhances the information retrieved from photoemission experiments

Precise nitrogen depth profiling by high-resolution RBS in combination with angle-resolved XPS

Nitrogen depth profiling in a high-k gate stack structure, SiON/HfO2/SiON/Si(0 0 1) was performed by high-resolution Rutherford backscattering spectroscopy (HRBS) in combination with angle-resolved X-ray photoelectron spectroscopy (AR-XPS). The nitrogen depth profile is determined so that both the HRBS spectrum and the angular dependence of the XPS yield are reproduced. The obtained nitrogen profile is compared with the result of high-resolution elastic recoil detection (ERD) which is the most reliable technique for depth profiling of light elements. The agreement between the result of the present combination analysis and that of high-resolution ERD is fairly good, showing that the present combination analysis is a promising method for the analysis of light elements