Integration of Ion Implantation with Scanning ProbeAlignment

We describe a scanning probe instrument which integrates ion beams with imaging and alignment functions of a piezo resistive scanning probe in high vacuum. Energetic ions (1 to a few hundred keV) are transported through holes in scanning probe tips [1]. Holes and imaging tips are formed by Focused Ion Beam (FIB) drilling and ion beam assisted thin film deposition. Transport of single ions can be monitored through detection of secondary electrons from highly charged dopant ions (e. g., Bi{sup 45+}) enabling single atom device formation. Fig. 1 shows SEM images of a scanning probe tip formed by ion beam assisted Pt deposition in a dual beam FIB. Ion beam collimating apertures are drilled through the silicon cantilever with a thickness of 5 {micro}m. Aspect ratio limitations preclude the direct drilling of holes with diameters well below 1 {micro}m, and smaller hole diameters are achieved through local thin film deposition [2]. The hole in Fig. 1 was reduced from 2 {micro}m to a residual opening of about 300 nm. Fig. 2 shows an in situ scanning probe image of an alignment dot pattern taken with the tip from Fig. 1. Transport of energetic ions through the aperture in the scanning probe tip allows formation of arbitrary implant patterns. In the example shown in Fig. 2 (right), a 30 nm thick PMMA resist layer on silicon was exposed to 7 keV Ar{sup 2+} ions with an equivalent dose of 10{sup 14} ions/cm{sup 2} to form the LBL logo. An exciting goal of this approach is the placement of single dopant ions into precise locations for integration of single atom devices, such as donor spin based quantum computers [3, 4]. In Fig. 3, we show a section of a micron size dot area exposed to a low dose (10{sup 11}/cm{sup 2}) of high charge state dopant ions. The Bi{sup 45+} ions (200 keV) were extracted from a low emittance highly charged ions source [5]. The potential energy of B{sup 45+}, i. e., the sum of the binding energies required to remove the electrons, amounts to 36 keV. This energy is deposited within {approx}10 fs when an ion impinges on a target. The highly localized energy deposition results in efficient resist exposure, and is associated with strongly enhanced secondary electron emission, which allows monitoring of single ion impacts [4]. The ex situ scanning probe image with line scan in Fig. 3 shows a single ion impact site in PMMA (after standard development). In our presentation, we will discuss resolution requirements for ion placement in prototype quantum computer structures [3] with respect to resolution limiting factors in ion implantation with scanning probe alignment

Mapping of ion beam induced current changes in FinFETs

We report on progress in ion placement into silicon devices with scanning probe alignment. The device is imaged with a scanning force microscope (SFM) and an aligned argon beam (20 keV, 36 keV) is scanned over the transistor surface. Holes in the lever of the SFM tip collimate the argon beam to sizes of 1.6 um and 100 nm in diameter. Ion impacts upset the channel current due to formation of positive charges in the oxide areas. The induced changes in the source-drain current are recorded in dependence of the ion beam position in respect to the FinFET. Maps of local areas responding to the ion beam are obtained.Comment: IBMM 2008 conference proceedin

Tip Motion-Sensor Signal Relation for a Composite SPM/SPL Cantilever

An array of microbeams is a promising approach to increase the throughput of scanning probe microscopes and lithography. This concept requires integrated sensors and actuators which enable individual measurement and control. Thus, existing models for single beams need to be reassessed in view of its applicability for arrays, which involve additional physical interactions and a varying geometry along the beam's length. This paper considers a single composite microbeam, which is excited by a thermal actuator and its displacement is measured by a piezoresistive sensor. We derive a model that incorporates the beam's composite structure, varying geometry along its length, its thermal coupling for actuation, and thermoelastic damping. Subsequently, the influence of the beam's geometry on its eigenmodes and frequencies is analyzed in far and close proximity operation to a surface. We observe parametric excitation phenomena of multiple integers of the fundamental excitation frequency, which originates from the geometrical composition of the beam. Furthermore, we observe that the so far constant assumed factor to convert the sensor signal to the beam's displacement depends on the dissipated power within the actuator, as well as on the dynamic behavior of the system, and thus is not constant

Herstellung von trockengeaetzten Silizium-Spitzen mit integriertem Detektorsystem fuer die SXM-Technik

A cantilever with integrated deflection sensor for modular near field-microscopes has been developed and its application has been demonstrated. Silicon tip and integrated piezoresistive detection system have been constructed using combined methods of conventional semiconductor and microstructure technology. The Si-tips prepared by dry-etching posses radia of curvature between 10 and 20 nm. By the piezoresistive cantilever with Si-tip, material surface properties can be studied even in the sub-nanometer region. (WEN)Available from TIB Hannover: F96B391+a / FIZ - Fachinformationszzentrum Karlsruhe / TIB - Technische InformationsbibliothekSIGLEBundesministerium fuer Bildung, Wissenschaft, Forschung und Technologie, Bonn (Germany)DEGerman

Adsorption properties of porous silicon

Porous silicon shows some interesting features for micromechanical applications. Some applications make use of its high surface-to-volume ratio. A capacitive gas or humidity sensor using the adsorption of gases on the porous surface can be easily fabricated. However an opportunity for more sensitive device is given by micromechanical structure. In this paper we report on the piezoresistive cantilever beam structure with porous silicon adsorbing spot as a gas sensor

Ion Implantation with Scanning Probe Alignment

We describe a scanning probe instrument which integrates ion beams with the imaging and alignment function of a piezo-resistive scanning probe in high vacuum. The beam passes through several apertures and is finally collimated by a hole in the cantilever of the scanning probe. The ion beam spot size is limited by the size of the last aperture. Highly charged ions are used to show hits of single ions in resist, and we discuss the issues for implantation of single ions

Piezoresistive sensors for atomic force microscopy - numerical simulations by means of virtual wafer fab

An important element in microelectronics is the comparison of the modelling and measurements results of the real semiconductor devices. Our paper describes the final results of numerical simulation of a micromechanical process sequence of the atomic force microscopy (AFM) sensors. They were obtained using the virtual wafer fab (VWF) software, which is used in the Institute of Electron Technology (IET). The technology mentioned above is used for fabrication of the AFM cantilevers, which has been designed for measurement and characterization of the surface roughness, the texturing, the grain size and the hardness. The simulation are very useful in manufacturing other microcantilever sensors