Ion formation in an argon and argon-oxygen gas mixture of a magnetron sputtering discharge

Formation of singly and doubly charged Arq+ and Tiq+ (q = 1,2) and of molecular Ar 2 +, ArTi+, and Ti 2 + ions in a direct current magnetron sputtering discharge with a Ti cathode and argon as working gas was investigated with the help of energy-resolved mass spectrometry. Measured ion energy distributions consist of low-energy and high-energy components resembling different formation processes. Intensities of Ar 2 + and ArTi+ dimer ions strongly increase with increasing gas pressure. Addition of oxygen gas leads to the formation of positively charged O+, O2 +, and TiO+ and of negatively charged O− and O2 - ions

Growth and properties of Ti-Cu films with respect to plasma parameters in dual-magnetron sputtering discharges

Properties of different methods of magnetron sputtering (dc-MS, dual-MS and dual-HiPIMS) are studied and compared with respect to intermetallic Ti-Cu film formation. The quality and features of thin films are strongly influenced by the energy of incoming particles. The ion velocity distribution functions (IVDFs) were measured by time-resolved retarding field analyzer (RFA) in the substrate position. Thin films were characterized by X-ray photoelectron spectroscopy (XPS), X-ray diffractometry (XRD) and X-ray reflectometry (XR). Properties and crystallography of Ti-Cu films are discussed as a function of ion energy which is affected by the mode of sputtering. It was found that IVDFs measured in pulsed discharges exhibit double-peak distribution. The IVDFs reach the maximum at ion energies about  ~8 eV. The ion saturated current is highest in dual-HiPIMS discharge (~5 μA/cm2) and is mostly represented by Cu+ and Ar+ ions. The mode of sputtering influences chemical composition and film formation. The copper forms polycrystalline fcc-phase while much smaller Ti particles enwraps the copper crystallites or are part of a solid solution

Analysis of the release characteristics of Cu-treated antimicrobial implant surfaces using atomic absorption spectrometry

New developments of antimicrobial implant surfaces doped with copper (Cu) ions may minimize the risk of implant-associated infections. However, experimental evaluation of the Cu release is influenced by various test parameters. The aim of our study was to evaluate the Cu release characteristics in vitro according to the storage fluid and surface roughness. Plasma immersion ion implantation of Cu (Cu-PIII) and pulsed magnetron sputtering process of a titanium copper film (Ti-Cu) were applied to titanium alloy (Ti6Al4V) samples with different surface finishing of the implant material (polished, hydroxyapatite and corundum blasted). The samples were submersed into either double-distilled water, human serum, or cell culture medium. Subsequently, the Cu concentration in the supernatant was measured using atomic absorption spectrometry. The test fluid as well as the surface roughness can alter the Cu release significantly, whereby the highest Cu release was determined for samples with corundum-blasted surfaces stored in cell medium