47 research outputs found
5 x 20 Gb/s heterogeneously integrated III-V on silicon electro-absorption modulator array with arrayed waveguide grating multiplexer
Ultra-compact lithium niobate photonic chip for high-capacity and energy-efficient wavelength-division-multiplexing transmitters
Recently, high-performance thin-film lithium niobate optical modulators have emerged that, together with advanced multiplexing technologies, are highly expected to satisfy the ever-growing demand for high-capacity optical interconnects utilizing multiple channels. Accordingly, in this study, a compact lithium-niobate-on-insulator (LNOI) photonic chip was adopted to establish four-channel wavelength-division-multiplexing (WDM) transmitters, comprising four optical modulators based on ultracompact 2 × 2 Fabry-Perot cavities and a four-channel WDM filter based on multimode waveguide gratings. The fabricated chip with four wavelength channels has a total footprint as compact as 0.3 × 2.8 mm2, and exhibits an excess loss of ~0.8 dB as well as low inter-channel crosstalk of < –22 dB. Using this LNOI photonic chip, high-capacity data transmissions of 320 Gbps (4 × 80 Gbps) on-off-keying signals and 400 Gbps (4 × 100 Gbps) four-level pulse amplitude signals were successfully realized with the ultra-low power consumption of 11.9 fJ/bit
5 x 20 Gb/s III-V on silicon electroabsorption modulator array heterogeneously integrated with a 1.6nm channel-spacing silicon AWG
We demonstrate a five-channel wavelength division multiplexed modulator module that heterogeneously integrates a 1.6nm channel-spacing arrayed-waveguide grating and a 20Gbps electroabsorption modulator array, showing the potential for 100 Gbps capacity on a 1.5x0.5 mm(2) footprint
5 x 20 Gb/s heterogeneously integrated III-V on silicon electro-absorption modulator array with arrayed waveguide grating multiplexer
Design, Simulation and Characterization of Some Planar Lightwave Circuits
Optical devices based on planar lightwave circuit (PLC) technology have the advantages of small size, high reliability, possibility for large scale production, and potential integration with electronics. These devices are widely employed in optical telecommunications, sensing, data storage, imaging, and signal processing. This thesis focuses on some selected PLC based devices, such as power splitters, demultiplexers, triplexers and polarization beam splitters. First, the basic principle of the waveguides and the simulation methods for PLC devices are discussed. A novel effective index method is introduced to reduce a two-dimensional structure to a one-dimensional one, and can be implemented for arbitrarily shaped waveguides. Numerical methods, such as finite-difference mode solver, beam propagation method, finite-difference time-domain method are introduced to analysis the mode profile of the waveguides, and the propagation properties of light in PLC devices. Multimode interference (MMI) couplers are widely used in many PLCs, such as power splitters, ring lasers, optical switches, and wavelength division multiplexers/demultiplexers. In this work, concepts for improving the self-imaging quality of MMI couplers are analyzed and new designs are proposed. A significant improvement in performance together with compact sizes were obtained with taper sections at the input/output of MMI couplers based on SOI, and deeply etched ridges in MMI couplers based on SiO2. A polarization insensitive dual wavelength demultiplexer based on sandwiched MMI waveguides was presented. Novel devices including triplexers and polarization beam splitters were realized by using photonic crystal (PhC) structures. Two stages of directional couplers based on PhC waveguides are cascaded to form an ultracompact triplexer. The special decoupling property of the PhC waveguide based directional coupler was utilized in the design. A novel polarization beam splitter was realized by combining a MMI coupler and a PhC which works as a polarization sensitive reflector. Finally, fabrication and optical characterization of an ultra-compact directional coupler and PhC structures in InP are presented. In a single etching step, by using the lag-effect in inductively coupled plasma reactive ion etching, a compact directional coupler (55 μm) is demonstrated. Carrier life times in PhC structures etched by chemically assisted ion beam etching were investigated, for emitter and switching applications.QC 2010090