Cost-Effective TSV Grouping for Yield Improvement of 3D-ICs

Three-dimensional Integrated Circuits (3D-ICs) vertically stack multiple silicon dies to reduce overall wire length, power consumption, and allow integration of heterogeneous technologies. Through-silicon-vias (TSVs) which act as vertical links between layers pose challenges for 3D integration design. TSV defects can happen in fabrication process and bonding stage, which can reduce the yield and increase the cost. Recent work proposed the employment of redundant TSVs to improve the yield of 3D-ICs. This paper presents a redundant TSVs grouping technique, which partition regular and redundant TSVs into groups. For each group, a set of multiplexers are used to select good signal paths away from defective TSVs. We investigate the impact of grouping ratio (regular-to-redundant TSVs in one group) on trade-off between yield and hardware overhead. We also show probabilistic models for yield analysis under the influence of independent and clustering defect distributions. Simulation results show that for a given number of TSVs and TSV failure rate, careful selection of grouping ratios lead to achieving 100% yield at minimal hardware cost (number of multiplexers and redundant TSVs) in comparison to a design that does not exploit TSV grouping ratios

Hardware Trojan Detection on a PCB Through Differential Power Monitoring

There is a general consensus that contemporary electronics are at risk of cyber-attacks or malicious modifications, such as Hardware Trojans (HT). This makes it crucial to develop reliable countermeasures at both Integrated Circuit (IC) and Printed Circuit Board (PCB) levels. While HT detection at IC level has been widely studied in the past several years, there is still very limited research carried out to tackle HTs on PCBs. We propose a power analysis method for detecting HT components implanted on PCBs. An experimental setup, using a hardware prototype, is built and tested for verification of the methodology, taking process and temperature variations into account. The results confirm the ability to detect alien components on a PCB and provide directions for further research. The performance degradation of the original PCB due to the implementation of the proposed approach is negligible. The area overhead of the proposed method is small, related to the original PCB design, and consists of Sub Power Monitors of individual ICs on the PCB and Main Power Monitor for the overall power measurement of the PCB. To the best of our knowledge this research is the first to develop a PCB HT detection methodology using power analysis

High quality testing of grid style power gating

This paper shows that existing delay-based testing techniques for power gating exhibit fault coverage loss due to unconsidered delays introduced by the structure of the virtual voltage power-distribution-network (VPDN). To restore this loss, which could reach up to 70.3% on stuck-open faults, we propose a design-for-testability (DFT) logic that considers the impact of VPDN on fault coverage in order to constitute the proper interface between the VPDN and the DFT. The proposed logic can be easily implemented on-top of existing DFT solutions and its overhead is optimized by an algorithm that offers trade-off flexibility between test-application-time and hardware overhead. Through physical layout SPICE simulations, we show complete fault coverage recovery on stuck-open faults and 43.2% test-application-time improvement compared to a previously proposed DFT technique. To the best of our knowledge, this paper presents the first analysis of the VPDN impact on test qualit

Modeling the Impact of Process Variation on Resistive Bridge Defects

Recent research has shown that tests generated without taking process variation into account may lead to loss of test quality. At present there is no efficient device-level modeling technique that models the effect of process variation on resistive bridges. This paper presents a fast and accurate technique to model the effect of process variation on resistive bridge defects. The proposed model is implemented in two stages: firstly, it employs an accurate transistor model (BSIM4) to calculate the critical resistance of a bridge; secondly, the effect of process variation is incorporated in this model by using three transistor parameters: gate length (L), threshold voltage (V) and effective mobility (ueff) where each follow Gaussian distribution. Experiments are conducted on a 65-nm gate library (for illustration purposes), and results show that on average the proposed modeling technique is more than 7 times faster and in the worst case, error in bridge critical resistance is 0.8% when compared with HSPICE

Delay test for diagnosis of power switches

Power switches are used as part of power-gating technique to reduce leakage power of a design. To the best of our knowledge, this is the first work in open-literature to show a systematic diagnosis method for accurately diagnosingpower switches. The proposed diagnosis method utilizes recently proposed DFT solution for efficient testing of power switches in the presence of PVT variation. It divides power switches into segments such that any faulty power switch is detectable thereby achieving high diagnosis accuracy. The proposed diagnosis method has been validated through SPICE simulation using a number of ISCAS benchmarks synthesized with a 90-nm gate library. Simulation results show that when considering the influence of process variation, the worst case loss of accuracy is less than 4.5%; and the worst case loss of accuracy is less than 12% when considering VT (Voltage and Temperature) variations

NBTI and leakage aware sleep transistor design for reliable and energy efficient power gating

In this paper we show that power gating techniques become more effective during their lifetime, since the aging of sleep transistors (STs) due to negative bias temperature instability (NBTI) drastically reduces leakage power. Based on this property, we propose an NBTI and leakage aware ST design method for reliable and energy efficient power gating. Through SPICE simulations, we show lifetime extension up to 19.9x and average leakage power reduction up to 14.4% compared to standard STs design approach without additional area overhead.Finally, when a maximum 10-year lifetime target is considered, we show that the proposed method allows multiple beneficial options compared to a standard STs design method: either to improve circuit operating frequency up to 9.53% or to reduce ST area overhead up to 18.4

BTI and leakage aware dynamic voltage scaling for reliable low power cache memories

We propose a novel dynamic voltage scaling (DVS)approach for reliable and energy efficient cache memories. First, we demonstrate that, as memories age, leakage power reduction techniques become more effective due to sub-threshold current reduction with aging. Then, we provide an analytical model and a design exploration framework to evaluate trade-offs between leakage power and reliability, and propose a BTI and leakage aware selection of the “drowsy” state retention voltage for DVS of cache memories. We propose three DVS policies, allowing us to achieve different power/reliability trade-offs. Through SPICE simulations, we show that a critical charge and a static noise margin increase up to 150% and 34.7%, respectively, is achieved compared to standard aging unaware drowsy technique, with a limited leakage power increase during the very early lifetime, and with leakage energy saving up to 37% in 10 years of operation. These improvements are attained at zero or negligible area cos