Sing Again That Sweet Refrain

https://digitalcommons.library.umaine.edu/mmb-vp/6766/thumbnail.jp

L'homme qui aime les maisons

Cet article contient des citations et est basé sur un interview de Wouter Van Acker par Baudouin Van Humbeeckinfo:eu-repo/semantics/publishe

Solid state diffusion in Cu-Sn and Ni-Sn diffusion couples with flip-chip scale dimensions

The formation and growth rate of intermetallics of frequently used metallisation systems for flip-chip bumping have been studied and are reported for many years. However, no data are available on diffusion couples with flip-chip processing methods and actual flip-chip scale dimensions. In this paper, the interdiffusion coefficients and activation energies of Cu-Sn and Ni-Sn intermetallic formations are measured on flip-chip bumps with 40 µm bond pad diameter. Also the morphology of the metallurgical reactions is described. Furthermore, the ideal case of a binary diffusion system is seldom present in real-life. In practice, the presence of additional alloying elements has an impact on the intermetallic stoichiometry and even on intermetallic growth and morphology. It is shown that small quantities of Cu in a Ni-Sn system can have a beneficial effect on the Ni consumption but larger quantities result in extreme scalloping of the intermetallic interface.status: publishe

Inference of well-typings for logic programs with application to termination analysis

status: publishe