Study of an intelligent hexapod walking robot

Concerns a hexapod walking robot designed for use in living and working spaces where it is necessary to ascend and descend structures such as stairs. It is designed to carry loads while always maintaining horizontal balance. It has eight CPUs for controlling the movement of twenty driving motors and for detecting attitude and its environment. It can move around autonomously as well as according to the operator's commands. The robot's configuration, structure and mechanism, and intelligence, are discussed</p

Numerical analysis in Ar-H2 coupled-coil inductively coupled thermal plasma with Si feedstock for stable operation

In nanopowder synthesis, the starting powder to be evaporated is infused in a plasma torch through the upper coil and the lower coil in the coupled model of inductively coupled thermal plasma (coupled-coil inductively coupled thermal plasma (ICTP)). Mixing these evaporated materials to form the coupled ICTP significantly influences the thermodynamic and transport properties. It is essential to understand these complex interactions between coupled ICTP and feedstock evaporation. This research investigated the thermal interactions between silicon raw material powder (Si) with ICTP in coupled 99%Ar/1%H2 through the numerical model developed for the synthesis of Si nanopowder. The feed rate of the Si raw material was set at 0.05, 0.1, and 0.5 g/min. This implies that the increased Si feed is too heavy to vaporize all the injected feed

Studies on the physiological roles of Transcription factor c-Myb and its Coactivator CBP in vivo

Thesis (Ph. D. in Science)--University of Tsukuba, (A), no. 1797, 1998.3.2

Influence of copper vapor contamination on dielectric properties of hot air at 300-3500 K in atmospheric pressure

金沢大学工学部The influence of copper vapor contamination on the dielectric properties of hot air at atmospheric pressure was numerically predicted in heavy particle temperature range 300-3500 K. Dielectric properties of hot gases are very important for effective design of switching devices and other applications. Copper vapor is known to be injected from the electrodes into the hot gas during arc interruption in a circuit breaker, which may substantially affect the dielectric strength of the hot gas. Analysis of equilibrium composition for a hot air contaminated with copper vapor and computations of Boltzmann equation made it possible to study the dielectric properties of interest. The result indicates that 1.0% copper vapor contamination remarkably increases the effective ionization coefficient ᾱ and thereby decreases the critical electric field (E/N)cr drastically. This arises from a much lower ionization potential of the copper atom. © 2005 IEEE

Thermally and chemically non-equilibrium modelling of Ar-N2-H2 inductively coupled plasmas at reduced pressure

金沢大学理工研究域電子情報学系A two-dimensional thermally and chemically non-equilibrium model was developed for Ar-N2-H2 inductively coupled plasmas (ICP) at reduced pressure. The Ar-N2-H2 or Ar-NH3 plasmas at reduced pressure has been widely used for nitriding processing of materials. Totally 164 reactions including 82 forward reactions and their backward reactions were taken into account. Spatial particle composition distribution in the plasma torch as well as in the reaction chamber was derived by solving simultaneously the mass conservation equation of each particle, considering diffusion, convection and production terms. © 2009 Elsevier B.V. All rights reserved

Influence of input power in Ar/H2 thermal plasma with silicon powder by numerical simulation

Numerical simulation in inductively coupled thermal plasma was made on the temperature distribution in argon (Ar)+hydrogen (H2) induction thermal plasma torch with silicon (Si) powder injection to obtain the temperature distribution and gas flow fields. The ICTP model was used in this research because it has benefit of good repeatability and no contamination process. Interactions between ICTP and injected powder are very complicated to be understood only by related experiments. Influence of input power in ICTP was numerically investigated on thermal plasma temperature fields and powder evaporation. The temperature distributions of thermal plasma and Si vapor distribution were compared at input powers of 20 kW, 30 kW, and 40 kW. Results indicated that higher input power increases the temperature of the thermal plasma with doughnut shape but it slightly enhances evaporation of the powder at the center axis of the plasma torch