Recent Advances in Seeded and Seed-Layer-Free Atomic Layer Deposition of High-K Dielectrics on Graphene for Electronics

Graphene (Gr) with its distinctive features is the most studied two-dimensional (2D) material for the new generation of high frequency and optoelectronic devices. In this context, the Atomic Layer Deposition (ALD) of ultra-thin high-k insulators on Gr is essential for the implementation of many electronic devices. However, the lack of out-of-plane bonds in the sp2 lattice of Gr typically hinders the direct ALD growth on its surface. To date, several pre-functionalization and/or seed-layer deposition processes have been explored, to promote the ALD nucleation on Gr. The main challenge of these approaches is achieving ultra-thin insulators with nearly ideal dielectric properties (permittivity, breakdown field), while preserving the structural and electronic properties of Gr. This paper will review recent developments of ALD of high k-dielectrics, in particular Al2O3, on Gr with "in-situ" seed-layer approaches. Furthermore, recent reports on seed-layer-free ALD onto epitaxial Gr on SiC and onto Gr grown by chemical vapor deposition (CVD) on metals will be presented, discussing the role played by Gr interaction with the underlying substrates

Negative charge trapping effects in Al2O3 films grown by atomic layer deposition onto thermally oxidized 4H-SiC

This letter reports on the negative charge trapping in Al2O3 thin films grown by atomic layer deposition onto oxidized silicon carbide (4H-SiC). The films exhibited a permittivity of 8.4, a breakdown field of 9.2 MV/cm and small hysteresis under moderate bias cycles. However, severe electron trapping inside the Al2O3 film (1 × 1012 cm−2) occurs upon high positive bias stress (>10V). Capacitance-voltage measurements at different temperatures and stress conditions have been used to determine an activation energy of 0.1eV. The results provide indications on the possible nature of the trapping defects and, hence, on the strategies to improve this technology for 4H-SiC devices

Near-surface processing on AlGaN/GaN heterostructures: a nanoscale electrical and structural characterization

The effects of near-surface processing on the properties of AlGaN/GaN heterostructures were studied, combining conventional electrical characterization on high-electron mobility transistors (HEMTs), with advanced characterization techniques with nanometer scale resolution, i.e., transmission electron microscopy, atomic force microscopy (AFM) and conductive atomic force microscopy (C-AFM). In particular, a CHF3-based plasma process in the gate region resulted in a shift of the threshold voltage in HEMT devices towards less negative values. Two-dimensional current maps acquired by C-AFM on the sample surface allowed us to monitor the local electrical modifications induced by the plasma fluorine incorporated in the material

Active dopant profiling and Ohmic contacts behavior in degenerate n-type implanted silicon carbide

This Letter reports on the active dopant profiling and Ohmic contact behavior in degenerate P-implanted silicon carbide (4H-SiC) layers. Hall measurements showed a nearly temperature-independent electron density, corresponding to an electrical activation of about 80% of the total implanted dose. Using the Hall result as calibration, the depth resolved active P-profile was extracted by scanning capacitance microscopy (SCM). Such information on the active P-profile permitted to elucidate the current injection mechanism at the interface of annealed Ni Ohmic contacts with the degenerate n-type 4H-SiC layer. Modeling the temperature dependence of the specific contact resistance with the thermionic field emission mechanism allowed extracting a doping concentration of 8.5 × 1019 cm−3 below the metal/4H-SiC interface, in excellent agreement with the value independently obtained by the SCM depth profiling. The demonstrated active dopant profiling methodology can have important implications in the 4H-SiC device technology

Correlating electron trapping and structural defects in Al2O3 thin films deposited by plasma enhanced atomic layer deposition

In this article, electron trapping in aluminum oxide (Al2O3) thin films grown by plasma enhanced atomic layer deposition on AlGaN/GaN heterostructures has been studied and a correlation with the presence of oxygen defects in the film has been provided. Capacitance–voltage measurements revealed the occurrence of a negative charge trapping effect upon bias stress, able to fill an amount of charge traps in the bulk Al2O3 in the order of 5 × 1012 cm−2. A structural analysis based on electron energy-loss spectroscopy demonstrated the presence of low-coordinated Al cations in the Al2O3 film, which is an indication of oxygen vacancies, and can explain the electrical behavior of the film. These charge trapping effects were used for achieving thermally stable (up to 100 °C) enhancement mode operation in AlGaN/GaN transistors, by controlling the two-dimensional electron gas depletion