Method for making monolithic prestressed ceramic devices

Monolithic, internally asymmetrically stress biased electrically active ceramic devices and a method for making same is disclosed. The first step in the method of the present invention is to fabricate a ceramic element having first and second opposing surfaces. Next, only the first surface is chemically reduced by heat treatment in a reducing atmosphere. This produces a concave shaped, internally asymmetrically stress biased ceramic element and an electrically conducting, chemically reduced layer on the first surface which serves as one of the electrodes of the device. Another electrode can be deposited on the second surface to complete the device. In another embodiment of the present invention two dome shaped ceramic devices can be placed together to form a completed clamshell structure or an accordion type structure. In a further embodiment, the clamshell or accordion type structures can be placed on top of one another. In another embodiment, a pair of dome shaped ceramic devices having opposing temperature characteristics can be placed on top of each other to produce an athermalized ceramic device

Monolithic prestressed ceramic devices and method for making same

Monolithic, internally asymmetrically stress biased electrically active ceramic devices and a method for making same is disclosed. The first step in the method of the present invention is to fabricate a ceramic element having first and second opposing surfaces. Next, only the first surface is chemically reduced by heat treatment in a reducing atmosphere. This produces a concave shaped, internally asymmetrically stress biased ceramic element and an electrically conducting, chemically reduced layer on the first surface which serves as one of the electrodes of the device. Another electrode can be deposited on the second surface to complete the device. In another embodiment of the present invention two dome shaped ceramic devices can be placed together to form a completed clamshell structure or an accordion type structure. In a further embodiment, the clamshell or accordion type structures can be placed on top of one another. In another embodiment, a pair of dome shaped ceramic devices having opposing temperature characteristics can be placed on top of each other to produce an athermalized ceramic device

Development of high T(sub c) (greater than 110 K) Bi, Tl, and Y-based materials as superconducting circuit elements

Experimental work has continued on the development and characterization of bulk and hot pressed powders and tapecast materials in the Bi-Sr-Ca-Cu-O and Tl-Ba-Ca-Cu-O systems. A process for producing warp-free, sintered, superconducting tapes of Bi composition Bi2Sr2Ca2Cu3O(x) with a mixed oxide process was established. This procedure required a triple calcination at 830 C for 24 hours and sintering at 845 C from 20 to 200 hours. Hot pressing the triple calcined powder at 845 C for 6 hours at 5000 psi yielded a dense material which on further heat treatment at 845 C for 24 hours exhibited a Tc of 108.2 K. A further improvement in the processing of the bismuth materials was achieved via a chemical coprecipitation process wherein the starting nitrate materials were coprecipitated with oxalic acid, thus yielding a more chemically homogeneous, more reactive powder. With the coprecipitated powders, only one calcine at 830 C for 12 hours and a final sinter at 845 C for 30 hours was sufficient to produce a bulk superconducting material with a Tc of 108.4 K. SAFIRE-type grounding links were successfully fabricated from sintered, tapecast, coprecipitated BSCCO 2223 powders. Compositional and processing investigations were continued on the Tl-based superconductors. Manganese and lithium additions and sintering temperature and time were examined to determine their influence on superconducting properties. It was found that lithium substitutions for copper enhance the transition temperatures while manganese additions produced deleterious effects on the superconducting properties. A suitable procedure for producing reproducible bulk and tapecast material of Tl composition Tl2Ba2Ca2Cu3O(x) was developed and used in fabricating uniform superconducting tapes. The highest transition temperature for Tl-based tapes was measured at 110.2 K. Thallium superconducting SAFIRE-type grounding links were fabricated from the tapes

Development of high Tc (greater than 110K) Bi, Tl and Y-based materials as superconducting circuit elements

This report is presented in two parts. Part 1 deals primarily with Bi-based materials and a small amount of work on a Y-based composition while Part 2 covers work on Tl-based materials. In Part 1, a reliable and reproducible process for producing bulk bismuth-based superconductors has been developed. It is noted however, that a percentage of the tapecast material experiences curling and fracturing after a 30 hour sintering period and is thus in need of further examination. The Bi-Sr-Ca-Cu-O (BSCCO) material has been characterized by critical temperature data, X-ray diffraction data, and surface morphology. In the case of T sub c, it is not critical to anneal the material. It appears that the BSCCO material has the possibility of producing a better grounding strap than that of the 123 material. Attempts to reproduce near room temperature superconductors in the Y-Ba-Cu-O system were unsuccessful. In Part 2, several methods of processing the high temperature superconductor Tl2Ba2Ca2Cu3O10 were investigated; i.e., different precursor compositions were sintered at various sintering times and temperatures. The highest superconductig temperature was found to be 117.8K when fired at 900 C for three hours. Higher sintering temperatures produced a melted sample which was nonsuperconducting at liquid nitrogen temperature. Also, a preliminary study found Li2O substitutions for copper appeared to increase the transition temperature and create fluxing action upon sintering. It was suggested that lower sintering temperatures might be obtained with lithium additions to produce reliable Tl2Ba2Ca2Cu3O10 processing methods

Development and evaluation of superconducting circuit elements

An approach to the application of high Tc ceramic superconductors to practical circuit elements was developed and demonstrated. This method, known as the rigid-conductor process (RCP), involves the combination of a pre-formed, sintered, and tested superconductor material with an appropriate, rigid substrate via an epoxy adhesive which also serves to encapsulate the element from the ambient environment. Emphasis was on the practical means to achieve functional, reliable, and reproducible components. Although all of the work described in this report involved a YBa2Cu3Osub(7-x) high Tc superconductor material, the techniques developed and conclusions reached are equally applicable to other high Tc materials