Evaluation on the Effects of Deicing Chemicals on Soil and Water Environment

AbstractDeicing chemicals are widely used to clear the pavement snow in the cold areas of China and many other countries in winter, because of their simple operation and excellent snow-melting effect, which leads to more convenience for traffic and low probability of traffic accident in the city, especially in metropolis. However, with the ever-growing application of deicing chemicals, their negative effects on environment such as soil and water system increased dramatically. Based on the related researches in China and abroad, this paper summarized the two categories of deicing chemicals and their working principles, and then provided the unique characteristics of deicing chemicals’ effects on soil and water environment in large cities, which may need considerable quantity of the chemicals to relieve traffic congestion. What's more, main aspects of impacts by deicing chemicals on regional soil and water environment and the fundamental factors related to the aspects above respectively were generalized, in order to propose a conceptual model to evaluate the harmful effects. Moreover, this paper put forward some suggestions for the further research in this field to fulfill the model, and provided a scientific basis for the pollution prevention of deicing chemicals on urban environment

Association of Insulin Resistance with Serum Interleukin-6 and TNF-α Levels During Normal Pregnancy

Overview The purpose of this study was to evaluate the role of Tumor Necrosis Factor-α (TNF-α) in insulin resistance (IR) during normal pregnancy. Approach This cross sectional study was carried out on 86 healthy pregnant women including 26, 23 and 37 individuals in the 1st, 2nd and 3rd trimesters, respectively, and in 21 healthy non pregnant women. Serum TNF-α concentration was measured by Enzyme Linked Immunosorbent Assay (ELISA) method. Results There were significant differences between serum TNF-α and IL-6 levels in pregnant women as compared with maternal healthy controls. There was significant correlation between gestational age and Body Mass Index (BMI) (r = 0.28, P = 0.01). There was no significant correlation between gestational age and insulin resistance (IR). We also did not find correlations between IR and TNF-α and IR and IL-6 in pregnant women. Conclusion In conclusion, our findings suggest that TNF-α and IL-6 are not greatly contributed to pregnancy induced insulin resistance in normal pregnancy

Cultural Perspective on Parenting, Trait Emotional Intelligence and Mental Health in Taiwanese Children

The current study aims to clarify the associations as well as the pathways through which parenting and children's emotional intelligence (EI) may influence children's mental health with a cross-sectional sample of 675 school pupils (fourth grade, mean age = 10.4 years, 310 boy, 356 girls and 9 unidentified) in Taiwan. Hierarchical regression and path analyses were used to examine the relationships between parenting styles, children's trait EI, and their psychological symptoms, with children's psychological symptoms as the dependent variable. The results showed that authoritative parenting was positively associated with children‟s trait EI, which in turn had a negative effect on children‟s psychological symptoms, whereas authoritarian and Chinese-specific parenting styles had direct negative effect on children‟s psychological symptoms. These findings shed light on the pathways of the interrelations between different parenting styles, children's trait EI, and psychological symptoms, providing theoretical as well as practical implications for children's emotional development and mental health

Superfluid pairing in a polarized dipolar Fermi gas

We calculate the critical temperature of a superfluid phase transition in a polarized Fermi gas of dipolar particles. In this case the order parameter is anisotropic and has a nontrivial energy dependence. Cooper pairs do not have a definite value of the angular momentum and are coherent superpositions of all odd angular momenta. Our results describe prospects for achieving the superfluid transition in single-component gases of fermionic polar molecules.Comment: 12 pages, 2 figure

Invasive Allele Spread under Preemptive Competition

We study a discrete spatial model for invasive allele spread in which two alleles compete preemptively, initially only the "residents" (weaker competitors) being present. We find that the spread of the advantageous mutation is well described by homogeneous nucleation; in particular, in large systems the time-dependent global density of the resident allele is well approximated by Avrami's law.Comment: Computer Simulation Studies in Condensed Matter Physics XVIII, edited by D.P. Landau, S.P. Lewis, and H.-B. Schuttler, (Springer, Heidelberg, Berlin, in press

Investigation of the Fundamental Reliability Unit for Cu Dual-Damascene Metallization

An investigation has been carried out to determine the fundamental reliability unit of copper dual-damascene metallization. Electromigration experiments have been carried out on straight via-to-via interconnects in the lower metal (M1) and the upper metal (M2), and in a simple interconnect tree structure consisting of straight via-to-via line with an extra via in the middle of the line (a "dotted-I"). Multiple failure mechanisms have been observed during electromigration testing of via-to-via Cu interconnects. The failure times of the M2 test structures are significantly longer than that of identical M1 structures. It is proposed that this asymmetry is the result of a difference in the location of void formation and growth, which is believed to be related to the ease of electromigration-induced void nucleation and growth at the Cu/Si₃N₄ interface. However, voids were also detected in the vias instead of in the Cu lines for some cases of early failure of the test lines. These early failures are suspected to be related to the integrity and reliability of the Cu via. Different magnitudes and directions of electrical current were applied independently in two segments of the interconnect tree structure. As with Al-based interconnects, the reliability of a segment in this tree strongly depends on the stress conditions of the connected segment. Beyond this, there are important differences in the results obtained under similar test conditions for Al-based and Cu-based interconnect trees. These differences are thought to be associated with variations in the architectural schemes of the two metallizations. The absence of a conducting electromigration-resistant overlayer in Cu technology allows smaller voids to cause failure in Cu compared to Al. Moreover, the Si₃N₄ overlayer that serves as an interlevel diffusion barrier provides sites for easy nucleation of voids and also provides a high diffusivity path for electromigration. The results reported here suggest that while segments are not the fundamental reliability unit for circuit-level reliability assessments for Al or Cu, vias, rather than trees, might be the appropriate fundamental units for the assessment of Cu reliability.Singapore-MIT Alliance (SMA