VME Readout at and Below the Conversion Time Limit

The achievable acquisition rates of modern triggered nuclear physics experiments are heavily dependent on the readout software, in addition to the limits given by the utilized hardware. This paper presents an asynchronous readout scheme that significantly improves the livetime of an otherwise synchronous triggered Versa Module Eurocard Bus-based data acquisition system. A detailed performance analysis of this and other readout schemes, in terms of the basic data transfer operations, is described. The performance of the newly developed scheme as well as synchronous schemes on two systems has been measured. The measurements show excellent agreement with the detailed description. For the second system, which previously used a synchronous readout, the deadtime ratio is at a 20-kHz trigger request frequency reduced by 30% compared to the nearest contender, allowing 10% more events to be recorded in the same time. The interaction between the network and readout tasks for single-core processors is also investigated. A livetime ratio loss of a few percents can be observed, depending on the size of the data chunks given to the operating system kernel for network transfer. With appropriately chosen chunk size, the effect can be mitigated

Large area processes for 3D shaped electronics

Conformable electronic systems consisting of laterally distributed electronic components (typically sensors, actuators or LEDs) have attracted considerable interest during the last years. By using different technology approaches considerable elasticity, repeated stretchability and conformability of such systems has been shown by research groups. Contrary to the expression of interest by many potential industrial manufactures of stretchable electronics, the adaptation of related technologies into fabrication environments is lagging. Among the reasons for the reluctance with respect to industrialization are concerns with respect to material used in deformable electronics (silicones), reliability issues (repeated stretchability), and (initial) cost. In this paper an approach for “single cycle deformable” - electronic systems and some of its application scenarios will be presented. Based on a previously developed technology for stretchable electronics using thermoplastic polyurethane as the matrix material, an approach for three dimensionally shaped electronic systems was developed. In order to fabricate a stable self-supported structure the stretchable system is attached to a thermoplastic polymer sheet (typically polycarbonate) with a thickness between 200 and 800 μm prior to being 3D-deformed by thermo-forming. Potential applications are any kind of products (consumer electronics, automotive, household appliances), where a need to integrate sensors and actuators into ergonomically or aesthetically 3D-shaped surfaces is identified. The fabrication of deformable electronics is a process fully compatible with a typical printed circuit board manufacturing and electronics assembly line. Also the used materials are well compliant with wet-chemical processes used during the processing. Rather complex electronic systems with a number of components like distributed sensors or actuators can be assembled in a conventional way on a flat electronic panel. The low temperature solder SnBi is used for the electronics assembly. Mounted components are typically fixed additionally by an underfiller, so that during the thermoforming process when the solder eventually melts components are not released from the contact pads. The stretchable electronics is subsequently fixed to a stiff thermoplasitc support sheet prior to being 3D-deformed by a thermoforming process

Verfahren zum Auftragen von Material auf einen Bereich eines elektrischen Bauteils

DE 10334388 B UPAB: 20041122 NOVELTY - The coating method has a magnetic or magnetizable solder material applied to the contact bumps (102) of a microchip (100), after preparation of the microchip, for providing contact bumps that are at least partially magnetic, the solder material and the contact bumps then brought together, so that the solder material is magnetically adhered to the contact bumps. USE - The coating is used for application of a magnetic or magnetizable solder material to solder bumps of a microchip, for flip-chip technology. ADVANTAGE - Use of magnetic adhesion provides simple and low-cost coating of contact bumps with solder material

Embedding of active components in multilayer flex boards

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Entwicklung und Charakterisierung duenner photoaktiver Schichten neuartiger Verbindungshalbleiter Abschlussbericht

The final report covers the following subjects: Van der Waals epitaxy at semiconducting layer lattice crystals, UHV experiments with pyrite surfaces and thin layers, preparation of pyrite layers, preparation and characterization of CuInS layers, ZnO deposition by reactive magnetron sputtering, photoconductive ploymers (modification of polymethylphenylsilane). (MM)In diesem Abschlussbericht werden folgende Themen behandelt: Van der Waals Epitaxie an halbleitenden Schichtgitterkristallen, UHV Experimente zu Pyrit-Oberflaechen und Schichten; Praeparation von Pyrit-Schichten; Herstellung und Charakterisierung von CuInS_2-Schichten; ZnO-Abscheidung durch reaktives Magnetron-Sputtern; Photoleitfaehige Polymere (Modifizierung von Polymethylphenylsilan). (MM)SIGLEAvailable from TIB Hannover: F96B303+a / FIZ - Fachinformationszzentrum Karlsruhe / TIB - Technische InformationsbibliothekBundesministerium fuer Forschung und Technologie (BMFT), Bonn (Germany)DEGerman