Thermal enclosures for electronically scanned pressure modules operating in cryogenic environments

Specific guidelines to design, construct, and test ESP thermal enclosures for applications at cryogenic temperatures are given. The enclosures maintain the ESP modules at a constant temperature (10 C plus or minus 1 C) to minimize thermal zero and sensitivity shifts, to minimize the frequency of expensive on-line calibrations, and to avoid adverse effects on tunnel and model boundary layers. The enclosures are constructed of a rigid closed-cell foam and are capable of withstanding the stagnation pressures to 932kPa (135 psia) without reduction in thermal insulation properties. This construction procedure has been used to construct several thermal packages which have been successfully used in National Transonic Facility

Compact Infrasonic Windscreen

A compact windscreen has been conceived for a microphone of a type used outdoors to detect atmospheric infrasound from a variety of natural and manmade sources. Wind at the microphone site contaminates received infrasonic signals (defined here as sounds having frequencies <20 Hz), because a microphone cannot distinguish between infrasonic pressures (which propagate at the speed of sound) and convective pressure fluctuations generated by wind turbulence. Hence, success in measurement of outdoor infrasound depends on effective screening of the microphone from the wind. The present compact windscreen is based on a principle: that infrasound at sufficiently large wavelength can penetrate any barrier of practical thickness. Thus, a windscreen having solid, non-porous walls can block convected pressure fluctuations from the wind while transmitting infrasonic acoustic waves. The transmission coefficient depends strongly upon the ratio between the acoustic impedance of the windscreen and that of air. Several materials have been found to have impedance ratios that render them suitable for use in constructing walls that have practical thicknesses and are capable of high transmission of infrasound. These materials (with their impedance ratios in parentheses) are polyurethane foam (222), space shuttle tile material (332), balsa (323), cedar (3,151), and pine (4,713)

Device and method for measuring thermal conductivity of thin films

A device and method are provided for measuring the thermal conductivity of rigid or flexible, homogeneous or heterogeneous, thin films between 50 .mu.m and 150 .mu.m thick with relative standard deviations of less than five percent. The specimen is sandwiched between like material, highly conductive upper and lower slabs. Each slab is instrumented with six thermocouples embedded within the slab and flush with their corresponding surfaces. A heat source heats the lower slab and a heat sink cools the upper slab. The heat sink also provides sufficient contact pressure onto the specimen. Testing is performed within a vacuum environment (bell-jar) between 10.sup.-3 to 10.sup.-6 Torr. An anti-radiant shield on the interior surface of the bell-jar is used to avoid radiation heat losses. Insulation is placed adjacent to the heat source and adjacent to the heat sink to prevent conduction losses. A temperature controlled water circulator circulates water from a constant temperature bath through the heat sink. Fourier's one-dimensional law of heat conduction is the governing equation. Data, including temperatures, are measured with a multi-channel data acquisition system. On-line computer processing is used for thermal conductivity calculations

Application of MEMS Microphone Array Technology to Airframe Noise Measurements

Current generation microphone directional array instrumentation is capable of extracting accurate noise source location and directivity data on a variety of aircraft components, resulting in significant gains in test productivity. However, with this gain in productivity has come the desire to install larger and more complex arrays in a variety of ground test facilities, creating new challenges for the designers of array systems. To overcome these challenges, a research study was initiated to identify and develop hardware and fabrication technologies which could be used to construct an array system exhibiting acceptable measurement performance but at much lower cost and with much simpler installation requirements. This paper describes an effort to fabricate a 128-sensor array using commercially available Micro-Electro-Mechanical System (MEMS) microphones. The MEMS array was used to acquire noise data for an isolated 26%-scale high-fidelity Boeing 777 landing gear in the Virginia Polytechnic Institute and State University Stability Tunnel across a range of Mach numbers. The overall performance of the array was excellent, and major noise sources were successfully identified from the measurements

Arrays of Miniature Microphones for Aeroacoustic Testing

A phased-array system comprised of custom-made and commercially available microelectromechanical system (MEMS) silicon microphones and custom ancillary hardware has been developed for use in aeroacoustic testing in hard-walled and acoustically treated wind tunnels. Recent advances in the areas of multi-channel signal processing and beam forming have driven the construction of phased arrays containing ever-greater numbers of microphones. Traditional obstacles to this trend have been posed by (1) the high costs of conventional condenser microphones, associated cabling, and support electronics and (2) the difficulty of mounting conventional microphones in the precise locations required for high-density arrays. The present development overcomes these obstacles. One of the hallmarks of the new system is a series of fabricated platforms on which multiple microphones can be mounted. These mounting platforms, consisting of flexible polyimide circuit-board material (see left side of figure), include all the necessary microphone power and signal interconnects. A single bus line connects all microphones to a common power supply, while the signal lines terminate in one or more data buses on the sides of the circuit board. To minimize cross talk between array channels, ground lines are interposed as shields between all the data bus signal lines. The MEMS microphones are electrically connected to the boards via solder pads that are built into the printed wiring. These flexible circuit boards share many characteristics with their traditional rigid counterparts, but can be manufactured much thinner, as small as 0.1 millimeter, and much lighter with boards weighing as much as 75 percent less than traditional rigid ones. For a typical hard-walled wind-tunnel installation, the flexible printed-circuit board is bonded to the tunnel wall and covered with a face sheet that contains precise cutouts for the microphones. Once the face sheet is mounted, a smooth surface is established over the entire array due to the flush mounting of all microphones (see right side of figure). The face sheet is made from a continuous glass-woven-fabric base impregnated with an epoxy resin binder. This material offers a combination of high mechanical strength and low dielectric loss, making it suitable for withstanding the harsh test section environment present in many wind tunnels, while at the same time protecting the underlying polyimide board. Customized signal-conditioning hardware consisting of line drivers and antialiasing filters are coupled with the array. The line drivers are constructed using low-supply-current, high-gain-bandwidth operational amplifiers designed to transmit the microphone signals several dozen feet from the array to external acquisition hardware. The anti-alias filters consist of individual Chebyshev low-pass filters (one for each microphone channel) housed on small printed-circuit boards mounted on one or more motherboards. The mother/daughter board design results in a modular system, which is easy to debug and service and which enables the filter characteristics to be changed by swapping daughter boards with ones containing different filter parameters. The filter outputs are passed to commercially- available acquisition hardware to digitize and store the conditioned microphone signals. Wind-tunnel testing of the new MEMS microphone polyimide mounting system shows that the array performance is comparable to that of traditional arrays, but with significantly less cost of construction

Development of Temperature Sensitive Paints for the Detection of Small Temperature Differences

Temperature sensitive paints (TSP s) have recently been used to detect small temperature differences on aerodynamic model surfaces. These types of applications impose stringent performance requirements on a paint system. The TSP s must operate over a broad temperature range, must be physically robust (cannot chip or peel), must be polishable to at least the smoothness of the model surface, and must have sufficient sensitivity to detect small temperature differences. TSP coatings based on the use of metal complexes in polymer binders were developed at NASA Langley Research Center which meet most of the requirements for detection of small temperature differences under severe environmental conditions