Origin of the retention loss in ferroelectric Hf0.5Zr0.5O2Hf_{0.5}Zr_{0.5}O_{2}-based memory devices

For the decade, ferroelectric hafnium oxide films are attracting the interest as a promising functional material for nonvolatile ferroelectric random access memory due to full scalability and complementary metal-oxide-semiconductor integratability. Despite the significant progress in key performance parameters, particularly, the readout charge and voltage as well as the endurance, the developed devices can only be implemented by the electronics industry if they exhibit a standard retention time of 10 years. Material engineering modifies not only target ferroelectric properties, but also the retention time. To understand how to maintain the sufficient retention, the physical mechanism behind it should be clarified. For this purpose, we have fabricated the capacitor memory cell with a high rate of retention loss. Comparing the device performance with the results of capacitance transient spectroscopy, operando hard X-ray photoelectron spectroscopy and in situ piezoresponse force microscopy, we have concluded that the retention loss is caused by the accumulation of the positively charged oxygen vacancies at the interfaces with capacitor electrodes. The redistribution of charges during long-term storage of information is fully defined by the domain structure in memory cell

Ferroelectric Second-Order Memristor

While the conductance of a first-order memristor is defined entirely by the external stimuli, in the second-order memristor it is governed by the both the external stimuli and its instant internal state. As a result, the dynamics of such devices allows to naturally emulate the temporal behavior of biological synapses, which encodes the spike timing information in synaptic weights. Here, we demonstrate a new type of second-order memristor functionality in the ferroelectric HfO2-based tunnel junction on silicon. The continuous change of conductance in the p+-Si/Hf0.5Zr0.5O2/TiN tunnel junction is achieved via the gradual switching of polarization in ferroelectric domains of polycrystalline Hf0.5Zr0.5O2 layer, whereas the combined dynamics of the built-in electric field and charge trapping/detrapping at the defect states at the bottom Si interface defines the temporal behavior of the memristor device, similar to synapses in biological systems. The implemented ferroelectric second-order memristor exhibits various synaptic functionalities, such as paired-pulse potentiation/depression and spike-rate-dependent plasticity, and can serve as a building block for the development of neuromorphic computing architectures

Field-Effect Transistor Based on 2D Microcrystalline MoS₂ Film Grown by Sulfurization of Atomically Layer Deposited MoO₃

Atomically thin molybdenum disulfide (MoS2) is a promising channel material for next-generation thin-body field-effect transistors (FETs), which makes the development of methods allowing for its controllable synthesis over a large area an essential task. Currently, one of the cost-effective ways of its synthesis is the sulfurization of preliminary grown oxide- or metallic film. However, despite apparent progress in this field, the electronic quality of the obtained MoS2 is inferior to that of exfoliated samples, making the detailed investigation of the sulfurized films’ properties of great interest. In this work, we synthesized continuous MoS2 films with a thickness of ≈2.2 nm via the sulfurization of an atomic-layer-deposited MoO3 layer. X-ray photoelectron spectroscopy, transmission electron microscopy, and Raman spectroscopy indicated the appropriate chemical composition and microcrystalline structure of the obtained MoS2 films. The semiconductor quality of the synthesized films was confirmed by the fabrication of a field-effect transistor (FET) with an Ion/Ioff ratio of ≈40, which was limited primarily by the high contact resistance. The Schottky barrier height at the Au/MoS2 interface was found to be ≈1.2 eV indicating the necessity of careful contact engineering. Due to its simplicity and cost-effectiveness, such a technique of MoS2 synthesis still appears to be highly attractive for its applications in next-generation microelectronics. Therefore, further research of the electronic properties of films obtained via this technique is required

Improved Ferroelectric Switching Endurance of La-Doped Hf_0.5Zr_0.5O₂ Thin Films

Hf_0.5Zr_0.5O₂ thin films are one of the most appealing HfO₂-based ferroelectric thin films, which have been researched extensively for their applications in ferroelectric memory devices. In this work, a 1 mol % La-doped Hf_0.5Zr_0.5O₂ thin film was grown by plasma-assisted atomic layer deposition and annealed at temperatures of 450 and 500 °C to crystallize the film into the desired orthorhombic phase. Despite the use of a lower temperature than that used in previous reports, the film showed highly promising ferroelectric propertiesa remnant polarization of ∼30 μC/cm² and switching cycle endurance up to 4 × 10¹⁰. The performance was much better than that of undoped Hf_0.5Zr_0.5O₂ thin films, demonstrating the positive influence of La doping. Such improvements were mainly attributed to the decreased coercive field (by ∼30% compared to the undoped film), which allowed for the use of a lower applied field to drive the cycling tests while maintaining a high polarization value. La doping also decreased the leakage current by ∼3 orders of magnitude compared to the undoped film, which also contributed to the strongly improved endurance. Nonetheless, the La-doped film required a larger number of wake-up cycles (∼10⁶ cycles) to reach a saturated remnant polarization value. This behavior might be explained by the increased generation of oxygen vacancies and slower migration of these vacancies from the interface to the bulk region. However, the maximum number of wake-up cycles was less than 0.01% of the total possible cycles, and therefore, initializing the film to the maximum performance state would not be a serious burden