Multi -mission Attitude Determination System for balloon flight

MADS (Multi-mission Attitude Determination System) is a new software package used to determine the attitude of instruments on a high-altitude balloon employed for scientific experiments. There is no existing system for the automated determination of the attitude of instruments in balloon experiments, so we have developed MADS to do the data analysis for balloon experiments to find the location of astrophysical sources such as gamma-ray or x-ray sources. The two areas that required most work were modeling star trackers and modeling the motion of the balloon. Star trackers are used on satellites, but are far too expensive and sophisticated to use on balloons. Their processes have to be modeled using only the data from simple CCD cameras. The motion of a three-axis-stabilized satellite moving in a prescribed orbit is very much simpler than the motion of a balloon, which is carried by stratospheric winds and always retains to some degree its initial spinning and pendular motions. Another area that had to be addressed was interpolation when the balloon is out of range of a sufficient number of GPS satellites to determine it position (This may happen in the Arctic or Antarctic). The software package, with documentation written to NASA standards, is being made available to NASA at their request

Microstructural and mechanical characteristics of micro-scale intermetallic compounds interconnections

Following the continually increasing demand for high-density interconnection and multilayer packaging for chips, solder bump size has decreased significantly over the years, this has led to some challenges in the reliability of interconnects. This thesis presents research into the resulting effects of miniaturization on the interconnection with Sn-solder, especially focusing on the full intermetallics (IMCs) micro-joints which appear in the 3D IC stacking packaging. Thereby, systematic studies have been conducted to study the microstructural evolution and reliability issues of Cu-Sn and Cu-Sn-Ni IMCs micro-joints. (1) Phenomenon of IMCs planar growth: The planar IMCs interlayer was asymmetric and composed of (Cu,Ni)6Sn5 mainly in Ni/Sn (2.5~5 µm)/Cu interconnect. Meanwhile, it was symmetric two-layer structure in Cu/Sn (2.5~5 µm)/Cu interconnect with the Cu3Sn fine grains underneath Cu6Sn5 cobblestone-shape-like grains for each IMCs layer. Besides, it is worth noticing that the appearance of Cu-rich whiskers (the mixture of Cu/Cu2O/SnOx/Cu6Sn5) could potentially lead to short-circuit in the cases of ultra-fine (<10 µm pitch) interconnects for the miniaturization of electronics devices. (2) Microstructural evolution process of Cu-Sn IMCs micro-joint: The simultaneous solidification of IMCs interlayer supressed the scalloped growth of Cu6Sn5 grains in Cu/Sn (2.5 µm)/Cu interconnect during the transient liquid phase (TLP) soldering process. The growth factor of Cu3Sn was in the range of 0.29~0.48 in Cu-Cu6Sn5 diffusion couple at 240~290 °C, which was impacted significantly by the type of substrates. And the subsequent homogenization process of Cu3Sn grains was found to be consistent with the description of flux-driven ripening (FDR) theory. Moreover, Kirkendall voids appeared only in the Cu3Sn layer adjacent to Cu-plated substrate, and this porous Cu3Sn micro-joint was mechanically robust during the shear test. (3) Microstructural evolution of Cu-Sn-Ni IMCs micro-joint: There was obvious inter-reaction between the interfacial reactions in Ni/Sn (1.5 µm)/Cu interconnect. The growth factor of (Cu,Ni)3Sn on Cu side was about 0.36 at 240 °C, and the reaction product on Ni side was changed from Ni3Sn4 into (Cu,Ni)6Sn5 with the increase of soldering temperature. In particular, the segregation of Ni atoms occurred along with phase transformation at 290 °C and thereby stabilized the (Cu,Ni)6Sn5 phase for the high Ni content of 20 at.%. (4) Micro-mechanical characteristics of Cu-Sn-Ni IMCs micro-joint: The Young s modulus and hardness of Cu-Sn-Ni IMCs were measured by nanoindentation test, such as 160.6±3.1 GPa/ 7.34±0.14 GPa for (Cu,Ni)6Sn5 and 183.7±4.0 GPa/ 7.38±0.46 GPa for (Cu,Ni)3Sn, respectively. Besides, in-situ nano-compression tests have been conducted on IMCs micro-cantilevers, the fracture strength turns out to be 2.46 GPa. And also, the ultimate tensile stress was calculated to be 2.3±0.7 GPa from in-situ micro-bending tests, which is not sensitive with the microstructural change of IMCs after dwelling at 290 °C

Microstructural and mechanical analysis on Cu-Sn intermetallic micro-joints under isothermal condition

This study focuses on the mechanism of phase transformation from Cu6Sn5 into Cu3Sn and the homogenization process in full intermetallics (IMCs) micro-joints, which were prepared by soldering the initial Cu/Sn/Cu structure through high temperature storage in vacuum environment as the Transient Liquid Phase (TLP) process. From the microstructural observation by electron backscatter diffraction (EBSD), a mixture of IMCs phases (Cu6Sn5 and Cu3Sn) has been found to constitute the sandwich-structured Cu/IMCs/Cu joints. With the dwell time increasing at 533 K, there were two layers of Cu3Sn emerging from both sides of copper substrates with the depletion of Cu6Sn5 layer, toward merging each other in the IMCs interlayer. Then the Cu3Sn grains with various sizes became more homogenous columnar crystallites. Meanwhile, some equiaxial ultra-fine grains accompanied with the Kirkendall voids, were found only in adjacent to the electroplated copper. In addition, a specific type of micropillar with the size ∼5 μm × 5 μm × 12 μm fabricated by focus ion beam (FIB) was used to carry out the mechanical testing by Nano-indentation, which confirmed that this type of joint is mechanically robust, regardless of its porous Cu3Sn IMC interconnection

Galaxy-galaxy weak-lensing measurement from SDSS: II. host halo properties of galaxy groups

As the second paper of a series on studying galaxy-galaxy lensing signals using the Sloan Digital Sky Survey Data Release 7 (SDSS DR7), we present our measurement and modelling of the lensing signals around groups of galaxies. We divide the groups into four halo mass bins, and measure the signals around four different halo-center tracers: brightest central galaxy (BCG), luminosity-weighted center, number-weighted center and X-ray peak position. For X-ray and SDSS DR7 cross identified groups, we further split the groups into low and high X-ray emission subsamples, both of which are assigned with two halo-center tracers, BCGs and X-ray peak positions. The galaxy-galaxy lensing signals show that BCGs, among the four candidates, are the best halo-center tracers. We model the lensing signals using a combination of four contributions: off-centered NFW host halo profile, sub-halo contribution, stellar contribution, and projected 2-halo term. We sample the posterior of 5 parameters i.e., halo mass, concentration, off-centering distance, sub halo mass, and fraction of subhalos via a MCMC package using the galaxy-galaxy lensing signals. After taking into account the sampling effects (e.g. Eddington bias), we found the best fit halo masses obtained from lensing signals are quite consistent with those obtained in the group catalog based on an abundance matching method, except in the lowest mass bin. Subject headings: (cosmology:) gravitational lensing, galaxies: clusters: generalComment: 12 pages, 7 figures, submitted to Ap

Microstructural evolution of Cu–Sn–Ni compounds in full intermetallic micro-joint and in situ micro-bending test

This study focuses on the microstructural evolution process of Cu–Sn–Ni intermetallic compounds (IMCs) interlayer in the micro-joints, formed from the initial Ni/Sn (1.5 µm)/Cu structure through transient liquid phase (TLP) soldering. Under the bonding temperature of 240 °C, the micro-joints evolve into Ni/(Cu, Ni)6Sn5/(Cu, Ni)3Sn/Cu structure, where the interfacial reactions on Cu/Sn and Sn/Ni are suppressed by the atoms diffusing from the opposite side. The thickness of (Cu, Ni)3Sn layer on plated Cu layer still increases with the prolonged dwell time. When the bonding temperature was elevated to 290 °C, the phase transformation of (Cu, Ni)6Sn5 into (Cu, Ni)3Sn has been accelerated, thus the majority of IMCs interlayer is constituted with (Cu, Ni)3Sn. However, a small amount of Ni-rich (Cu, Ni)6Sn5 phases still remain near the Ni substrate and some of them close to the center-line of IMCs interlayer. The state between (Cu, Ni)6Sn5 and the adjacent (Cu, Ni)3Sn tends to reach equilibrium in Ni content based on the observation from Transmission Electron Microscope (TEM). In addition, the Cu–Sn–Ni IMCs micro-cantilevers were fabricated from these micro-joints using Focus Ion Beam (FIB) for the in situ micro-bending test, the results indicate a high ultimate tensile strength as well as the brittle fracture in the inter- and transgranular modes

The effect credit term structure of monetary policy on firms' "short-term debt for long-term investment" behavior: empirical evidence from China

This paper examines the effects and mechanism paths of monetary policy on firms' "short-term debt for long-term investment (SDFLI)" behavior using panel data of Chinese A-share listed firms from 2007-2019. The findings indicate that loose monetary policy suppresses corporate SDFLI behavior by lengthening corporate credit maturity structure through the credit maturity structure channel. In addition, heterogeneity analysis shows that loose monetary policy significantly inhibits the SDFLI behavior of state-owned enterprises(SOEs), non-high-tech firms, and firms in regions with high bank competition levels through the credit term structure channel, and the monetary policy credit term structure channel fails for non-state-owned enterprises(non-SOEs), high-tech firms, and firms in regions with low bank competition levels. The results of the heterogeneity analysis validate the plausibility that monetary policy affects firms' SDFLI behavior through the credit term structure channel

Assessment of ecosystem health based on landscape pattern in ecologically fragile regions at different spatial scales: A case study of Dianchi Lake basin, China

In the process of urbanization, maintaining ecosystem health in ecologically fragile regions is an inevitable requirement for sustainable development in the future, but the ecological health status varies greatly at different spatial scales. Determining the appropriate spatial scale of ecological health assessment is the basis and premise of ecological management and environmental protection policy making. Taking Dianchi Lake basin as the research area, based on the vigor-organization-resilience (VOR) model and landscape pattern index, this study established an assessment system of ecological health to evaluate the ecosystem health status from quadrat, ecological and administrative scales, with the aim to determine a reasonable evaluation scale and strengthen regional sustainability. The results show that: 1) The suitable spatial grain of landscape pattern analysis in Dianchi Lake basin is 150 m. 2) The average values of ecosystem health indices at quadrat scale, ecological scale and administrative scale are 0.5466, 0.4977 and 0.5373, respectively, demonstrating a sub-health state. 3) The most suitable scale for ecological health assessment of Dianchi Lake basin is ecological scale, because taking sub-watershed as ecological unit can ensure the integrity of the evaluated ecosystem to the greatest extent. Multiscale assessment is helpful for eco-environmental management departments to understand the ecosystem health status at different scales and provide a scientific basis for regional eco-environmental management decisions

A Human-Specific <i>De Novo</i> Protein-Coding Gene Associated with Human Brain Functions

To understand whether any human-specific new genes may be associated with human brain functions, we computationally screened the genetic vulnerable factors identified through Genome-Wide Association Studies and linkage analyses of nicotine addiction and found one human-specific de novo protein-coding gene, FLJ33706 (alternative gene symbol C20orf203). Cross-species analysis revealed interesting evolutionary paths of how this gene had originated from noncoding DNA sequences: insertion of repeat elements especially Alu contributed to the formation of the first coding exon and six standard splice junctions on the branch leading to humans and chimpanzees, and two subsequent substitutions in the human lineage escaped two stop codons and created an open reading frame of 194 amino acids. We experimentally verified FLJ33706's mRNA and protein expression in the brain. Real-Time PCR in multiple tissues demonstrated that FLJ33706 was most abundantly expressed in brain. Human polymorphism data suggested that FLJ33706 encodes a protein under purifying selection. A specifically designed antibody detected its protein expression across human cortex, cerebellum and midbrain. Immunohistochemistry study in normal human brain cortex revealed the localization of FLJ33706 protein in neurons. Elevated expressions of FLJ33706 were detected in Alzheimer's brain samples, suggesting the role of this novel gene in human-specific pathogenesis of Alzheimer's disease. FLJ33706 provided the strongest evidence so far that human-specific de novo genes can have protein-coding potential and differential protein expression, and be involved in human brain functions.</p

Grafted human-induced pluripotent stem cells-derived oligodendrocyte progenitor cells combined with human umbilical vein endothelial cells contribute to functional recovery following spinal cord injury

Background: Spinal cord injury (SCI) is a devastating disease that causes extensive damage to oligodendrocytes and neurons leading to demyelination and axonal degeneration. In this study, we co-transplanted cell grafts containing oligodendrocyte progenitor cells (OPCs) derived from human-induced pluripotent stem cells (iPSCs) combined with human umbilical vein endothelial cells (HUVECs), which were reported to promote OPCs survival and migration, into rat contusion models to promote functional recovery after SCI. Methods: OPCs were derived from iPSCs and identified by immunofluorescence at different time points. Functional assays in vitro were performed to evaluate the effect of HUVECs on the proliferation, migration, and survival of OPCs by co-culture and migration assay, as well as on the neuronal axonal growth. A combination of OPCs and HUVECs was transplanted into the rat contusive model. Upon 8 weeks, immunofluorescence staining was performed to test the safety of transplanted cells and to observe the neuronal repairment, myelination, and neural circuit reconstruction at the injured area; also, the functional recovery was assessed by Basso, Beattie, and Bresnahan open-field scale, Ladder climb, SEP, and MEP. Furthermore, the effect of HUVECs on grafts was also determined in vivo. Results: Data showed that HUVECs promote the proliferation, migration, and survival of OPCs both in vitro and in vivo. Furthermore, 8 weeks upon engraftment, the rats with OPCs and HUVECs co-transplantation noticeably facilitated remyelination, enhanced functional connection between the grafts and the host and promoted functional recovery. In addition, compared with the OPCs-alone transplantation, the co-transplantation generated more sensory neurons at the lesion border and significantly improved the sensory functional recovery. Conclusions: Our study demonstrates that transplantation of OPCs combined with HUVECs significantly enhances both motor and sensory functional recovery after SCI. No significance was observed between OPCs combined with HUVECs group and OPCs-alone group in motor function recovery, while the sensory function recovery was significantly promoted in OPCs combined with HUVECs groups compared with the other two groups. These findings provide novel insights into the field of SCI research