Development of a multimaterial additive manufacturing process for electronic devices

In order to increase the versatility of additive manufacturing multimaterial processes, a hybrid system has been developed, which is capable of combin ing 3D printing technology by DLP (Digital Light Processing) with a two - dimensional Drop - on - Demand Inkjet printing system. Through DLP technology based on digital micromirror devices (DMDs) it is possible to build up 3D geometries layer - by - layer using polyme rization of photo sensitive resins. Concurrently, while the construction process is performed, the I nk J et printing system is used to deposit tiny drops of conductive inks on the substrate generated, which will thus constitute an electric circuit embedded within the three dimensional structure. On the other hand, photo sensitive resins have been filled with Low Te mperature Co - f iring Ceramic (LT CC) particles , in order to modify the basis properties of the part by using sinterizable slurries. Finally the challenges in the sintering process for achieving functional parts are discussed and a few prototypes have been built in order t o validate this technologyPostprint (author's final draft

Development of a multi-material additive manufacturing process for electronic devices

In order to increas e the versatility of additive manufacturing multimaterial processes, a hybrid system has been developed, which is capable of combining 3D printing technology by DLP (Digital Light Processing) with a two -dimensional Drop- on-Demand Inkjet printing system. Through DLP technology based on digital micromirror devices (DMDs) it is possible to build up 3D geometries layer -by-layer using polymerization of photosensitive resins. Concurrently, while the construction process is performed, the InkJet printing system is used to deposit tiny drops of conductive inks on the substrate generated, which will thus constitute an electric circuit em bedded within the three dimensional structure. On the other hand, photosensitive resins have been filled with Low Temperature Co- firing Ceramic (LTCC) particles, in order to modify the basis properties of the part by using sinterizable slurries. Finally the challenges in the sintering process for a chieving functional parts are discussed and a few prototypes have been built in order to validate this technologyPeer Reviewe

Development of a multimaterial additive manufacturing process for electronic devices

In order to increase the versatility of additive manufacturing multimaterial processes, a hybrid system has been developed, which is capable of combining 3D printing technology by DLP (Digital Light Processing) with a two-dimensional Drop-on-Demand Inkjet printing system. Through DLP technology based on digital micromirror devices (DMDs) it is possible to build up 3D geometries layer-by-layer using polymerization of photosensitive resins. Concurrently, while the construction process is performed, the InkJet printing system is used to deposit tiny drops of conductive inks on the substrate generated, which will thus constitute an electric circuit embedded within the three dimensional structure. On the other hand, photosensitive resins have been filled with Low Temperature Co-firing Ceramic (LTCC) particles, in order to modify the basis properties of the part by using sinterizable slurries. Finally the challenges in the sintering process for achieving functional parts are discussed and a few prototypes have been built in order to validate this technology.Peer Reviewe

Development of a multimaterial additive manufacturing process for electronic devices

In order to increase the versatility of additive manufacturing multimaterial processes, a hybrid system has been developed, which is capable of combin ing 3D printing technology by DLP (Digital Light Processing) with a two - dimensional Drop - on - Demand Inkjet printing system. Through DLP technology based on digital micromirror devices (DMDs) it is possible to build up 3D geometries layer - by - layer using polyme rization of photo sensitive resins. Concurrently, while the construction process is performed, the I nk J et printing system is used to deposit tiny drops of conductive inks on the substrate generated, which will thus constitute an electric circuit embedded within the three dimensional structure. On the other hand, photo sensitive resins have been filled with Low Te mperature Co - f iring Ceramic (LT CC) particles , in order to modify the basis properties of the part by using sinterizable slurries. Finally the challenges in the sintering process for achieving functional parts are discussed and a few prototypes have been built in order t o validate this technolog