54 research outputs found

    Ultrathin gate oxide reliability: physical models, statistics, and characterization

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    A Macroporous TiO2 Oxygen Sensor Fabricated Using Anodic Aluminium Oxide as an Etching Mask

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    An innovative fabrication method to produce a macroporous Si surface by employing an anodic aluminium oxide (AAO) nanopore array layer as an etching template is presented. Combining AAO with a reactive ion etching (RIE) processes, a homogeneous and macroporous silicon surface can be effectively configured by modulating AAO process parameters and alumina film thickness, thus hopefully replacing conventional photolithography and electrochemical etch methods. The hybrid process integration is considered fully CMOS compatible thanks to the low-temperature AAO and CMOS processes. The gas-sensing characteristics of 50 nm TiO2 nanofilms deposited on the macroporous surface are compared with those of conventional plain (or non-porous) nanofilms to verify reduced response noise and improved sensitivity as a result of their macroporosity. Our experimental results reveal that macroporous geometry of the TiO2 chemoresistive gas sensor demonstrates 2-fold higher (∌33%) improved sensitivity than a non-porous sensor at different levels of oxygen exposure. In addition, the macroporous device exhibits excellent discrimination capability and significantly lessened response noise at 500 °C. Experimental results indicate that the hybrid process of such miniature and macroporous devices are compatible as well as applicable to integrated next generation bio-chemical sensors

    Combinatorial Study of Ni-Ti-Pt Ternary Metal Gate Electrodes on HfO\u3csub\u3e2\u3c/sub\u3e for the Advanced Gate Stack

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    The authors have fabricated combinatorial Ni–Ti–Pt ternary metal gate thin film libraries on HfO2 using magnetron co-sputtering to investigate flatband voltage shift (ΔVfb) , work function (Ωm) , and leakage current density (JL) variations. A more negative ΔVfb is observed close to the Ti-rich corner than at the Ni- and Pt-rich corners, implying smaller Ωm near the Ti-rich corners and higher Ωm near the Ni- and Pt-rich corners. In addition, measured JL values can be explained consistently with the observed Ωm variations. Combinatorial methodologies prove to be useful in surveying the large compositional space of ternary alloymetal gate electrode systems

    Q&A. What Is the Secret of Red Hat's Success?

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    Raspberry Pi hacks

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    Channel Hot-Electron Degradation On 60-Nm Hfo2-Gated Nmosfet Dc And Rf Performances

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    Channel hot-carrier-induced dc and RF performance degradations in 60-nm high-k nMOSFETs are examined experimentally. RF performances such as the cutoff frequency, noise figure, linearity, and flicker noise of high-k MOSFETs show significant vulnerability to the hot-electron effect. Analytical equations for normalized RF degradations relating to the device dc and ac parameters are derived. Good agreement between the analytical predictions and experimental data is obtained. The accuracy of the model equations suggests fast and effective evaluation of noise figure and linearity degradations using simple dc and ac parameters directly. © 2006 IEEE

    Quasi Three-Dimensional Simulation of Heat Transport in Thermal-Based Microsensors

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    Band offsets of Al2O3/InxGa1-xAs (x=0.53 and 0.75) and the effects of postdeposition annealing

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    Band offsets at the interfaces of InxGa1-xAs/Al2O3/Al where x=0.53 and 0.75 were determined by internal photoemission and spectroscopic ellipsometry. The photoemission energy threshold at the InxGa1-xAs/Al2O3 interface was found to be insensitive to the indium composition but shifted to a lower energy after a postdeposition annealing at high temperatures. Subthreshold electron photoemission was also observed for the annealed sample and was attributed to interfacial layer formation during the annealing process

    A Tutorial Introduction to IoT Design and Prototyping with Examples

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    The dramatic drop in price of computing hardware, coupled with the recent breakthroughs in embedded systems design that enabled the integration of high‐level software and low‐level electronics, have created a paradigm shift in embedded systems development. This has led to the development of different varieties of user‐friendly Internet of Things (IoT) hardware development platforms for IoT prototyping. The ubiquity of such prototyping platforms has undoubtedly contributed toward the explosive growth of the IoT, which is already seeping into all areas of human endeavor, including transportation, logistics, business, and healthcare. Building IoT projects that can be controlled over the Internet can be challenging, especially for beginners. This chapter discusses the design and development of prototypes for IoT applications with focus on Arduino and Raspberry Pi platforms. The aim is to provide insightful information on best practices for designing and prototyping IoT projects, as well as to serve as step‐by‐step guidelines for beginners
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