A vertically integrated
junctionless field-effect transistor (VJ-FET), which is composed of
vertically stacked multiple silicon nanowires (SiNWs) with a gate-all-around
(GAA) structure, is demonstrated on a bulk silicon wafer for the first
time. The proposed VJ-FET mitigates the issues of variability and
fabrication complexity that are encountered in the vertically integrated
multi-NW FET (VM-FET) based on an identical structure in which the
VM-FET, as recently reported, harnesses a source and drain (S/D) junction
for its operation and is thus based on the inversion mode. Variability
is alleviated by bulk conduction in a junctionless FET (JL-FET), where
current flows through the core of the SiNW, whereas it is not mitigated
by surface conduction in an inversion mode FET (IM-FET), where current
flows via the surface of the SiNW. The fabrication complexity is reduced
by the inherent JL structure of the JL-FET because S/D formation is
not required. In contrast, it is very difficult to dope the S/D when
it is positioned at each floor of a tall SiNW with greater uniformity
and with less damage to the crystalline structure of the SiNW in a
VM-FET. Moreover, when the proposed VJ-FET is used as nonvolatile
flash memory, the endurance and retention characteristics are improved
due to the above-mentioned bulk conduction