More rapid climate change promotes evolutionary rescue through selection for increased dispersal distance

Acknowledgements This research was funded by FWO projects G.0057.09 to DB and JB, and G.0610.11 to DB, JB and RS. JMJT, DB and RS are supported by the FWO Research Network EVENET.Peer reviewedPublisher PD

Vertically coupled microring resonators using one epitaxial growth step and single-side lithography

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Evanescently-coupled hybrid III-V/silicon laser based on DVS-BCB bonding

© 2014 IEEE. Controllable electrical breakdown of multiwall nanotubes (MWNTs) is studied utilizing the atomic force microscopy (AFM). Electrical breakdown has been known as the way to fundamentally understand the electrical properties of nanotubes and an approach to develop MWNT based transistors and sensors. Normally, electrical breakdown was known to be happened in the center of MWNT because of the thermal accumulation. However, considering the effect of thermal dissipation, the electrical breakdown could be mechanically controlled by an additional heat sink, which could be the substrate of MWNT device. Therefore, the electrical breakdown process is controllable through controlling Joule heating and thermal dissipation. In this research, we study the crucial factors that affect the electrical breakdown. The AFM based nano robot is used to measure the conductance distribution, and manipulate the three dimensional structure of MWNT in order to change the position of heat sink to control the location where electrical breakdown happened. The controllable electrical breakdown is an alternative approach for conducting bandgap engineering in nanodevice and fabricating high performance nano sensors and transistors.Link_to_subscribed_fulltex

SIW cavity-backed slot (multi-)antenna systems for the next generation IoT applications

Substrate integrated waveguide (SIW) cavity-backed slot antenna topologies are promising candidates to adress the specific design challenges posed by the Internet of Things (IoT). In this contribution, we demonstrate their potential by discussing two designs on two different, application-specific, innovative substrate materials. First, a compact, ultra-wideband three-element array with very low mutual coupling is presented for integration into furniture. In the second design, the half-mode SIW technique is applied to obtain a miniaturized ultra-wideband design, enabling invisible integration into cork floor and wall tiles. The compactness, integrability, and stable, high performance of both designs in different operating conditions, make them ideal candidates for IoT applications