388 research outputs found

    Robot-Based Research on Three-Layer Oriented Flakeboards

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    A small jointed-arm motion type robot system was introduced for wood mat formation to study the relationship between wood mat structure and panel properties. Four types of structures of three-layer oriented flakeboards with different face to core ratios and core orientations were formed using the robot as a tool. The panels were then hot-pressed and tested for horizontal density distribution (HDD) by X-ray machine, bending modulus of elasticity (MOE), internal bond (IB) and thickness swelling (TS). The results showed that the programmed robot formed panels with well-defined and reproducible structures. Linked with the existing panel simulation program, X-ray data, and real properties, the panel structure with face to core ratio of 15:70:15 and random core has been considered the most suitable panel pattern for additional research based on its superior performance and lower variation of properties

    Quadratic RSM Models of Processing Parameters for Three-Layer Oriented Flakeboards

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    Response surface method with central composite design was used to establish quadratic regression models and surface maps to relate panel properties, including static bending modulus of elasticity, modulus of rupture, internal bond strength, and thickness swelling with flake slenderness ratio, flake orientation, and panel density. A robot mat formation system was used to form the panels with predefined processing parameters. Results indicated that nonlinear models capable of including interactions were required to relate flake slenderness ratio, flake orientation, and panel density to panel properties. An optimization model was developed to obtain the best panel performance with respect to the three factors. The optimized combination of the three factors within the experimental range is: 133 for flake slenderness ratio, 8° for surface flake orientation, and 0.62g/cm3 for board density

    Digital projection photochemical etching for gray-scale semiconductor applications

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    In the contemporary semiconductor industry, with the ever-growing demand for smaller, denser, and newer device features, various industrial and academic research groups across the world are looking beyond the conventional planar lithography and fabrication methods for semiconductor materials. The rapidly evolving domain of 3-dimensional and gray-scale semiconductor device fabrication paves the way for a wide range of revolutionary techniques, innovative applications, and promising products. This thesis presents digital projection photochemical etching, a novel and dynamic semiconductor fabrication technique that achieves a 3-dimensional structure in a single etch step. This technique utilizes a commercial digital projector to focus a substantially de-magnified image beam pattern onto the semiconductor sample, where the projected image itself is used to catalyze and define the etching. The discussion begins with a thorough introduction and literature review to cover the fundamental mechanisms behind the technique of photochemical etching. This is followed by an in-depth explanation of the methodology of experimental design and setup configuration. Subsequently, the thesis comprehensively describes the fabrication of various novel structures and devices using digital projection photochemical etching, demonstrating this technique’s resolution, dynamics, and ability to integrate with higher-resolution lithography methods while preserving the unique gray-scale feature control

    Simple and Effective Online Position Error Compensation Method for Sensorless SPMSM Drives

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    Online Identification of Intrinsic Load Current Dependent Position Estimation Error for Sensorless PMSM Drives

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