Development of low cost, high reliability sealing techniques for hybrid microcircuit packages. Phase 2, supplement 1: Moisture permeation of adhesive-sealed hybrid microcircuit packages

The susceptibility of adhesive-sealed ceramic packages to moisture permeation was investigated. The two adhesives, Ablebond 789-1 and Epo-Tek H77, were evaluated as package sealants. These adhesives were previously selected as the most promising candidates for this application from a group of ten adhesives. Ceramic packages sealed with these adhesives were exposed to temperature-humidity conditions of 25 C/98 percent RH, 50 C/60 percent RH, 50 C/98 percent RH, and 85 C/85 percent RH and their moisture contents using were monitored solid state moisture sensors sealed inside them. Five packages were tested at each of these exposures - two ceramic packages sealed with each of the two adhesives and one seam-sealed gold-plated Kovar package. This latter package was included to serve as a control. The results showed that the adhesive-sealed packages were not hermetic to moisture. The rates at which moisture entered the packages increased with the severity of the exposure environments (i.e., higher temperatures and higher moisture vapor pressures) with greater dependence on temperature than on moisture vapor pressure

Development of low cost, high reliability sealing techniques for hybrid microcircuit packages, phase 2

Adhesives were evaluated to determine if they qualify for application to hybrid microcircuit packages. The effort consisted of the following: (1) seal gold-plated Kovar packages with selective adhesives and determine seal integrity after exposure to temperature humidity environments; (2) seal both gold-plated Kovar and ceramic packages with the four best adhesives identified in (1) and determine seal integrity after exposure to MIL-STD-883A test environments; and (3) subject the best adhesive identified in (2) to a 60 C/98% RH environment and determine susceptibility to moisture permeation. Test results are provided

Investigation of organic adhesives for hybrid microcircuits

The properties of organic adhesives were investigated to acquire information for a guideline document regarding the selection of adhesives for use in high reliability hybrid microcircuits. Specifically, investigations were made of (1) alternate methods for determining the outgassing of cured adhesives, (2) effects of long term aging at 150 C on the electrical properties of conductive adhesives, (3) effects of shelf life age on adhesive characteristics, (4) bond strengths of electrically conductive adhesives on thick film gold metallization, (5) a copper filled adhesive, (6) effects of products outgassed from cured adhesives on device electrical parameters, (7) metal migration from electrically conductive adhesives, and (8) ionic content of electrically insulative adhesives. The tests performed during these investigations are described, and the results obtained are discussed

Design guidelines for hybrid microcircuits; organic adhesives for hybrid microcircuits

The properties of organic adhesives were studied to acquire an adequate information base to generate a guideline document for the selection of adhesives for use in high reliability hybrid microcircuits. Specific areas covered include: (1) alternate methods for determining the outgassing of cured adhesives; (2) effects of long term aging at 150C on the electrical properties of conductive adhesives; (3) effects of shelf life age on adhesive characteristics; (4) bond strengths of electrically conductive adhesives on thick film gold metallization, (5) a copper filled adhesive; (6) effects of products outgassed from cured adhesives on device electrical parameters; (7) metal migration from electrically conductive adhesives; and (8) ionic content of electrically insulative adhesives. The tests performed during these investigations are described, and the results obtained are discussed in detail

Investigation of low cost, high reliability sealing techniques for hybrid microcircuits, phase 1

A preliminary investigation was made to determine the feasibility of using adhesive package sealing for hybrid microcircuits. Major effort consisted of: (1) surveying representative hybrid manufacturers to assess the current use of adhesives for package sealing; (2) making a cost comparison of metallurgical versus adhesive package sealing; (3) determining the seal integrity of gold plated flatpack type packages sealed with selected adhesives, thermal shock, temperature cycling, mechanical shock, and constant acceleration test environments; and (4) defining a more comprehensive study to continue the evaluation of adhesives for package sealing. Results showed that 1.27 cm square gold plated flatpack type packages sealed with the film adhesives and the paste adhesive retained their seal integrity after all tests, and that similarly prepared 2.54 cm square packages retained their seal integrity after all tests except the 10,000 g's constant acceleration test. It is concluded that these results are encouraging, but by no means sufficient to establish the suitability of adhesives for sealing high reliability hybrid microcircuits

Development of a qualification standard for adhesives used in hybrid microcircuits

Improved qualification standards and test procedures for adhesives used in microelectronic packaging are developed. The test methods in specification for the Selection and Use of Organic Adhesives in Hybrid Microcircuits are reevaluated versus industry and government requirements. Four electrically insulative and four electrically conductive adhesives used in the assembly of hybrid microcircuits are selected to evaluate the proposed revised test methods. An estimate of the cost to perform qualification testing of an adhesive to the requirements of the revised specification is also prepared

Design guidelines for use of adhesives and organic coatings in hybrid microcircuits

A study was conducted to investigate the reliability of organic adhesives in hybrid microcircuits. The objectives were twofold: (1) to identify and investigate problem areas that could result from the use of organic adhesives and (2) to develop evaluation tests to quantify the extent to which these problems occur for commercially available adhesives. Efforts were focused on electrically conductive adhesives. Also, a study was made to evaluate selected organic coatings for contamination protection for hybrid microcircuits

Laparoscopic ileocecal resection in acute and chronic presentations of Crohn's disease. A single center experience

The terminal ileum is the most involved tract in Crohn's disease. The obstruction in this location is the most frequent complication. Acute or chronic presentations can occur. Surgery finds a role in the management of chronic strictures and in acute clinical presentations with complications not improving with conservative therapy

Mirror neuron activation in children with developmental coordination disorder: A functional MRI study.

The aim of this study was to reveal cortical areas that may contribute to the movement difficulties seen in children with Developmental Coordination Disorder (DCD). Specifically, we hypothesized that there may be a deficit in the mirror neuron system (MNS), a neural system that responds to both performed and observed actions. Using functional MRI, 14 boys with DCD (x¯=10.02 years±1.28, range=8.33-11.17 years) and 12 typically developing controls (x¯=10.10 years±1.16, range=8.02-12 years) were scanned observing, executing and imitating a finger sequencing task using their right hand. Cortical activations of mirror neuron regions, including posterior inferior frontal gyrus, ventral premotor cortex, anterior inferior parietal lobule and superior temporal sulcus were examined. Children with DCD had decreased cortical activation mirror neuron related regions, including the precentral gyrus and inferior frontal gyrus, as well as in the posterior cingulate and precuneus complex when observing the sequencing task. Region of interest analysis revealed lower activation in the pars opercularis, a primary MNS region, during imitation in the DCD group compared to controls. These findings provide some preliminary evidence to support a possible MNS dysfunction in children with DCD

Is it really useful the harmonic scalpel in axillary dissection for locally advanced breast cancer? A case series

Background. The seroma is one of the most common complications in the axillary lymph nodal dissection (different surgical approaches have been tried to reduce the seroma incidence). In our study we evaluate the outcome of patients using or not the ultrasonic scalpel (Harmonic scalpel) according to a standardized surgical technique. Patients and Methods. From January 2011 to December 2015 120 patients underwent axillary dissection for breast cancer. Patients were divided in two groups: patients belonging to the first group underwent Harmonic scalpel dissection and patients belonging to the second group underwent classical dissection. Each group consisted of 60 patients. Quadrantectomy (QUAD) was performed in 54 patients, 66 women underwent mastectomy. In all patients axillary dissection included the I, II and III level. We compared two groups in terms of: time of surgery, hematoma, drainage volume, days of sealing drainage, seroma formation, number of post-seroma aspirations, upper limb lymphedema, wound infections, post-operative pain. Results. Statistically significant results were obtained in terms of the total volume of the breast and axillary drainage in the two techniques. There were no significant differences in the two samples in terms of operative time incidence of seroma, post-operative hematoma, wound infection, and lymphedema of the upper limb. Conclusion. The small number of cases did not allow us to reach definitive conclusions. The use of Harmonic scalpel seems to show smaller incidence of seroma and reduction of the amount of both breast and axillary drainages. Further studies are needed to define the real advantage in terms of cost benefit of using these devices in the axillary surgery