Implantation doping of GaN

Ion implantation has played an enabling role in the realization of many high performance photonic and electronic devices in mature semiconductor materials systems such as Si and GaAs. This can also be expected to be the case in III-Nitride based devices as the material quality continues to improve. This paper reviews the progress in ion implantation processing of the III-Nitride materials, namely, GaN, AlN, InN and their alloys. Details are presented of the successful demonstrations of implant isolation as well as n- and p-type implantation doping of GaN. Implant doping has required activation annealing at temperatures in excess of 1,000 C. The nature of the implantation induced damage and its response to annealing is addressed using Rutherford Backscattering. Finally, results are given for the first demonstration of a GaN device fabricated using ion implantation doping, a GaN junction field effect transistor (JFET)

Implantation activation annealing of Si-implanted gallium nitride at temperatures > 1,100 C

The activation annealing of Si-implanted GaN is reported for temperatures from 1,100 to 1,400 C. Although previous work has shown that Si-implanted GaN can be activated by a rapid thermal annealing at {approximately}1,100 C, it was also shown that significant damage remained in the crystal. Therefore, both AlN-encapsulated and uncapped Si-implanted GaN samples were annealed in a metal organic chemical vapor deposition system in a N{sub 2}/NH{sub 3} ambient to further assess the annealing process. Electrical Hall characterization shows increases in carrier density and mobility for annealing up to 1,300 C before degrading at 1,400 C due to decomposition of the GaN epilayer. Rutherford backscattering spectra show that the high annealing temperatures reduce the implantation induced damage profile but do not completely restore the as-grown crystallinity

Plasma-induced-damage of GaN

Plasma-induced-damage often degrades the electrical and optical properties of compound semiconductor devices. Despite the fact that the binding energy of GaN is larger than that for more conventional III--V compounds, etch damage is still a concern. Photoluminescence measurements and atomic force microscopy have been used to determine the damage induced in GaN by exposure to both electron cyclotron resonance (ECR) and inductively coupled plasmas (ICP) generated Ar plasmas

Complementary HFET technology for wireless digital and microwave applications

Development of a complementary heterostructure field effect transistor (CHFET) technology for low-power, mixed-mode digital-microwave applications is presented. Digital CHFET technology with independently optimizable transistors has been shown to operate with 319 ps loaded gate delays at 8.9 fJ. Power consumption is dominated by leakage currents of the p-channel FET, while performance is determined by the characteristics of 0.7 {mu}m gate length devices. As a microwave technology, the nJFET forms the basis of low-power cirucitry without any modification to the digital process. Narrow band amplification with a 0.7x100 {mu}m nJFET has been demonstrated at 2.1-2.4 GHz with gains of 8-10 dB at 1 mW power. These amplifiers showed a minimum noise figure of 2.5 dB. Next generation CHFET transistors with sub 0.5 {mu}m gate lengths have also been developed. Cutoff frequencies of 49 and 11.5 GHz were achieved for n- and p-channel FETs with 0.3 and 0.4 {mu}m gates, respectively. These FETs will enable enhancements in both digital and microwave circuits

Effect of hydrogen on Ca and Mg acceptors in GaN

The influence of minority carrier injection on the reactivation of hydrogen passivated Mg in GaN at 175 C has been investigated in p-n junction diodes. The dissociation of the neutral MgH complexes is greatly enhanced in the presence of minority carrier and the reactivation process follows second order kinetics. Conventional annealing under zero-bias conditions does not produce Mg-H dissociation until temperatures {ge} 450 C. These results provide an explanation for the e-beam induced reactivation of Mg acceptors in hydrogenated GaN. Exposure to a hydrogen plasma at 250 C of p-type GaN (Ca) prepared by either Ca{sup +} or Ca{sup +} plus P{sup +} coimplantation leads to a reduction in sheet carrier density of approximately an order of magnitude (1.6 {times} 10{sup 12} cm{sup {minus}2} to 1.8 {times} 10{sup 11} cm{sup {minus}2}), and an accompanying increase in hole mobility (6 cm{sup 2}/Vs to 18 cm{sup 2}/Vs). The passivation process can be reversed by post-hydrogenation annealing at 400--500 C under a N{sub 2} ambient. This reactivation of the acceptors is characteristic of the formation of neutral (Ca-H) complexes in the GaN. The thermal stability of the passivation is similar to that of Mg-H complexes in material prepared in the same manner (implantation) with similar initial doping levels. Hydrogen passivation of acceptor dopants in GaN appears to be a ubiquitous phenomenon, as it is in other p-type semiconductors

High-efficiency and high-power vertical-cavity surface-emitting laser designed for cryogenic applications

Includes bibliographical references.We report the first vertical-cavity surface-emitting laser (VCSEL) that has been optimized for cryogenic applications near 77 K, with superior characteristics that include a high output power (Pout = 22 mW at I = 25 mA), high power conversion efficiency (ηd = 32%), low threshold voltage (Vth = 1.75 V) and current (Ith = 1.7 mA), and low power dissipation (9 mW at Pout = 2.0 mW) for a 20-μm-diameter device.This work was supported in part by AFOSR and the DOE under Contract No. DE-AC04-94AL85000

A survey of ohmic contacts to III-V compound semiconductors

A survey of ohmic contact materials and properties to GaAs, InP, GaN will be presented along with critical issues pertaining to each semiconductor material. Au-based alloys (e.g., GeAuNi for n-type GaAs) are the most commonly used contacts for GaAs and InP materials for both n- and p-type contacts due to the excellent contact resistivity, reliability, and usefulness over a wide range of doping levels. Research into new contacting schemes for these materials has focused on addressing limitations of the conventional Au-alloys in thermal stability, propensity for spiking, poor edge definition, and new approaches for a non-alloyed contact. The alternative contacts to GaAs and InP include alloys with higher temperature stability, contacts based on solid phase regrowth, and contacts that react with the substrate to form lower bandgap semiconductors alloys at the interface. A new area of contact studies is for the wide bandgap group III-Nitride materials. At present, low resistivity ohmic contact to p-type GaN has not been obtained primarily due to the large acceptor ionization energy and the resultant difficulty in achieving high free hole concentrations at room temperature. For n-type GaN, however, significant progress has been reported with reactive Ti-based metalization schemes or the use of graded InGaN layers. The present status of these approaches will be reviewed

High temperature surface degradation of III-V nitrides

The surface stoichiometry, surface morphology and electrical conductivity of AlN, GaN, InN, InGaN and InAlN was examined at rapid thermal annealing temperatures up to 1,150 C. The sheet resistance of the AlN dropped steadily with annealing, but the surface showed signs of roughening only above 1,000 C. Auger Electronic Spectroscopy (AES) analysis showed little change in the surface stoichiometry even at 1,150 C. GaN root mean square (RMS) surface roughness showed an overall improvement with annealing, but the surface became pitted at 1,000 C, at which point the sheet resistance also dropped by several orders of magnitude, and AES confirmed a loss of N from the surface. The InN surface had roughened considerably even at 650 C, and scanning electron microscopy (SEM) showed significant degradation. In contrast to the binary nitrides the sheet resistance of InAlN was found to increase by {approximately} 10{sup 2} from the as grown value after annealing at 800 C and then remain constant up to 1,000 C, while that of InGaN increased rapidly above 700 C. The RMS roughness increased above 800 C and 700 C respectively for InAlN and InGaN samples. In droplets began to form on the surface at 900 C for InAlN and at 800 C for InGaN, and then evaporate at 1,000 C leaving pits. AES analysis showed a decrease in the N concentration in the top 500 {angstrom} of the sample for annealing {ge} 800 C in both materials

High Temperature Surface Degradation of III-V Nitrides

The surface stoichiometry, surface morphology and electrical conductivity of AlN, GaN, InN, InGaN and InAlN was examined at rapid thermal annealing temperatures up to 1,150 C. The sheet resistance of the AlN dropped steadily with annealing, but the surface showed signs of roughening only above 1,000 C. Auger Electronic Spectroscopy (AES) analysis showed little change in the surface stoichiometry even at 1,150 C. GaN root mean square (RMS) surface roughness showed an overall improvement with annealing, but the surface became pitted at 1,000 C, at which point the sheet resistance also dropped by several orders of magnitude, and AES confirmed a loss of N from the surface. The InN surface had roughened considerably even at 650 C, and scanning electron microscopy (SEM) showed significant degradation. In contrast to the binary nitrides the sheet resistance of InAlN was found to increase by {approximately} 10{sup 2} from the as grown value after annealing at 800 C and then remain constant up to 1,000 C, while that of InGaN increased rapidly above 700 C. The RMS roughness increased above 800 C and 700 C respectively for InAlN and InGaN samples. In droplets began to form on the surface at 900 C for InAlN and at 800 C for InGaN, and then evaporate at 1,000 C leaving pits. AES analysis showed a decrease in the N concentration in the top 500 {angstrom} of the sample for annealing {ge} 800 C in both materials

High-frequency operation of 0.3 {mu}m GaAs JFETs for low-power electronic

GaAs Junction Field Effect Transistors (JFETs) have attracted renewed attention for low-power, low-voltage electronics. JFETs have a significant advantage over MESFETs for low-power operation due to their higher gate barrier to current flow resulting from p/n junction gate. This paper reports recent advances in an all ion implanted self-aligned GaAs JFET with a gate length down to 0.3 {mu}m. By employing shallopw SiF implants next to the gate, dielectric sidewall spacers, and 50 keV source and drain implants, JFETs with a f{sub t} up to 49 GHz with good pinchoff and subthreshold characteristics have been realized. In addition, the JFET benefits from the use of shallow Zn or Cd implantation to form abrupt p{sup +}/n gate profiles