21,685 research outputs found

    The NASA, Marshall Space Flight Center drop tube user's manual

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    A comprehensive description of the structural and instrumentation hardware and the experimental capabilities of the 105-meter Marshall Space Flight Center Drop Tube Facility is given. This document is to serve as a guide to the investigator who wishes to perform materials processing experiments in the Drop Tube. Particular attention is given to the Tube's hardware to which an investigator must interface to perform experiments. This hardware consists of the permanent structural hardware (with such items as vacuum flanges), and the experimental hardware (with the furnaces and the sample insertion devices). Two furnaces, an electron-beam and an electromagnetic levitator, are currently used to melt metallic samples in a process environment that can range from 10(exp -6) Torr to 1 atmosphere. Details of these furnaces, the processing environment gases/vacuum, the electrical power, and data acquisition capabilities are specified to allow an investigator to design his/her experiment to maximize successful results and to reduce experimental setup time on the Tube. Various devices used to catch samples while inflicting minimum damage and to enhance turnaround time between experiments are described. Enough information is provided to allow an investigator who wishes to build his/her own furnace or sample catch devices to easily interface it to the Tube. The experimental instrumentation and data acquisition systems used to perform pre-drop and in-flight measurements of the melting and solidification process are also detailed. Typical experimental results are presented as an indicator of the type of data that is provided by the Drop Tube Facility. A summary bibliography of past Drop Tube experiments is provided, and an appendix explaining the noncontact temperature determination of free-falling drops is provided. This document is to be revised occasionally as improvements to the Facility are made and as the summary bibliography grows

    Particle Gibbs with Ancestor Sampling

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    Particle Markov chain Monte Carlo (PMCMC) is a systematic way of combining the two main tools used for Monte Carlo statistical inference: sequential Monte Carlo (SMC) and Markov chain Monte Carlo (MCMC). We present a novel PMCMC algorithm that we refer to as particle Gibbs with ancestor sampling (PGAS). PGAS provides the data analyst with an off-the-shelf class of Markov kernels that can be used to simulate the typically high-dimensional and highly autocorrelated state trajectory in a state-space model. The ancestor sampling procedure enables fast mixing of the PGAS kernel even when using seemingly few particles in the underlying SMC sampler. This is important as it can significantly reduce the computational burden that is typically associated with using SMC. PGAS is conceptually similar to the existing PG with backward simulation (PGBS) procedure. Instead of using separate forward and backward sweeps as in PGBS, however, we achieve the same effect in a single forward sweep. This makes PGAS well suited for addressing inference problems not only in state-space models, but also in models with more complex dependencies, such as non-Markovian, Bayesian nonparametric, and general probabilistic graphical models

    Variable force and visual feedback effects on teleoperator man/machine performance

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    An experimental study was conducted to determine the effects of various forms of visual and force feedback on human performance for several telemanipulation tasks. Experiments were conducted with varying frame rates and subtended visual angles, with and without force feedback

    Thermal shock testing for assuring reliability of glass-sealed microelectronic packages

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    Tests were performed to determine if thermal shocking is destructive to glass-to-metal seal microelectronic packages and if thermal shock step stressing can compare package reliabilities. Thermal shocking was shown to be not destructive to highly reliable glass seals. Pin-pull tests used to compare the interfacial pin glass strengths showed no differences between thermal shocked and not-thermal shocked headers. A 'critical stress resistance temperature' was not exhibited by the 14 pin Dual In-line Package (DIP) headers evaluated. Headers manufactured in cryogenic nitrogen based and exothermically generated atmospheres showed differences in as-received leak rates, residual oxide depths and pin glass interfacial strengths; these were caused by the different manufacturing methods, in particular, by the chemically etched pins used by one manufacturer. Both header types passed thermal shock tests to temperature differentials of 646 C. The sensitivity of helium leak rate measurements was improved up to 70 percent by baking headers for two hours at 200 C after thermal shocking
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