Metal-assisted etching of silicon molds for electroforming

Ordered arrays of high-aspect-ratio micro/nanostructures in semiconductors stirred a huge scientific interest due to their unique one-dimensional physical morphology and the associated electrical, mechanical, chemical, optoelectronic, and thermal properties. Metal-assisted chemical etching enables fabrication of such high aspect ratio Si nanostructures with controlled diameter, shape, length, and packing density, but suffers from structure deformation and shape inconsistency due to uncontrolled migration of noble metal structures during etching. Hereby the authors prove that a Ti adhesion layer helps in stabilizing gold structures, preventing their migration on the wafer surface while not impeding the etching. Based on this finding, the authors demonstrate that the method can be used to fabricate linear Fresnel zone plates

Method to Fabricate Portable Electron Source based on Nitrogen Incorporated Ultrananocrystalline Diamond (N-UNCD)

A source cold cathode field emission array (FEA) source based on ultra-nanocrystalline diamond (UNCD) field emitters. This system was constructed as an alternative for detection of obscured objects and material. Depending on the geometry of the given situation a flat-panel source can be used in tomography, radiography, or tomosynthesis. Furthermore, the unit can be used as a portable electron or X-ray scanner or an integral part of an existing detection system. UNCD field emitters show great field emission output and can be deposited over large areas as the case with carbon nanotube “forest” (CNT) cathodes. Furthermore, UNCDs have better mechanical and thermal properties as compared to CNT tips which further extend the lifetime of UNCD based FEA

Microwave Dielectric Properties of On-Chip Liquid Films

A microwave characterization method for on-chip liquid film dielectric property measurement is developed. Microstrip-line based on-chip test structures are fabricated to characterize the microwave dielectric properties of various on-chip liquid films: DI water and binary mixtures of DI water with glucose and ethanol. The obtained microwave dielectric properties are presented in Cole-Cole diagrams, which show general frequency dependence similar to that of bulk liquids. Different concentration levels of glucose and ethanol show different microwave dielectric responses. Therefore, on-chip microwave dielectric spectroscopy provides a promising and inexpensive on-chip sensing mechanism for biomedical and chemical applications

Integration of silicon chip microstructures for in-line microbial cell lysis in soft microfluidics

The paper presents fabrication methodologies that integrate silicon components into soft microfluidic devices to perform microbial cell lysis for biological applications. The integration methodology consists of a silicon chip that is fabricated with microstructure arrays and embedded in a microfluidic device, which is driven by piezoelectric actuation to perform cell lysis by physically breaking microbial cell walls via micromechanical impaction. We present different silicon microarray geometries, their fabrication techniques, integration of said micropatterned silicon impactor chips into microfluidic devices, and device operation and testing on synthetic microbeads and two yeast species (S. cerevisiae and C. albicans) to evaluate their efficacy. The generalized strategy developed for integration of the micropatterned silicon impactor chip into soft microfluidic devices can serve as an important process step for a new class of hybrid silicon-polymeric devices for future cellular processing applications. The proposed integration methodology can be scalable and integrated as an in-line cell lysis tool with existing microfluidics assays

X-Ray Lithography of Metal and Semiconductor Nanoparticles

In the last few years, a considerable amount of research has focused on the three-dimensional fabrication of contacts and electronic devices. Most techniques, however, are essentially based on photoreduction, and are limited to noble- and semi-noble metals. We present here a general method that allows patterning of porous matrices in 3D with metal, but also with semiconductor nanoparticles which is of potential relevance for microfabrication applications. In our method, the pore-filling solvent of a sol-gel material is exchanged with a solution of precursors. The precursors are photodissociated and nanoparticles are formed when the monoliths are irradiated. In a series of previous publications we showed that noble metals but also semiconductor quantum dots can be produced with our technique. Here we focus on the Xray variation of our technique and show that monoliths can be patterned with metals and also with semiconductor nanoparticles. The patterns have the same resolution than the masks, i.e., around 10 μm, and extend into the bulk of the monoliths for up to a depth of 12 mm. Our method possesses several attractive features. Sample preparation is very simple; the technique has a bottom-up character; it allows access to a wide number of materials, such as noble metals and II-VI semiconductor materials; and it has a 3D character. With additional developments, our technique could be possibly used to complement more established techniques such as LIGA and multiphoton fabrication techniques which are currently used for 3D microfabrication