Analysis of a spherical shell with a non-axisymmetric boundary

Spherical shell problem formulated in terms of stress functions, and applied to nonaxisymmetric boundar

Supersymmetric reduced models with a symmetry based on Filippov algebra

Generalizations of the reduced model of super Yang-Mills theory obtained by replacing the Lie algebra structure to Filippov $n$-algebra structures are studied. Conditions for the reduced model actions to be supersymmetric are examined. These models are related with what we call \{cal N}_{min}=2 super $p$-brane actions.Comment: v3: In the previous versions we overlooked that Eq.(3.9) holds more generally, and missed some supersymmetric actions. Those are now included and modifications including a slight change in the title were made accordingly. 1+18 page

Analisa Pengaruh Service Quality Terhadap Customer Loyalty Dengan Customer Satisfaction Sebagai Variabel Intervening Celebrity Fitness Center Surabaya

The development of fitness centers in the city of Surabaya is growing rapidly, strategic locations such as in the center of the famous city in the city of Surabaya, of course this is directly proportional to the changing lifestyle of people in the city of Surabaya is more advanced and the view of an increasingly healthy lifestyle. With so many fitness centers in Surabaya, this is also affecting the fitness industry competition in terms of quality of service that becomes one factor that impacts on customer satisfaction, which in the end faced with the advantage of improving both the quality and the quantity of output produced. This research aims to analyze the influence of Service Quality (Tangible, Emphaty, Responsiveness, Realibility, Assurance) to Customer Loyalty (Say positive thing, Recommend to friend, Continue purchasing) by considering the factor of Customer Satisfaction (Satisfaction as Fulfillment, Satisfaction as Pleasure, Satisfaction as Ambivalance) This research was conducted by distributing questionnaires to 100 respondents of Celebrity Fitness Centre customers. Analyze technique used is quantitative analysis technique with path analysis method

A new observational and numerical study of tidal interactions in M81-M82-NGC3077 system

A nearby system of interacting galaxies M81-M82-NGC3077 triplet (D = 3.3 Mpc; Freeman & Madore 1988) has been studied using multi-wavelength observations and numerical simulations to obtain a comprehensive understanding on the dynamics and the consequences of tidal interactions in a group environment. The VLA 12-field Mosaic H I observations of 2 x 1.5 deg. region have revealed a vast array of H I filaments which suggests that the severity and extent of tidal disruptions far exceed the previous estimates. A tidal remnant of the former H I disk of M82 extending up to 30 kpc (in projection) is identified for the first time, and the pervasive effects of the tidal disruption are traced into the inner disk by optical and CO observations, including a kinematic trace of a large scale bar potential (Yun, Ho, & Lo 1992). The H I disk of M81 is traced out to 40 kpc in radius, and a large scale (l approx. 20 kpc) velocity anomaly ('High Velocity Trough'), which may be a remnant of a gaseous collision, is found within the disk of M81. The large H I bridge between M81 and NGC 3077 (van der Hulst 1979) is also found to extend approx. greater than 50 kpc further, bending around NGC 3077, toward M82. The total H I detected in this experiment, 5.6 x 10(exp 9) solar mass, represents the majority of the single-dish flux (Appleton, Davies, & Stephenson 1981) and suggests that the bulk of H I found in the region belongs to the three galaxies and the tidal filaments. The impact and details of the tidal interactions have been further examined through the use of numerical techniques. The 'restricted 3-body' approach was used to simulate the observed distribution of tidal H I streamers connecting the three galaxies, and the success of the simulation is further strengthened by the accurate predictions on the gas kinematics

Analysis of plate structures by a dual finite element method

Stretching and bending of linearly elastic orthotropic plate analysis by dual finite element method with computer progra

Aspects of U-duality in BLG models with Lorentzian metric 3-algebras

In our previous paper, it was shown that BLG model based on a Lorentzian metric 3-algebra gives Dp-brane action whose worldvolume is compactified on torus T^d (d=p-2). Here the 3-algebra was a generalized one with d+1 pairs of Lorentzian metric generators and expressed in terms of a loop algebra with central extensions. In this paper, we derive the precise relation between the coupling constant of the super Yang-Mills, the moduli of T^d and some R-R flux with VEV's of ghost fields associated with Lorentzian metric generators. In particular, for d=1, we derive the Yang-Mills action with theta term and show that SL(2,Z) Montonen-Olive duality is realized as the rotation of two VEV's. Furthermore, some moduli parameters such as NS-NS 2-form flux are identified as the deformation parameters of the 3-algebras. By combining them, we recover most of the moduli parameters which are required by U-duality symmetry.Comment: 27 pages, v2: minor correction

Stress-Induced Delamination Of Through Silicon Via Structures

Continuous scaling of on-chip wiring structures has brought significant challenges for materials and processes beyond the 32 nm technology node in microelectronics. Recently three-dimensional (3-D) integration with through-silicon-vias (TSVs) has emerged as an effective solution to meet the future interconnect requirement. Thermo-mechanical reliability is a key concern for the development of TSV structures used in die stacking as 3-D interconnects. This paper examines the effect of thermal stresses on interfacial reliability of TSV structures. First, the three-dimensional distribution of the thermal stress near the TSV and the wafer surface is analyzed. Using a linear superposition method, a semi-analytic solution is developed for a simplified structure consisting of a single TSV embedded in a silicon (Si) wafer. The solution is verified for relatively thick wafers by comparing to numerical results obtained by finite element analysis (FEA). Results from the stress analysis suggest interfacial delamination as a potential failure mechanism for the TSV structure. Analytical solutions for various TSV designs are then obtained for the steady-state energy release rate as an upper bound for the interfacial fracture driving force, while the effect of crack length is evaluated numerically by FEA. Based on these results, the effects of TSV designs and via material properties on the interfacial reliability are elucidated. Finally, potential failure mechanisms for TSV pop-up due to interfacial fracture are discussed.Aerospace Engineerin