50 research outputs found

    New precise determination of the \tau lepton mass at KEDR detector

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    The status of the experiment on the precise τ\tau lepton mass measurement running at the VEPP-4M collider with the KEDR detector is reported. The mass value is evaluated from the τ+τ\tau^+\tau^- cross section behaviour around the production threshold. The preliminary result based on 6.7 pb1^{-1} of data is mτ=1776.800.23+0.25±0.15m_{\tau}=1776.80^{+0.25}_{-0.23} \pm 0.15 MeV. Using 0.8 pb1^{-1} of data collected at the ψ\psi' peak the preliminary result is also obtained: ΓeeBττ(ψ)=7.2±2.1\Gamma_{ee}B_{\tau\tau}(\psi') = 7.2 \pm 2.1 eV.Comment: 6 pages, 8 figures; The 9th International Workshop on Tau-Lepton Physics, Tau0

    Search for narrow resonances in e+ e- annihilation between 1.85 and 3.1 GeV with the KEDR Detector

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    We report results of a search for narrow resonances in e+ e- annihilation at center-of-mass energies between 1.85 and 3.1 GeV performed with the KEDR detector at the VEPP-4M e+ e- collider. The upper limit on the leptonic width of a narrow resonance Gamma(R -> ee) Br(R -> hadr) < 120 eV has been obtained (at 90 % C.L.)

    New precision measurement of the J/ψJ/\psi- and ψ\psi' -meson masses

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    A new high precision measurement of the J/ψJ/\psi- and ψ\psi'-meson masses has been performed at the VEPP-4M collider using the KEDR detector. The resonant depolarization method has been employed for the absolute calibration of the beam energy. The following mass values have been obtained: MJ/ψ=3096.917±0.010±0.007M_{J/\psi} = 3096.917 \pm 0.010 \pm 0.007 MeV, Mψ=3686.111±0.025±0.009M_{\psi'} = 3686.111 \pm 0.025 \pm 0.009 MeV. The relative measurement accuracy has reached 4.1064. 10^{-6} for J/ψJ/\psi and 7.1067. 10^{-6} for ψ\psi', approximately 3 times better than in the previous precise experiments.Comment: 12 pages, 4 tables, 10 figure

    Features of Formation of Ohmic Contacts and Gate on Epitaxial Heterostructure of AlGaN / GaN High Electron Mobility Transistor

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    Reported about study of processes of formation of Ti / Al / Ni / Au ohmic contacts to heterostructures AlGaN / GaN and gate Ni / Au. Investigated of process recess the semiconductor layer for minimum resistance of ohmic contact – 0.4 Ohm·mm. Studied influence of encapsulation ohmic contacts on their surface morphology

    Optical dissector for longitudinal beam profile measurement

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