Electrical activation of carbon in GaAs : implantation temperature effects

Carbon was implanted into GaAs at the energy of 1 MeV with doses between 131013 and 2 31015 cm22 at temperatures of 80 K, nominal room temperature (RT), and 300 °C. A markedly higher electrical activation was obtained in the samples implanted at 80 K compared to those implanted at RT or 300 °C, attaining a maximum hole concentration of 231019 cm23. The redistribution of the C profile during rapid thermal annealing at temperatures from 700 to 950 °C for 10 s was found negligible, independently of the implantation temperature. Similar improvements in the electrical properties were also verified in samples implanted at 80 K with a lower energy of 60 keV. We consider that despite the light mass of C ions, the reduced dynamic annealing at 80 K allows the accumulation of an abundance of As vacancies, which assist the C activation as a p-type dopant

Electrical Isolation Of A Silicon δ-doped Layer In Gaas By Ion Irradiation

The electrical isolation of a n-type δ-doped layer embedded into undoped GaAs was studied using proton or helium ion bombardment. The threshold dose for isolation Dth of the δ-doped layer was found to be ≈2 times higher than that predicted for thick doped layers of similar carrier concentration. The thermal stability of the isolation, i.e., the persistence of sheet resistance Rs at values > 109Ω/□ after subsequent thermal annealing, is limited to temperatures below 400°C. This temperature limit for the thermal stability Tsm is markedly lower than those observed in wider doped layers in which Tsm is ≅650°C. A previously isolated δ-doped layer presents p-type conductivity after annealing at temperatures >600°C . © 1999 American Institute of Physics.751319171919Shubert, E.F., (1990) J. Vac. Sci. Technol. A, 8, p. 2980Daniltsev, V.M., Irin, I.V., Murel, A.V., Khrykin, O.I., Shashkin, V.I., (1994) Inorg. Mater. (Transl. of Neorg. Mater.), 30, p. 948Zrenner, A., Koch, F., Ploog, K., (1987) Inst. Phys. Conf. Ser., 91, p. 171Van Der Pauw, L.J., (1958) Philips Res. Rep., 13, p. 1De Souza, J.P., Danilov, I., Boudinov, H., (1997) J. Appl. Phys., 81, p. 650Ziegler, J.F., Biersack, J.P., Littmark, U., (1985) The Stopping and Range of Ions in Solids, 1. , Pergamon, OxfordDe Souza, J.P., Danilov, I., Boudinov, H., (1998) J. Appl. Phys., 84, p. 4757De Souza, J.P., Danilov, I., Boudinov, H., (1996) Appl. Phys. Lett., 68, p. 535De Souza, J.P., Danilov, I., Boudinov, H., (1998) Radiat. Eff. Defects Solids, 147, p. 109Grandidier, B., Stiévenard, D., Nys, J.P., Wallart, X., (1998) Appl. Phys. Lett., 72, p. 245

Electrical activation of carbon in GaAs : implantation temperature effects

Carbon was implanted into GaAs at the energy of 1 MeV with doses between 131013 and 2 31015 cm22 at temperatures of 80 K, nominal room temperature (RT), and 300 °C. A markedly higher electrical activation was obtained in the samples implanted at 80 K compared to those implanted at RT or 300 °C, attaining a maximum hole concentration of 231019 cm23. The redistribution of the C profile during rapid thermal annealing at temperatures from 700 to 950 °C for 10 s was found negligible, independently of the implantation temperature. Similar improvements in the electrical properties were also verified in samples implanted at 80 K with a lower energy of 60 keV. We consider that despite the light mass of C ions, the reduced dynamic annealing at 80 K allows the accumulation of an abundance of As vacancies, which assist the C activation as a p-type dopant

Electrical isolation of a silicon [Delta]-doped layer in GaAs by ion irradiation

The electrical isolation of a n-type d -doped layer embedded into undoped GaAs was studied using proton or helium ion bombardment. The threshold dose for isolation Dth of the d -doped layer was found to be '2 times higher than that predicted for thick doped layers of similar carrier concentration. The thermal stability of the isolation, i.e., the persistence of sheet resistance Rs at values .109V/h after subsequent thermal annealing, is limited to temperatures below 400 °C. This temperature limit for the thermal stability Tsm is markedly lower than those observed in wider doped layers in which Tsm is >650 °C. A previously isolated d -doped layer presents p-type conductivity after annealing at temperatures .600 °C

Electrical isolation of a silicon [Delta]-doped layer in GaAs by ion irradiation

The electrical isolation of a n-type d -doped layer embedded into undoped GaAs was studied using proton or helium ion bombardment. The threshold dose for isolation Dth of the d -doped layer was found to be '2 times higher than that predicted for thick doped layers of similar carrier concentration. The thermal stability of the isolation, i.e., the persistence of sheet resistance Rs at values .109V/h after subsequent thermal annealing, is limited to temperatures below 400 °C. This temperature limit for the thermal stability Tsm is markedly lower than those observed in wider doped layers in which Tsm is >650 °C. A previously isolated d -doped layer presents p-type conductivity after annealing at temperatures .600 °C