Through Silicon Via-Based Grid for Thermal Control in 3D Chips

3D stacked chips have become a promising integration technology for modern systems. The complexity reached in multi-processor systems has increased the communication delays between processing cores, and an effective way to diminish this impact on communication is the 3D integration technology and the use of through-silicon vias (TSVs) for inter-layer communication. However, 3D chips present important ther- mal issues due to the presence of processing units with a high power density, which are not homogeneously distributed in the stack. Also, the presence of hot-spots creates thermal gradients that impact negatively on the system reliability and relate with the leakage power consumption. Thus, new approaches for thermal control of 3D chips are in great need. This paper discusses the use of a grid and non-uniform placement of TSVs as an effective mechanism for thermal balancing and control in 3D chips. We have modelled the material layers and TSVs mathematically using a detailed calibration phase based on a real 5-tier 3D chip stack, where several heaters and sensors are manufactured to study the heat diffusion. The obtained results show interesting conclusions about thermal dissipation for 3D chips with TSVs and outline new insights in the area of thermal modeling and optimization for 3D chips by exploiting the inclusion of minimal percentages of TSVs in strategic positions of the layout

Effect of mean void fraction correlations on a shell-and-tube evaporator dynamic model performance

In this paper, the influence of different mean void fraction correlations on a shell-and-tube evaporator dynamic model performance has been evaluated. The model proposed is based on the moving boundary approach and includes the expansion valve modelling. Several transient tests, using R134a as working fluid, have been carried out varying refrigerant mass flow, inlet enthalpy and secondary fluid flow. Then, the model performance, using different mean void fractions, is analysed from the system model outputs (evaporating pressure, refrigerant outlet temperature and condensing water outlet temperature). The slip ratio expressions selected are: homogenous, momentum flux model, Zivi's, Chisholm's and Smith's correlations. The results of the comparison between experimental and model predictions depend on the transient characteristics and there is not a single slip ratio correlation that provides the best performance in all the cases analysed.Navarro-Esbrí, J.; Milián Sánchez, V.; Mota Babiloni, A.; Molés Ribera, F.; Verdú Martín, GJ. (2015). Effect of mean void fraction correlations on a shell-and-tube evaporator dynamic model performance. Science and Technology for the Built Environment. 21(7):1057-1072. doi:10.1080/23744731.2015.1034594S1057107221

The effects of sample position and gas flow pattern on the sintering of a 7xxx aluminum alloy

The effects of sample position and gas flow pattern on the sintering of a 7xxx aluminum alloy Al-7Zn-2.5Mg-1Cu in flowing nitrogen have been investigated both experimentally and numerically. The near-surface pore distribution and sintered density of the samples show a strong dependency on the sample separation distance over the range from 2 mm to 40 mm. The open porosity in each sample increases with increasing separation distance while the closed porosity remains essentially unchanged. A two-dimensional computational fluid dynamics (CFD) model has been developed to analyze the gas flow behavior near the sample surfaces during isothermal sintering. The streamlines, velocity profile, and volume flow rate in the cavity between each two samples are presented as a function of the sample separation distance at a fixed nitrogen flow rate of 6 L/min. The CFD modeling results provide essential details for understanding the near-surface pore distribution and density of the sintered samples. It is proposed that the different gas flow patterns near the sample surfaces result in variations of the oxygen content from the incoming nitrogen flow in the local sintering atmosphere, which affects the self-gettering process of the aluminum compacts during sintering. This leads to the development of different near-surface pore distributions and sintered densities

Distortion in a 7xxx aluminum alloy during liquid phase sintering

The distortion in a sintered 7xxx aluminum alloy, Al-7Zn-2.5Mg-1Cu (wt. pct), has been investigated by sintering three rectangular bars in each batch at 893 K (620 °C) for 0 to 40 minutes in nitrogen, followed by air or furnace cooling. They were placed parallel to each other, equally spaced apart at 2 mm, with their long axes being perpendicular to the incoming nitrogen flow. Pore evolution in each sample during isothermal sintering was examined metallographically. The compositional changes across sample mid-cross section and surface layers were analyzed using energy dispersive X-ray spectroscopy and X-ray photoelectron spectroscopy depth profiling, respectively. The two outer samples bent toward the middle one, while the middle sample was essentially distortion free after sintering. The distortion in the outer samples was a result of differential shrinkage between their outer and inner surfaces during isothermal sintering. The porous outer surface showed an enrichment of oxygen around the large pores as well as lower magnesium and zinc contents than the interior and inner surface of the same sample, while the inner surface was distinguished by the presence of AlN. The differential shrinkage was caused by different oxygen contents in local sintering atmosphere and unbalanced loss of magnesium and zinc between the outer and inner surfaces