3DIP: An iterative partitioning tool for monolithic 3D IC

Conference of 2016 IEEE International 3D Systems Integration Conference, 3DIC 2016 ; Conference Date: 8 November 2016 Through 11 November 2016; Conference Code:129057International audienceCoolCubeTM is a monolithic 3D (M3D) technology offering a vertical density of integration 20 times higher than face to face copper hybrid bonding (F2F Cu-Cu), thanks to ultra-thin Monolithic Inter-tier Vias (MIVs). In this work, we propose a new partitioning tool exploiting this characteristic for 2-tier Cell-on-Cell ICs before placement. It is based on a fast and iterative algorithm that explores the space of solutions and minimizes the estimated cost of wires with balanced area between tiers without limiting the number of MIVs. A mathematical formulation of the 3D partitioning problem and a comprehensive framework, based on simulated annealing (SA) algorithm coupled with a dedicated cost function, are detailed and compared with Min-Cut (MC) partitions commonly used. It appears that our solution can decrease the estimated total cost of wires by 41% and 45% for the LDPC and FFT/AES units. It also reduces the total cost of wires by 30% to 44% compared to the MC algorithm for the same units and with no significant increase in runtime

Une agronomie clinique et territoriale pour accompagner la transition vers une économie circulaire autour de l’agriculture : mise à l’épreuve et enseignements du projet GABiR à La Réunion

International audienceAs circular economy (CE) emerges as a new economic and societal paradigm, the role of agricultural sector to increase circularity in territories is questioned. This questioning is all the more relevant inan insular context like Reunion Island, where food and energy autonomy are major challenges. From 2017 to 2020, a Research and Development project entitled GABIR (Gestion Agricole desBiomasses sur l’île de la Reunion) mobilized actors from Development, Educational Training and Research, including many agronomists from different disciplines, but also policy makers. Thisproject aimed to strengthen the inclusion of agricultural sector in the island's CE through a territorial approach of biomass flows valued or valuable in agriculture. Based on the projectexperience and achievements, a generic methodological framework, related to a clinical approach at territorial level and aiming to accompany CE transitions, including the agricultural sector, isproposed.Alors que l’économie circulaire (EC) comme nouveau paradigme économique et sociétal émerge, la place du secteur agricole dans les initiatives d’accroissement de la circularité dans les territoires est questionnée. Ce questionnement est d’autant plus pertinent dans un contexte insulaire comme celui de La Réunion, où les enjeux d’autonomie alimentaire et énergétique sont majeurs. De 2017 à 2020, un projet de Recherche et Développement intitulé GABiR (Gestion Agricole des Biomasses sur l’île de La Réunion) a mobilisé des acteurs issus du Développement, de la Formation et de la Recherche, dont de nombreux agronomes de diverses disciplines, mais également des décideurs politiques. Ce projet visait à renforcer l’inclusion du secteur agricole dans l’EC de l’île par une approche territoriale de la gestion des biomasses, valorisées ou valorisables en agriculture. Fort de cette expérience et des acquis du projet, un cadre méthodologique à visée générique relevant d’une démarche clinique à l’échelle territoriale et visant à accompagner la transition vers une EC incluant le secteur agricole est proposé. Mots clés : Bioéconomie circulaire, Approche territoriale, Île de La Réunion, Démarche Cliniqu

3D sequential integration: applications and associated key enabling modules (design & technology)

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Opportunities and challenges brought by 3D-sequential integration

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3DVLSI with CoolCube process: An alternative path to scaling

session 5: 3D Systems and PackagingInternational audience3D VLSI with a CoolCube™ integration allows vertically stacking several layers of devices with a unique connecting via density above a million/mm 2 . This results in increased density with no extra cost associated to transistor scaling, while benefiting from gains in power and performance thanks to wire-length reduction. CoolCube™ technology leads to high performance top transistors with Thermal Budgets (TB) compatible with bottom MOSFET integrity. Key enablers are the dopant activation by Solid Phase Epitaxy (SPE) or nanosecond laser anneal, low temperature epitaxy, low k spacers and direct bonding. New data on the maximal TB bottom MOSFET can withstand (with high temperatures but short durations) offer new opportunities for top MOSFET process optimization