University teachers’ views of interprofessional learning and their role in achieving outcomes - a qualitative study

Over the past decade, there has been a rapid increase in higher education institutions offering opportunities for interprofessional learning (IPL) to their students. The literature presents a number of factors that contribute to effective IPL, including having trained facilitators that help optimise the learning process. Many of these IPL facilitators are university teachers and the literature provides us with some insight into their views of IPL. However, little is known about university teachers’ views about IPL and their role in supporting students in achieving outcomes linked to IPL during their own teaching; this paper explores these areas. University teachers, working with students in Norway and England who contribute to patients’ care pathway were purposively invited to join focus groups. Data collected from the teachers’ conversations during these focus groups were analysed to elicit the main themes. Findings show that university teachers have a wide range of views about IPL, its potential to enhance collaborative practice and care, and their role in helping students achieve outcomes linked to IPL. A key challenge appears to be whether IPL is “worth the struggle,” which emphasises the need for strong leadership in order to align pedagogical approaches in education and practice that strive to achieve agreed outcomes

Test Results of the first 3D-IC Prototype Chip Developed in the Framework of HL-SLHC/ATLAS Hybrid Pixel Upgrade

Published in the Journal of Instrumentation (JINST) Proceedings SectionTo face new challenges brought by the upgrades of the Large Hadron Collider at CERN and of ATLAS pixels detector, for which high spatial resolution, very good signal to noise ratio and high radiation hardness are needed, 3D Integrated Technologies are investigated. Commercial offers of such technologies are only very few and the 3D designer's choice is as a consequence strongly constrained. We present here the test results of the first 3D prototype chip developed in the GlobalFoundries 130 nm chips processed by the Tezzaron Company, submitted within the 3D-IC consortium for which a reliable qualification program was developed. Reliability and influence on the integrated devices behavior of Bond Interface (BI) and Through Silicon Via (TSV) connections, both needed for the 3D integration process, has also been addressed by the tests