In situ imaging of microstructure formation in electronic interconnections

The development of microstructure during melting, reactive wetting and solidification of solder pastes on Cu-plated printed circuit boards has been studied by synchrotron radiography. Using Sn-3.0Ag-0.5Cu/Cu and Sn-0.7Cu/Cu as examples, we show that the interfacial Cu6Sn5 layer is present within 0.05 s of wetting, and explore the kinetics of flux void formation at the interface between the liquid and the Cu6Sn5 layer. Quantification of the nucleation locations and anisotropic growth kinetics of primary Cu6Sn5 crystals reveals a competition between the nucleation of Cu6Sn5 in the liquid versus growth of Cu6Sn5 from the existing Cu6Sn5 layer. Direct imaging confirms that the β-Sn nucleates at/near the Cu6Sn5 layer in Sn-3.0Ag-0.5Cu/Cu joints

Crystal structure of Cu-Sn-In alloys around the {\eta} phase field studied by neutron diffraction

The study of the Cu-Sn-In ternary system has become of great importance in recent years, due to new environmental regulations forcing to eliminate the use of Pb in bonding technologies for electronic devices. A key relevant issue concerns the intermetallic phases which grow in the bonding zone and are determining in their quality and performance. In this work, we focus in the {\eta}-phase (Cu2In or Cu6Sn5) that exists in both end binaries and as a ternary phase. We present a neutron diffraction study of the constitution and crystallography of a series of alloys around the 60 at.% Cu composition, and with In contents ranging from 0 to 25 at.%, quenched from 300\degreeC. The alloys were characterized by scanning electron microscopy, probe microanalysis and high-resolution neutron diffraction. The Rietveld refinement of neutron diffraction data allowed to improve the currently available model for site occupancies in the hexagonal {\eta}-phase in the binary Cu-Sn as well as in ternary alloys. For the first time, structural data is reported in the ternary Cu-Sn-In {\eta}-phase as a function of composition, information that is of fundamental technological importance as well as valuable input data for ongoing modelisations of the ternary phase diagram.Comment: 8 pages, 10 figure

Effect of Ni on the Formation and Growth of Primary Cu6Sn5 Intermetallics in Sn-0.7 wt.%Cu Solder Pastes on Cu Substrates During the Soldering Process

This paper investigates the effect of 0.05 wt.% Ni on the formation and growth of primary Cu6Sn5 in Sn-0.7 wt.%Cu solder paste soldered on a Cu substrate, using a real-time synchrotron imaging technique. It was found that small additions of Ni significantly alter the formation and growth of the primary Cu6Sn5 intermetallics, making them small. In contrast, without Ni, primary Cu6Sn5 intermetallics tend to continue growth throughout solidification and end up much larger and coarser. The primary effect of the Ni addition appears to be in promoting the nucleation of a larger amount of small Cu6Sn5. The results provide direct evidence of the sequence of events in the reaction of Ni-containing Sn-0.7 wt.%Cu solder paste with a Cu substrate, and in particular the formation and growth of the primary Cu6Sn5 intermetallic

Effect of Phosphorus and Strontium Additions on Formation Temperature and Nucleation Density of Primary Silicon in Al-19 Wt Pct Si Alloy and Their Effect on Eutectic Temperature

The influence of P and Sr additions on the formation temperature and nucleation density of primary silicon in Al-19 wt pct Si alloy has been determined, for small volumes of melt solidified at cooling rates _T of ~0.3 and 1 K/s. The proportion of ingot featuring primary silicon decreased progressively with increased Sr addition, which also markedly reduced the temperature for first formation of primary silicon and the number of primary silicon particles per unit volume �Nv: When combined with previously published results, the effects of amount of P addition and cooling rate on �Nv are in reasonable accord with �Nv� _T ¼ ðp=6fÞ1=2 109 [250 � 215 (wt pct P)0.17]�3, where �Nv is in mm�3, _T is in K/s, and f is volume fraction of primary silicon. Increased P addition reduces the eutectic temperature, while increased Sr appears to generate a minimum in eutectic temperature at about 100 ppmw Sr

Effects of Ni and TiO2 additions in as-reflowed and annealed Sn0.7Cu solders on Cu substrates

The growth of CuSn and CuSn interfacial layers after isothermal annealing and the resultant effect on the solder joint strength are studied in TiO and Ni containing Sn0.7Cu solders. These composite solders were fabricated using a powder metallurgy method and reflow soldered on a Cu substrate printed circuit board (PCB) with an organic soldering preservative (OSP) surface finish. With TiO additions, a more planar scalloped CuSn morphology was observed with reduced interfacial boundary grooves while a fine scallop-shaped interfacial (Cu,Ni)Sn layer was observed in Ni containing solder joints. The interfacial layer was further suppressed with a combination of Ni and TiO even after annealing which resulted in superior shear strength and fracture energy

Типовая учебная программа для высших учебных заведений по специальности 1-21 01 01 Теология

Effects of Bi additions to Ag-containing lead-free solders have been the focus of a considerable amount of past investigation. However, the influence of Bi on Sn-Cu-Ni solders has not been studied extensively. In the present study, we explore the influence of Bi on microstructure formation of Sn-0.7Cu-0.05Ni/Cu solder joints both in the bulk and at the interface. It is shown that (i) Sn-0.7Cu-0.05Ni solidifies to produce a markedly different grain structure to Ag-containing lead-free alloys, with 5-8 independent βSn grains in each joint; (ii) Bi additions to Sn-0.7Cu-0.05Ni maintain this distinct βSn grain structure and had no discernible effect on the (Cu,Ni)6Sn5 interfacial intermetallic layers or primary intermetallic crystals

Al8Mn5 particle settling and interactions with oxide films in liquid AZ91 magnesium alloys

Al8Mn5 particles form as primary solidification phases in Mg-Al-based alloys and are important for ensuring adequate corrosion resistance. However, excessive Al8Mn5 formation above the α-Mg liquidus temperature can lead to sludge formation, and the clustering of Al8Mn5 particles on oxide films can generate deleterious casting defects. Here, we use analytical SEM and real-time synchrotron x-ray radiography to study Al8Mn5 particle settling, the formation of a sludge layer, and the mechanism of Al8Mn5 clustering on oxides in AZ91 containing two Fe levels. It is shown that settling Al8Mn5 can become trapped in entrained oxide and that new Al8Mn5 particles also seem to nucleate on oxide films. On cooling, these Al8Mn5 particles continue to grow, creating large Al8Mn5 clusters

Study of heterogeneous nucleation of eutectic Si in high-purity Al-Si alloys with Sr addition

The official published version can be accessed from the link below - Copyright @ 2010 The Minerals, Metals & Materials Society and ASM InternationalAl-5 wt pct Si master-alloys with controlled Sr and/or P addition/s were produced using super purity Al 99.99 wt pct and Si 99.999 wt pct materials in an arc melter. The master-alloy was melt-spun resulting in the production of thin ribbons. The Al matrix of the ribbons contained entrained Al-Si eutectic droplets that were subsequently investigated. Differential scanning calorimetry, thermodynamic calculations, and transmission electron microscopy techniques were employed to examine the effect of the Sr and P additions on eutectic undercoolings and nucleation phenomenon. Results indicate that, unlike P, Sr does not promote nucleation. Increasing Sr additions depressed the eutectic nucleation temperature. This may be a result of the formation of a Sr phase that could consume or detrimentally affect potent AlP nucleation sites.This work is financially supported by the Higher Education Commission of Pakistan and managerially supported from the OAD

Microstructure control in Sn-0.7mass%Cu alloys

Soldering alloys based oft the Sn-Cu alloy system are amongst the most favourable lead-free alternatives due to a range of attractive properties. Trace additions of Ni have been found to significantly improve the soldering characteristics of these alloys (reduced bridging etc.). This paper examines the mechanisms underlying the improvement in soldering properties of Sn-0.7 mass%Cu eutectic alloys modified with concentrations of Ni ranging front 0 to 1000 ppm. The alloys were investigated by thermal analysis during solidification, as well as optical/SEM microanalyses of fully solidified samples anti samples quenched during solidification. It is concluded that Ni additions dramatically alter the nucleation patterns and solidification behaviour of the Sn-Cu6Sn5 eutectic anti that these changes are related to the superior soldering characteristics of the Ni-modified Sn-0.7 mass%Cu alloys