21 research outputs found
Ion formation in an argon and argon-oxygen gas mixture of a magnetron sputtering discharge
Formation of singly and doubly charged Arq+ and Tiq+ (q = 1,2) and of molecular Ar 2 +, ArTi+, and Ti 2 + ions in a direct current magnetron sputtering discharge with a Ti cathode and argon as working gas was investigated with the help of energy-resolved mass spectrometry. Measured ion energy distributions consist of low-energy and high-energy components resembling different formation processes. Intensities of Ar 2 + and ArTi+ dimer ions strongly increase with increasing gas pressure. Addition of oxygen gas leads to the formation of positively charged O+, O2 +, and TiO+ and of negatively charged O− and O2 - ions
Growth and properties of Ti-Cu films with respect to plasma parameters in dual-magnetron sputtering discharges
Properties of different methods of magnetron sputtering (dc-MS, dual-MS and dual-HiPIMS)
are studied and compared with respect to intermetallic Ti-Cu film formation. The quality
and features of thin films are strongly influenced by the energy of incoming particles.
The ion velocity distribution functions (IVDFs) were measured by time-resolved retarding
field analyzer (RFA) in the substrate position. Thin films were characterized by X-ray
photoelectron spectroscopy (XPS), X-ray diffractometry (XRD) and X-ray reflectometry (XR).
Properties and crystallography of Ti-Cu films are discussed as a function of ion energy
which is affected by the mode of sputtering. It was found that IVDFs measured in pulsed
discharges exhibit double-peak distribution. The IVDFs reach the maximum at ion energies
about ~8 eV. The ion saturated current is highest in dual-HiPIMS discharge
(~5 μA/cm2) and is mostly represented by Cu+
and Ar+ ions. The mode of sputtering influences chemical composition and film
formation. The copper forms polycrystalline fcc-phase while much smaller Ti particles
enwraps the copper crystallites or are part of a solid solution
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Analysis of the release characteristics of Cu-treated antimicrobial implant surfaces using atomic absorption spectrometry
New developments of antimicrobial implant surfaces doped with copper (Cu) ions may minimize the risk of implant-associated infections. However, experimental evaluation of the Cu release is influenced by various test parameters. The aim of our study was to evaluate the Cu release characteristics in vitro according to the storage fluid and surface roughness. Plasma immersion ion implantation of Cu (Cu-PIII) and pulsed magnetron sputtering process of a titanium copper film (Ti-Cu) were applied to titanium alloy (Ti6Al4V) samples with different surface finishing of the implant material (polished, hydroxyapatite and corundum blasted). The samples were submersed into either double-distilled water, human serum, or cell culture medium. Subsequently, the Cu concentration in the supernatant was measured using atomic absorption spectrometry. The test fluid as well as the surface roughness can alter the Cu release significantly, whereby the highest Cu release was determined for samples with corundum-blasted surfaces stored in cell medium