Embedding of fibre optic sensors within flexible host

This work deals with the establishment of a UV polymerisation procedure combined with moulding technology towards the development of a mass production technology for the fabrication of flexible polymers with optical fibres embedded. The concept is to provide an artificial sensing skin based on fibre optic sensors which can be applied to irregular or moveable surfaces for distributed pressure applications, as for instance in structural monitoring or rehabilitation. The selected polymers for such an application are here reviewed and their composition adjusted in order to accommodate the required flexibility. As compared to other techniques, UV polymerisation advantages are pointed out when moving towards industrial applications and large scale productions. Meanwhile, curing tests to embed optical fibres in the developed polymers are carried out with an in house developed glass mould set-up and the results are presented. Laser ablation of polymers is also discussed in order to reply the demand of complex fibre layout as for example meandering or curved shape patterns

Development of sensitive skin based on distributed PCF-Bragg grating sensors

© euspen Headquarters. This work deals with the development of a new paradigm towards the full integration of PCF-Bragg grating sensors and opto-electronic components within flexible polymer foils. Dedicated material was tailored to the required flexibility for sensitive skin. Additionally, UV polymerization process was applied to produce the final skin with fibres embedded. Compatible moulds for embedding fibres both in a cylindrical polymer tube and large area flat polymer foil are presented.status: publishe

An array waveguide sensor for artificial optical skins

We present a concept for an artificial optical skin, a flexible foil in which a novel type of optical force sensing elements is integrated. The principle relies on the change in coupling between two arrays of crossing polymer waveguides separated by a thin layer of soft silicone. When the exerted pressure is increasing, the distance between the waveguides decreases and consequently power is transmitted from one to another. A process flow to produce a proof of principle demonstrator with arrays of Truemode (TM) waveguides embedded in silicone is described. In a second approach also the waveguides are fabricated in silicone using an embossing technique

Ultrathin optoelectronic device packaging in flexible carriers

This paper presents the development of an advanced packaging technique for commercially available optoelectronic devices. Vertical Cavity Surface Emitting Laser diodes and Photodiodes are thinned down to 20 µm thickness, and are embedded in flexible carriers, resulting in a 75 µm thin package, which can be bent down to a bending radius of 2 mm. Electrical, optical and mechanical characterization addresses the influence of thinning and embedding of bare optoelectronic chips on their main properties. Next to the embedded optoelectronics, also electrical Integrated Circuits like amplifiers and drivers can be housed in the same thin flexible package, using an identical technology and layer build-up. Finally, this new packaging approach is demonstrated in two different integrated sensor applications and in an integrated optical interconnection. For the latter application, also waveguides and optical out-of-plane coupling elements are integrated in the package and the complete system reliability is assessed by accelerated aging tests