Paper Session II-C - High-Resolution Integrated Micro Gyroscope for Space Applications

In this paper, an integrated capacitive gyroscope fabricated by CMOS-MEMS technology is presented. The CMOS-compatibility of the fabrication process enables full integration of the sensor with interface and signal conditioning circuitry on a single chip. The entire microstructure is single-crystal silicon based, resulting in large proof mass and good mechanical behaviors. Thus, high-resolution and high-robustness microgyroscopes can be obtained. With a resolution of about 0.01°/s/Hz112 , the fabricated gyroscope chip is only as small as 1.5mm by 2mm including the sensing elements and integrated electronics. The robustness, light weight and high performance make this type of MEMS gyroscope very suitable for space navigation applications where payload is critical. The on-chip capacitive sensing circuitry employs chopper stabilization technique to minimize the influence of 1/f noise. The on-chip circuits also include a two-stage fully differential amplifier and a DC feedback loop to cancel the DC offset. The CMOS fabrication was performed through MOSIS by using the 4-metal TSMC 0.35 μm CMOS process. The post-CMOS micromachining processing consists of only dry etch steps and uses the interconnect metal layers as etching masks. Single-crystal silicon (SCS) structures are produced by applying a backside etch and forming a 60μm-thick SCS membrane. This work is sponsored by NASA through the UCF/UF Space Research Initiative

MEMS-Based Endoscopic Optical Coherence Tomography

Early cancer detection has been playing an important role in reducing cancer mortality. Optical coherence tomography (OCT), due to its micron-scale resolution, has the ability to detect cancerous tissues at their early stages. For internal organs, endoscopic probes are needed as the penetration depth of OCT is about 1–3 mm. MEMS technology has the advantages of fast speed, small size, and low cost, and it has been widely used as the scanning engine in endoscopic OCT probes. Research results have shown great potential for OCT in endoscopic imaging by incorporating MEMS scanning mirrors. Various MEMS-OCT designs are introduced, and their imaging results are reviewed in the paper

Editorial for the Special Issue on MEMS Mirrors

MEMS mirrors can steer, modulate, and switch light, as well as control the wavefront for focusing or phase modulation.[...

Editorial for the Special Issue on Optical MEMS

International audienc

Microfabrication and Characterization of an Integrated 3-Axis CMOS-MEMS Accelerometer

This paper reports the fabrication and characterization of a monolithically integrated 3-axis CMOS-MEMS accelerometer with a single proof mass. An improved microfabrication process has been developed to solve the structure overheating and particle contamination problems in the plasma etching processes of device fabrication. The whole device is made of bulk silicon except for some short thin films for electrical isolation, allowing large sensing capacitance and flat device structure. A low-noise, low-power amplifier is designed for each axis, which provides 40 dB on-chip amplification and consumes only 1 mW power. Quasi-static and dynamic characterization of the fabricated device has been performed. The measured sensitivities of the lateral- and z-axis accelerometers are 560 mV/g and 320 mV/g, respectively, which can be tuned by simply varying the amplitude of the modulation signal. The over-all noise floors of the lateral- and z-axis are 12 μg/ÖHz and 110 μg/ÖHz, respectively when tested at 200 Hz

A Fast, Large-Stroke Electrothermal MEMS Mirror Based on Cu/W Bimorph

This paper reports a large-range electrothermal bimorph microelectromechanical systems (MEMS) mirror with fast thermal response. The actuator of the MEMS mirror is made of three segments of Cu/W bimorphs for lateral shift cancelation and two segments of multimorph beams for obtaining large vertical displacement from the angular motion of the bimorphs. The W layer is also used as the embedded heater. The silicon underneath the entire actuator is completely removed using a unique backside deep-reactive-ion-etching DRIE release process, leading to improved thermal response speed and front-side mirror surface protection. This MEMS mirror can perform both piston and tip-tilt motion. The mirror generates large pure vertical displacement up to 320 μm at only 3 V with a power consumption of 56 mW for each actuator. The maximum optical scan angle achieved is ±18° at 3 V. The measured thermal response time is 15.4 ms and the mechanical resonances of piston and tip-tilt modes are 550 Hz and 832 Hz, respectively

An Electrothermal Cu/W Bimorph Tip-Tilt-Piston MEMS Mirror with High Reliability

This paper presents the design, fabrication, and characterization of an electrothermal MEMS mirror with large tip, tilt and piston scan. This MEMS mirror is based on electrothermal bimorph actuation with Cu and W thin-film layers forming the bimorphs. The MEMS mirror is fabricated via a combination of surface and bulk micromachining. The piston displacement and tip-tilt optical angle of the mirror plate of the fabricated MEMS mirror are around 114 μm and ±8°, respectively at only 2.35 V. The measured response time is 7.3 ms. The piston and tip-tilt resonant frequencies are measured to be 1.5 kHz and 2.7 kHz, respectively. The MEMS mirror survived 220 billion scanning cycles with little change of its scanning characteristics, indicating that the MEMS mirror is stable and reliable