Additional file 1: of Extracellular vesicle-derived DNA for performing EGFR genotyping of NSCLC patients

Materials and methods. Table S1. Patient demographics and clinical characteristics. Table S2. Concentration and purity (260/280) of BALF EV DNA and BALF cfDNA. Table S3. Concentration of DNA larger than 1kb in EV DNA and cfDNA. Table S4. Ct value of EV DNA and cfDNA samples and their differences. Table S5. Comparison of the EGFR mutation status between tumor tissue and plasma in EGFR-TKIs naïve patients. Table S6. Clinical characteristics of patients who developed acquired resistance to 1st or 2nd generation EGFR-TKIs and underwent rebiopsy. Figure S1. Sizes of purified BALF EVs. Figure S2. Sizes of purified plasma EVs. Figure S3. EM image of BALF EVs. Figure S4. Immuno-EM images show detection of dsDNA in BALF EVs. Red arrows indicate gold particles. Figure S5. Gel-like images show the size and amount of EV DNA and cfDNA determined using the bioanalyzer. (DOCX 900 kb

A Vertically Integrated Junctionless Nanowire Transistor

A vertically integrated junctionless field-effect transistor (VJ-FET), which is composed of vertically stacked multiple silicon nanowires (SiNWs) with a gate-all-around (GAA) structure, is demonstrated on a bulk silicon wafer for the first time. The proposed VJ-FET mitigates the issues of variability and fabrication complexity that are encountered in the vertically integrated multi-NW FET (VM-FET) based on an identical structure in which the VM-FET, as recently reported, harnesses a source and drain (S/D) junction for its operation and is thus based on the inversion mode. Variability is alleviated by bulk conduction in a junctionless FET (JL-FET), where current flows through the core of the SiNW, whereas it is not mitigated by surface conduction in an inversion mode FET (IM-FET), where current flows via the surface of the SiNW. The fabrication complexity is reduced by the inherent JL structure of the JL-FET because S/D formation is not required. In contrast, it is very difficult to dope the S/D when it is positioned at each floor of a tall SiNW with greater uniformity and with less damage to the crystalline structure of the SiNW in a VM-FET. Moreover, when the proposed VJ-FET is used as nonvolatile flash memory, the endurance and retention characteristics are improved due to the above-mentioned bulk conduction

Vertically Integrated Multiple Nanowire Field Effect Transistor

A vertically integrated multiple channel-based field-effect transistor (FET) with the highest number of nanowires reported ever is demonstrated on a bulk silicon substrate without use of wet etching. The driving current is increased by 5-fold due to the inherent vertically stacked five-level nanowires, thus showing good feasibility of three-dimensional integration-based high performance transistor. The developed fabrication process, which is simple and reproducible, is used to create multiple stiction-free and uniformly sized nanowires with the aid of the one-route all-dry etching process (ORADEP). Furthermore, the proposed FET is revamped to create nonvolatile memory with the adoption of a charge trapping layer for enhanced practicality. Thus, this research suggests an ultimate design for the end-of-the-roadmap devices to overcome the limits of scaling

Three-Dimensional Fin-Structured Semiconducting Carbon Nanotube Network Transistor

Three-dimensional (3-D) fin-structured carbon nanotube field-effect transistors (CNT-FETs) with purified 99.9% semiconducting CNTs were demonstrated on a large scale 8 in. silicon wafer. The fabricated 3-D CNT-FETs take advantage of the 3-D geometry and exhibit enhanced electrostatic gate controllability and superior charge transport. A trigated structure surrounding the randomly networked single-walled CNT channel was formed on a fin-like 3-D silicon frame, and as a result, the effective packing density increased to almost 600 CNTs/μm. Additionally, highly sensitive controllability of the threshold voltage (<i>V</i>_TH) was achieved using a thin back gate oxide in the same silicon frame to control power consumption and enhance performance. Our results are expected to broaden the design margin of CNT-based circuit architectures for versatile applications. The proposed 3-D CNT-FETs can potentially provide a desirable alternative to silicon based nanoelectronics and a blueprint for furthering the practical use of emerging low-dimensional materials other than CNTs