Fully embedded optical and electrical interconnections in flexible foils

This paper presents the development of a technology platform for the full integration of opto-electronic and electronic components, as well as optical interconnections in a flexible foil. A technology is developed to embed ultra thin (20 μ m) VCSEL's and Photodiodes in layers of optical transparent material. These layers are sandwiched in between two Polyimide layers to get a flexible foil with a final stack thickness of 150 μ m. Optical waveguides are structured by photolithography in the optical layers and pluggable mirror components couple the light from the embedded opto-electronics in and out of the waveguides. Besides optical links and optoelectronic components, electrical circuitry is also embedded by means of embedded copper tracks and thinned down Integrated Circuits (20 μ m). Optical connection towards the outer world is realized by U-groove passive alignment coupling of optical fibers with the embedded waveguides

Embedding of optical interconnections in flexible electronics

P

Embedded flexible optical shear sensor

Monitoring shear stresses is increasingly important in the medical sector, where the sensors need to be unobtrusive, compact and flexible. A very thin and flexible sensor foil is presented based on the shear stress dependent coupling change of optical power between a laser and photodiode chip that were separated by a deformable sensing layer. These opto-electronic components were embedded in a very thin foil of only 40 mu m thick. The sensitivity and measurement range can be modified by selecting the material properties of the sensing layer. The sensor response showed to be reproducible and the influence of normal pressure on the sensor was very limited

Packaging technology enabling flexible optical interconnections

This paper reports on the latest trends and results on the integration of optical and opto-electronic devices and interconnections inside flexible carrier materials. Electrical circuits on flexible substrates are a very fast growing segment in electronics, but opto-electronics and optics should be able to follow these upcoming trends. This paper presents the back-thinning and packaging of single opto-electronic devices resulting in highly flexible and reliable packages. Optical waveguides and optical out-of-plane coupling structures are integrated inside the same layer stack, resulting in complete VCSEL-to-PD links with low total optical losses and high resistance to heat cycling and moisture exposure

Learning and exploiting mixed variable dependencies with a model-based EA

Mixed-integer optimization considers problems with both discrete and continuous variables. The ability to learn and process problem structure can be of paramount importance for optimization, particularly when faced with black-box optimization (BBO) problems, where no structural knowledge is known a priori. For such cases, model-based Evolutionary Algorithms (EAs) have been very successful in the fields of discrete and continuous optimization. In this paper, we present a model-based EA which integrates techniques from the discrete and continuous domains in order to tackle mixed-integer problems. We furthermore introduce the novel mechanisms to learn and exploit mixed-variable dependencies. Previous approaches only learned dependencies explicitly in either the discrete or the continuous domain. The potential usefulness of addressing mixed dependencies directly is assessed by empirically analyzing algorithm performance on a selection of mixed-integer problems with different types of variable interactions. We find substantially improved, scalable performance on problems that exhibit mixed dependencies