8,730 research outputs found

    Turbulence modeling and surface heat transfer in a stagnation flow region

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    Analysis for the turbulent flow field and the effect of freestream turbulence on the surface heat transfer rate of a stagnation flow is presented. The emphasis is on modeling and its augmentation of surface heat transfer rate. The flow field considered is the region near the forward stagnation point of a circular cylinder in a uniform turbulent mean flow

    Application of turbulence modeling to predict surface heat transfer in stagnation flow region of circular cylinder

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    A theoretical analysis and numerical calculations for the turbulent flow field and for the effect of free-stream turbulence on the surface heat transfer rate of a stagnation flow are presented. The emphasis is on the modeling of turbulence and its augmentation of surface heat transfer rate. The flow field considered is the region near the forward stagnation point of a circular cylinder in a uniform turbulent mean flow. The free stream is steady and incompressible with a Reynolds number of the order of 10 to the 5th power and turbulence intensity of less than 5 percent. For this analysis, the flow field is divided into three regions: (1) a uniform free-stream region where the turbulence is homogeneous and isotropic; (2) an external viscid flow region where the turbulence is distorted by the variation of the mean flow velocity; and, (3) an anisotropic turbulent boundary layer region over the cylinder surface. The turbulence modeling techniques used are the kappa-epsilon two-equation model in the external flow region and the time-averaged turbulence transport equation in the boundary layer region. The turbulence double correlations, the mean velocity, and the mean temperature within the boundary layer are solved numerically from the transport equations. The surface heat transfer rate is calculated as functions of the free-stream turbulence longitudinal microlength scale, the turbulence intensity, and the Reynolds number

    Spherical alterations of handles: embedding the manifold plus construction

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    A key tool in our earlier work on ends of manifolds high-dimensional manifolds was an ability to embed cobordisms provided by the Quillen Plus Construction into those ends. Here we develop a `spherical modification' trick which provides a constructive approach to obtaining such embeddings. More importantly, this approach allows for more general embedding results. In this paper we develop generalizations of the plus construction and show how the corresponding cobordisms can be embedded in manifolds satisfying appropriate fundamental group properties. Results obtained here play an important role in our ongoing study of noncompact manifolds.Comment: This final version will appear in Algebraic & Geometric Topology. Small corrections, including a fix to the statement of Theorem 5.3. 22 pages, 4 figure

    A cooled telescope for infrared balloon astronomy

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    The characteristics of a 16 inch liquid helium cooled Cassegrain telescope with vibrating secondary mirror are discussed. The telescope is used in making far infrared astronomical observations. The system houses several different detectors for multicolor photometry. The cooled telescope has a ten to one increase in signal-to-noise ratio over a similar warm version and is installed in a high altitude balloon gondola to obtain data on the H2 region of the galaxy

    Two stage superconducting quantum interference device amplifier in a high-Q gravitational wave transducer

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    We report on the total noise from an inductive motion transducer for a gravitational-wave antenna. The transducer uses a two-stage SQUID amplifier and has a noise temperature of 1.1 mK, of which 0.70 mK is due to back-action noise from the SQUID chip. The total noise includes thermal noise from the transducer mass, which has a measured Q of 2.60 X 10^6. The noise temperature exceeds the expected value of 3.5 \mu K by a factor of 200, primarily due to voltage noise at the input of the SQUID. Noise from flux trapped on the chip is found to be the most likely cause.Comment: Accepted by Applied Physics Letters tentatively scheduled for March 13, 200
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